BUTT Other Function uPs,uCs & Peripheral ICs 47

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	DAC Channels	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
CC3220MODASF12MONR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V			NO	CHIP CARRIER		2.3 V	85 Cel			-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.41 mm	1024000	256	20.5 mm	0			TIMER(4), WDT	0		30	260	25 mm		262144	CMOS	4-Ch 12-Bit	3.3 V		NO		I2C, I2S, SPI, UART	FLASH	I2C; I2S; SPI; UART	1.27 mm		R-XBCC-B63	3				e4	8	25
CC3200MODR1M2AMOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V			NO	CHIP CARRIER		2.3 V	70 Cel			-20 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm			17.5 mm	0				0		30	260	20.5 mm			CMOS	4-Ch 12-Bit	3.3 V		NO				I2C; SPI; UART	1.27 mm		R-XBCC-B63	3				e4		25
CC3220MODSF12MOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	NO	YES	3.6 V	8	0	NO	CHIP CARRIER		2.3 V	85 Cel	CORTEX-M4	0	-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	1024000	256	17.5 mm	0		YES	TIMER(4), WDT	0		30	260	20.5 mm	4	262144	CMOS	4-Ch 12-Bit	3.3 V	2	NO	2	I2C, I2S, SD, SPI, UART	FLASH		1.27 mm	FIXED POINT	R-XBCC-B63	3		2400 rpm	YES	e4	8	25
CC3220MODASM2MONR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V			NO	CHIP CARRIER		2.3 V	85 Cel			-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.41 mm	1024000	256	20.5 mm	0			TIMER(4), WDT	0		30	260	25 mm		262144	CMOS	4-Ch 12-Bit	3.3 V		NO		I2C, I2S, SPI, UART	FLASH	I2C; I2S; SPI; UART	1.27 mm		R-XBCC-B63	3				e4	8	25
CC3220MODSM2MOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	NO	YES	3.6 V	8	0	NO	CHIP CARRIER		2.3 V	85 Cel	CORTEX-M4	0	-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	1024000	256	17.5 mm	0		YES	TIMER(4), WDT	0		30	260	20.5 mm	4	262144	CMOS	4-Ch 12-Bit	3.3 V	2	NO	2	I2C, I2S, SD, SPI, UART	FLASH		1.27 mm	FIXED POINT	R-XBCC-B63	3		2400 rpm	YES	e4	8	25
CC3200MODR1M2AMOBT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V			NO	CHIP CARRIER		2.3 V	70 Cel			-20 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm			17.5 mm	0				0		30	260	20.5 mm			CMOS	4-Ch 12-Bit	3.3 V		NO				I2C; SPI; UART	1.27 mm		R-XBCC-B63	3				e4		25
MC13213R2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY		YES	3.4 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel			-40 Cel	NICKEL GOLD		BOTTOM		1 mm			9 mm							30	250	9 mm			CMOS		2.7 V							.5 mm		S-PBGA-B71	3	Not Qualified			e4
FXLC95000CLR1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	24	TFLGA	RECTANGULAR	PLASTIC/EPOXY		YES	1.89 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.71 V	85 Cel			-40 Cel			BOTTOM		1.1 mm			3 mm							40	260	5 mm			CMOS		1.8 V							.5 mm		R-PBGA-B24	3
MC13212	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY		YES	3.4 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel			-40 Cel	NICKEL GOLD		BOTTOM		1 mm			9 mm							30	250	9 mm			CMOS		2.7 V							.5 mm		S-PBGA-B71	3	Not Qualified			e4
MKW01Z128CHN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	60	VBCC	SQUARE	PLASTIC/EPOXY		YES	3.6 V				CHIP CARRIER, VERY THIN PROFILE		1.8 V	85 Cel			-40 Cel	NICKEL GOLD		BOTTOM		.98 mm			8 mm							40	260	8 mm			CMOS		3.3 V							.5 mm		S-PBCC-B60	3				e4
SA3229-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			0 Cel			BOTTOM		1.781 mm			3.18 mm							NOT SPECIFIED	NOT SPECIFIED	5.59 mm			CMOS		1.25 V									R-PBCC-B25
SI1002-E-GM2	Silicon Labs	MICROCONTROLLER	INDUSTRIAL	BUTT	42	HLGA	RECTANGULAR	UNSPECIFIED		YES	3.6 V				GRID ARRAY, HEAT SINK/SLUG		1.8 V	85 Cel			-40 Cel			BOTTOM		.95 mm			5 mm		ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY.					NOT SPECIFIED	NOT SPECIFIED	7 mm			CMOS		1.9 V							.5 mm		R-XBGA-B42
AX-SIP-SFEU-1-01-TX30	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	44	HVBCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-30 Cel	NICKEL GOLD PALLADIUM		BOTTOM		.996 mm			7 mm							30	260	9 mm			CMOS		3 V									R-XBCC-B44	3
MC13211	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY		YES	3.4 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel			-40 Cel	NICKEL GOLD		BOTTOM		1 mm			9 mm							30	250	9 mm			CMOS		2.7 V							.5 mm		S-PBGA-B71	3	Not Qualified			e4
AX-SIP-SFEU-API-1-01-TX30	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	44	HVBCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-30 Cel	NICKEL GOLD PALLADIUM		BOTTOM		.996 mm			7 mm							30	260	9 mm			CMOS		3 V									R-XBCC-B44	3
R3920-CFAB-E1T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY	NO	YES					CHIP CARRIER	LGA25,3X8,27		40 Cel			0 Cel			BOTTOM		1.781 mm			3.18 mm			NO			4.218 MHz	NOT SPECIFIED	NOT SPECIFIED	5.59 mm			CMOS		1.25 V							.686 mm	FIXED POINT	R-PBCC-B25
SI1000-E-GM2	Silicon Labs	MICROCONTROLLER	INDUSTRIAL	BUTT	42	HLGA	RECTANGULAR	UNSPECIFIED		YES	3.6 V				GRID ARRAY, HEAT SINK/SLUG		1.8 V	85 Cel			-40 Cel			BOTTOM		.95 mm			5 mm		ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY.					40	260	7 mm			CMOS		1.9 V							.5 mm		R-XBGA-B42	2
GB3221-ZZ-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	15	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			-10 Cel			BOTTOM		1.65 mm			3.18 mm									5.76 mm			CMOS		1.3 V									R-PBCC-B15
GA3219D-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	20	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			0 Cel			BOTTOM		1.83 mm			3.15 mm							NOT SPECIFIED	NOT SPECIFIED	5.46 mm			CMOS		1.25 V									R-PBCC-B20
GA3285A-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	16	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			0 Cel			BOTTOM		1.83 mm			3.15 mm							NOT SPECIFIED	NOT SPECIFIED	5.46 mm			CMOS		1.25 V									R-PBCC-B16
GA3224-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	13	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			-10 Cel			BOTTOM		1.65 mm			3.18 mm									5.76 mm			CMOS		1.3 V									R-PBCC-B13
LC898113RA-WH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	49	VFLGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel			-30 Cel			BOTTOM		.8 mm			4 mm		ALSO REQIRIES 1.8 V SUPPLY; SEATED HGT-NOM							4 mm			CMOS		3.3 V							.5 mm		S-PBGA-B49
GB3221-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	15	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			-10 Cel			BOTTOM		1.65 mm			3.18 mm									5.76 mm			CMOS		1.3 V									R-PBCC-B15
SA3229-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			0 Cel			BOTTOM		1.781 mm			3.18 mm							NOT SPECIFIED	NOT SPECIFIED	5.59 mm			CMOS		1.25 V									R-PBCC-B25
GA3285A-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	16	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			0 Cel			BOTTOM		1.83 mm			3.15 mm							NOT SPECIFIED	NOT SPECIFIED	5.46 mm			CMOS		1.25 V									R-PBCC-B16
GA3224-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	13	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			-10 Cel			BOTTOM		1.65 mm			3.18 mm									5.76 mm			CMOS		1.3 V									R-PBCC-B13
GA3224-ZZ-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	13	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			-10 Cel			BOTTOM		1.65 mm			3.18 mm									5.76 mm			CMOS		1.3 V									R-PBCC-B13
GA3224-ZZ-B	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	13	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			-10 Cel			BOTTOM		1.65 mm			3.18 mm									5.76 mm			CMOS		1.3 V									R-PBCC-B13
SA3286-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	16	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			0 Cel			BOTTOM		1.83 mm			3.15 mm									5.46 mm			CMOS		1.25 V									R-PBCC-B16
GB3225-ZZ-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	14	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			-10 Cel			BOTTOM		1.65 mm			3.18 mm									5.76 mm			CMOS		1.3 V									R-PBCC-B14
SA3286-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	16	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			0 Cel			BOTTOM		1.83 mm			3.15 mm									5.46 mm			CMOS		1.25 V									R-PBCC-B16
SB3230-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			0 Cel			BOTTOM		1.781 mm			3.18 mm									5.59 mm			CMOS		1.25 V									R-PBCC-B25
AX-SIP-SFEU-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	44	HVBCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-30 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		BOTTOM		.996 mm			7 mm								260	9 mm			CMOS		3 V									R-XBCC-B44	3				e4
AX-SIP-SFEU-API-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	44	HVBCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-30 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		BOTTOM		.996 mm			7 mm								260	9 mm			CMOS		3 V									R-XBCC-B44	3				e4
GB3221-ZZ-B	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	15	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			-10 Cel			BOTTOM		1.65 mm			3.18 mm									5.76 mm			CMOS		1.3 V									R-PBCC-B15
GA3284-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	16	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			0 Cel			BOTTOM		1.83 mm			3.15 mm							NOT SPECIFIED	NOT SPECIFIED	5.46 mm			CMOS		1.25 V									R-PBCC-B16
LC898113-TBM-H	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	49	VFLGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel			-30 Cel			BOTTOM		.8 mm			4 mm		ALSO REQIRIES 1.8 V SUPPLY; SEATED HGT-NOM					30	260	4 mm			CMOS		3.3 V							.5 mm		S-PBGA-B49	4
GA3284-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	16	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			0 Cel			BOTTOM		1.83 mm			3.15 mm							NOT SPECIFIED	NOT SPECIFIED	5.46 mm			CMOS		1.25 V									R-PBCC-B16
GB3225-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	14	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			-10 Cel			BOTTOM		1.65 mm			3.18 mm									5.76 mm			CMOS		1.3 V									R-PBCC-B14
GA3216-E1-B	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	20	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			-10 Cel			BOTTOM		1.6 mm			3.12 mm									4.82 mm			CMOS		1.3 V									R-PBCC-B20
GA3219D-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	20	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			0 Cel			BOTTOM		1.83 mm			3.15 mm							NOT SPECIFIED	NOT SPECIFIED	5.46 mm			CMOS		1.25 V									R-PBCC-B20
GA3227-E1-B	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	20	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			0 Cel			BOTTOM		1.27 mm			3.81 mm									6.35 mm			CMOS		1.25 V									R-PBCC-B20
GB3225-ZZ-B	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	14	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel			-10 Cel			BOTTOM		1.65 mm			3.18 mm									5.76 mm			CMOS		1.3 V									R-PBCC-B14
SDIO101IHE	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	60	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1.95 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.65 V	85 Cel			-40 Cel			BOTTOM		.6 mm			5 mm									5 mm			CMOS		1.8 V							.5 mm		S-PBCC-B60		Not Qualified
MC13211R2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY		YES	3.4 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel			-40 Cel	NICKEL GOLD		BOTTOM		1 mm			9 mm							30	250	9 mm			CMOS		2.7 V							.5 mm		S-PBGA-B71	3	Not Qualified			e4
MC13212R2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY		YES	3.4 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel			-40 Cel	NICKEL GOLD		BOTTOM		1 mm			9 mm							30	250	9 mm			CMOS		2.7 V							.5 mm		S-PBGA-B71	3	Not Qualified			e4
MC13213	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY		YES	3.4 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel			-40 Cel	NICKEL GOLD		BOTTOM		1 mm			9 mm							30	250	9 mm			CMOS		2.7 V							.5 mm		S-PBGA-B71	3	Not Qualified			e4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.