Infineon Technologies Other Function uPs,uCs & Peripheral ICs 1,980

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
CY8C4146LQE-S453T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147AZA-S465	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4146LQE-S243	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4125LQS-S413	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.27SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm	7 mm			7 mm	CMOS	1.8 V		.5 mm	S-XQCC-N40	3		e4
CY8C4147LQE-S463T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
SLE66CLX360M-C	Infineon Technologies		OTHER									1.8/5		DIE OR CHIP		85 Cel	-25 Cel								CMOS		Other Microprocessor ICs				Not Qualified
CY8C4245AZS-M445	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3 V		.5 mm	S-PQFP-G64	3
CY8C4126AZS-M445	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4125PVE-S422	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm			10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
CY8C4147LQE-S463	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4146PVS-S422	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm			10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
CY8C4147AZE-S465T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4147AZA-S285T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4146AZS-S275T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4146AZE-S245	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
SLE66C40S-V5M4	Infineon Technologies
CY8C4147AZA-S295	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147LQA-S473	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40	3
CY8C4147AZE-S445T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4125AZS-M445	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4124LQE-S433	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	6 mm			6 mm	CMOS	1.8 V		.5 mm	S-XQCC-N40	3		e4
CY8C4125AZS-M443	Infineon Technologies	PSoC		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	7 mm			7 mm	CMOS	3.3 V		.5 mm	S-PQFP-G48	3
CY8C4127LQS-S443T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4146AZA-S255T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	30	260	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
SLE66CLX206S-C	Infineon Technologies
CY8C4147AZS-S445T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	30	260	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147LQA-S283T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
SAB-R2010-16QJ	Infineon Technologies
CY8C4147LQS-S473T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
SLE66CLX206M-C	Infineon Technologies
CY8C6245LQI-S3D62	Infineon Technologies	SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1 mm	8 mm			8 mm	CMOS	1.8 V		.4 mm	S-XQCC-N68	3
SP001719944	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm			5 mm	CMOS	3.3 V		.5 mm	S-PQCC-N32
CY8C4126AZA-S455T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
FP30D250E	Infineon Technologies
CY8C4124PVS-S412	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm			10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
C161U-LF	Infineon Technologies
CY8C4146LQS-S253T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4146AZS-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C21334-24PVXAT	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	4.75 V	85 Cel	-40 Cel	MATTE TIN	DUAL	2 mm	5.3 mm	20	260	7.2 mm	CMOS	5 V		.65 mm	R-PDSO-G20	3		e3
SLE76CF1960PC	Infineon Technologies
CY8C4124PVA-S422	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm			10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
SLE6636ED	Infineon Technologies		OTHER									5		DIE OR CHIP		80 Cel	-40 Cel								CMOS	5 V	Other Microprocessor ICs				Not Qualified
CY8C4247AZS-M475	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	1.8 V		.5 mm	S-PQFP-G64	3
SLE66C40S-T85M4	Infineon Technologies
CY8C4126LQE-S453	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147LQS-S443	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C6137FDI-F02	Infineon Technologies	PROGRAMMABLE SoC		BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,11X15,14	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	3.19 mm			3.676 mm	CMOS	1.8 V		.35 mm	R-PBGA-B80
CY8C4147LQA-S293	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.