Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.4 mm |
S-XQCC-N56 |
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|
Infineon Technologies |
PSoC |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
5 mm |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N32 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
1.6 mm |
7 mm |
7 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G48 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
BALL |
124 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA124,13X13,25 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 mm |
9 mm |
9 mm |
CMOS |
1.8 V |
.65 mm |
S-PBGA-B124 |
3 |
e1 |
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|
Infineon Technologies |
PROGRAMMABLE SoC |
TIN SILVER COPPER |
3 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
1.6 mm |
7 mm |
260 |
7 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G48 |
3 |
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|
Infineon Technologies |
PROGRAMMABLE SoC |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
1.8 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 mm |
5.3 mm |
10.2 mm |
CMOS |
3 V |
.65 mm |
R-PDSO-G28 |
3 |
e4 |
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|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
85 Cel |
-20 Cel |
NICKEL GOLD PALLADIUM SILVER |
QUAD |
.9 mm |
5 mm |
ALSO OPERATES WITH 3.3V NOM SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
3 |
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|
Infineon Technologies |
PSoC |
INDUSTRIAL |
NICKEL PALLADIUM GOLD |
30 |
260 |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
BALL |
124 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA124,13X13,25 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 mm |
9 mm |
9 mm |
CMOS |
1.8 V |
.65 mm |
S-PBGA-B124 |
3 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
SoC |
GULL WING |
64 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP64,.47SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
10 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G64 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
SoC |
GULL WING |
208 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.3 V |
AEC-Q100; TS 16949 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP208,1.2SQ,20 |
1.1 V |
105 Cel |
-40 Cel |
QUAD |
1.7 mm |
28 mm |
28 mm |
CMOS |
1.2 V |
.5 mm |
S-PQFP-G208 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
INDUSTRIAL |
NICKEL PALLADIUM GOLD |
30 |
260 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
INDUSTRIAL |
PURE TIN |
30 |
260 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
1.8/5 |
NICKEL PALLADIUM GOLD |
N |
20 |
260 |
524288 Bits |
Other uPs/uCs/Peripheral ICs |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
TIN SILVER COPPER |
3 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
2/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
N |
QUAD |
1 mm |
7 mm |
20 |
260 |
7 mm |
65536 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
SoC |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
12 mm |
12 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G80 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SYSTEM ON CHIP |
TIN |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SYSTEM ON CHIP |
TIN |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
NICKEL PALLADIUM GOLD |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
BALL |
124 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA124,13X13,25 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 mm |
9 mm |
9 mm |
CMOS |
1.8 V |
.65 mm |
S-PBGA-B124 |
3 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
TIN SILVER COPPER |
3 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
NICKEL PALLADIUM GOLD |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
1.8 V |
125 Cel |
-40 Cel |
PURE TIN |
QUAD |
1.6 mm |
10 mm |
10 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G64 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
6 |
BCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.6 V |
GRID ARRAY |
SOLCC6,.04,20 |
1.35 V |
85 Cel |
-40 Cel |
BOTTOM |
.4 mm |
1.1 mm |
ALSO OPERATES WITH 3.8V NOM SUPPLY |
1.5 mm |
CMOS |
1.45 V |
.5 mm |
R-PBCC-N6 |
1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
OTHER |
NO LEAD |
10 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
.6 mm |
3 mm |
3 mm |
CMOS |
3.3 V |
.5 mm |
S-PDSO-N10 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
1.8/5 |
NICKEL PALLADIUM GOLD |
N |
20 |
260 |
131072 Bits |
Other uPs/uCs/Peripheral ICs |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
.6 mm |
5 mm |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N32 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
.6 mm |
6 mm |
6 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N40 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
GULL WING |
64 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP64,.47SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
10 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G64 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
SoC |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
8 mm |
8 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N68 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
21.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
6 mm |
6 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N40 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
SERIAL, FIXED PROTOCOL |
5.5 V |
3/5 |
SMALL OUTLINE |
SOP14,.25 |
N |
2.7 V |
85 Cel |
-40 Cel |
PURE TIN |
DUAL |
1.75 mm |
3.9 mm |
30 |
260 |
8.64 mm |
CMOS |
SECONDS |
3 V |
Timer or RTC |
1.27 mm |
R-PDSO-G14 |
3 |
Not Qualified |
NO |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.62 V |
85 Cel |
-20 Cel |
NICKEL GOLD PALLADIUM SILVER |
QUAD |
.9 mm |
5 mm |
ALSO OPERATES AT 3.3V NOMINAL VOLATGE |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
1.8/5 |
NICKEL PALLADIUM GOLD |
N |
40 |
260 |
524288 Bits |
Other uPs/uCs/Peripheral ICs |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
1.8/5 |
NICKEL PALLADIUM GOLD |
N |
40 |
260 |
524288 Bits |
Other uPs/uCs/Peripheral ICs |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
INDUSTRIAL |
PURE TIN |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
INDUSTRIAL |
PURE TIN |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
INDUSTRIAL |
PURE TIN |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
NICKEL PALLADIUM GOLD |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
BALL |
124 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA124,13X13,25 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 mm |
9 mm |
9 mm |
CMOS |
1.8 V |
.65 mm |
S-PBGA-B124 |
3 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
12 mm |
12 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G80 |
3 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.