Infineon Technologies Other Function uPs,uCs & Peripheral ICs 1,980

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
CY8C21534-24PVXAT	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel	-40 Cel		DUAL	2 mm	5.3 mm	10.2 mm	CMOS	5 V		.65 mm	R-PDSO-G28	3
CY8C4147AZE-S285	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4124LQE-S413	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	6 mm	6 mm	CMOS	1.8 V		.5 mm	S-XQCC-N40	3		e4
SLE66CLX206PE-C	Infineon Technologies
CY8C4146AZS-S265T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4146PVA-S422	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm	10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
PEB20544E	Infineon Technologies		INDUSTRIAL	BALL	316	BGA	SQUARE	PLASTIC/EPOXY	YES			2.5,3.3	GRID ARRAY	BGA316,20X20,50		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM				CMOS		Other Microprocessor ICs	1.27 mm	S-PBGA-B316		Not Qualified	e0
IR1145SPBF	Infineon Technologies
PXF4270E	Infineon Technologies
FP30L100E	Infineon Technologies
CY8C4146AZA-S265	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4146PVA-S432	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm	10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
IRS2580DSTRPBF	Infineon Technologies
CY8C4147AZS-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
SLE66CLX800PEC	Infineon Technologies		OTHER									1.8/5		DIE OR CHIP		85 Cel	-25 Cel						CMOS		Other uPs/uCs/Peripheral ICs				Not Qualified
CY8C4146AZE-S245T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4147AZS-S275	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147LQA-S463	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm	6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4125LQA-S423	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.27SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm	7 mm	7 mm	CMOS	1.8 V		.5 mm	S-XQCC-N40	3		e4
CY8C4146LQE-S243T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm	6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4127LQS-S453	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm	6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147LQS-S463T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm	6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147AZS-S465	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
SAF-TC1100-L100EBAA	Infineon Technologies
CY8C4146AZS-S265	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
SLE66C324PEM5	Infineon Technologies	MICROPROCESSOR CIRCUIT
SLE66CX206PEC	Infineon Technologies	MICROPROCESSOR CIRCUIT
KTY23	Infineon Technologies
SLE66C42P-F7M5	Infineon Technologies
CY8C4147AZE-S445	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
TLE5203S	Infineon Technologies
SLE66C20SM4	Infineon Technologies
SLE66C20S-V5-F7M4	Infineon Technologies
CY8C4127AZA-S445T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4126AZE-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4246AZA-M445	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	10 mm	CMOS	1.8 V		.5 mm	S-PQFP-G64	3
CY8C4146AZE-S255T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4147AZA-S475T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
SLE76CF3601PC	Infineon Technologies		OTHER									1.8/5		DIE OR CHIP		85 Cel	-25 Cel						CMOS		Other Microprocessor ICs				Not Qualified
CY8C4125PVE-S412	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm	10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
CY8C624AAZI-S2D44	Infineon Technologies	PROGRAMMABLE SoC																PURE TIN										3
CY8C4147LQS-S443T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm	6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
SLE66CLX207PEM-C	Infineon Technologies
CY8C4127AZE-S455T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C6248BZI-S2D44	Infineon Technologies	PROGRAMMABLE SoC																TIN SILVER COPPER										3		e1
CY8C4147LQE-S273T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm	6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C6245LQI-S3D42	Infineon Technologies	SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1 mm	8 mm	8 mm	CMOS	1.8 V		.4 mm	S-XQCC-N68	3
CY8C4147AZS-S295	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.