Infineon Technologies Other Function uPs,uCs & Peripheral ICs 1,980

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
CY8C4125LQS-S433	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.27SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm	7 mm			7 mm	CMOS	1.8 V		.5 mm	S-XQCC-N40	3		e4
CY8C4146LQE-S433	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	6 mm			6 mm	CMOS	1.8 V		.5 mm	S-XQCC-N40	3		e4
CY8C4147LQS-S473	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40	3
KTY20-5	Infineon Technologies
CY8C4147AZS-S275T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
IR3521MTRPBF	Infineon Technologies	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					MATTE TIN	QUAD	.9 mm	5 mm			5 mm	CMOS			.5 mm	S-XQCC-N32		Not Qualified	e3
CY8C4247LWS-M484	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.9 mm	8 mm			8 mm	CMOS	1.8 V		.5 mm	S-XQCC-N56	3		e4
CY8C4146AZE-S275	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4124LQS-S413	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	6 mm			6 mm	CMOS	1.8 V		.5 mm	S-XQCC-N40	3		e4
KTY21	Infineon Technologies
CY8C4146LQS-S453T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4246AZS-M445	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	1.8 V		.5 mm	S-PQFP-G64	3
CY8C4147AZE-S295T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4147LQE-S443T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40	3
CY8C4147AZS-S445	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147LQS-S293	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
SLE66CX186PEC	Infineon Technologies
CY8C624ABZI-S2D14	Infineon Technologies	PROGRAMMABLE SoC																TIN SILVER COPPER												3		e1
KTY20	Infineon Technologies
KTY20-6	Infineon Technologies
CY8C4146LQS-S273	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4127LQA-S443	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4127AZE-S445	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4146AZE-S265	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4125AZA-M443	Infineon Technologies	PSoC		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	7 mm	30	260	7 mm	CMOS	3.3 V		.5 mm	S-PQFP-G48	3
CY8C6248LQI-S2D02	Infineon Technologies	PROGRAMMABLE SoC																												3
SLE66CLX360PEC	Infineon Technologies		OTHER									1.8/5		DIE OR CHIP		85 Cel	-25 Cel								CMOS		Other uPs/uCs/Peripheral ICs				Not Qualified
CY8C4147LQE-S283T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C6245LQI-S3D02	Infineon Technologies	SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1 mm	8 mm			8 mm	CMOS	1.8 V		.4 mm	S-XQCC-N68	3
CY8C4147LQA-S463T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
SLE66CX322P-T85M5	Infineon Technologies
CY8C4147AZA-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	30	260	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4146LQA-S273T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4125AZA-M445	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4146LQS-S433	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	6 mm			6 mm	CMOS	1.8 V		.5 mm	S-XQCC-N40	3		e4
SLE66C644P-T85M5	Infineon Technologies
SLE66CL81PE(M)-C	Infineon Technologies
CY8C4147AZE-S275T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4146LQA-S253T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147AZA-S445T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147LQA-S273T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4127LQE-S453T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4124PVE-S422	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm			10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
CY8C4125PVS-S432	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm			10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
CY8C4146LQS-S423	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	6 mm			6 mm	CMOS	1.8 V		.5 mm	S-XQCC-N40	3		e4
CY8C6248LQI-S2D42	Infineon Technologies	PROGRAMMABLE SoC																												3
SDA9095	Infineon Technologies
SLE66C20S-V5-T85M4	Infineon Technologies

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.