Infineon Technologies Other Function uPs,uCs & Peripheral ICs 1,980

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
CY8C4146AZA-S265T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
SBV566	Infineon Technologies
CY8C4147LQA-S443	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4146LQS-S263	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147AZA-S275T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
PMB8789	Infineon Technologies
CY8C6117FDI-F02	Infineon Technologies	PROGRAMMABLE SoC		BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,11X15,14	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	3.19 mm			3.676 mm	CMOS	1.8 V		.35 mm	R-PBGA-B80
CY8C4147LQA-S243T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147AZS-S455T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
IRS2580DSPBF	Infineon Technologies
IR1144SPBF	Infineon Technologies
SLE66CX642P-F7M5	Infineon Technologies
CY8C4146LQE-S263T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
PEB3454E	Infineon Technologies		INDUSTRIAL	BALL	316	BGA	SQUARE	PLASTIC/EPOXY	YES			2.5,3.3	GRID ARRAY	BGA316,20X20,50		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM						CMOS		Other Microprocessor ICs	1.27 mm	S-PBGA-B316		Not Qualified	e0
SLE6636C	Infineon Technologies		OTHER									5		DIE OR CHIP		80 Cel	-40 Cel								CMOS	5 V	Other Microprocessor ICs				Not Qualified
CY8C4146LQA-S243T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
SLE66C24PEM5	Infineon Technologies	MICROPROCESSOR CIRCUIT
CY8C4125PVA-S432	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm			10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
CY8C4146LQS-S273T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4127AZA-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZE-S265T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4124PVA-S432	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm			10.2 mm	CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
CY8C624ABZI-S2D04	Infineon Technologies	PROGRAMMABLE SoC																TIN SILVER COPPER												3		e1
CY8C6245LQI-S3D12	Infineon Technologies	SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1 mm	8 mm			8 mm	CMOS	1.8 V		.4 mm	S-XQCC-N68	3
CY8C4125LQS-S423	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.27SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm	7 mm			7 mm	CMOS	1.8 V		.5 mm	S-XQCC-N40	3		e4
CY8C4147AZS-S475	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZS-S255	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147LQA-S453	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
PEF20064E	Infineon Technologies
SLE66CL180PEMC	Infineon Technologies		OTHER									1.8/5		DIE OR CHIP		85 Cel	-25 Cel								CMOS		Other uPs/uCs/Peripheral ICs				Not Qualified
SLE66C321PEM5	Infineon Technologies	MICROPROCESSOR CIRCUIT
CY8C4146AZA-S245T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147LQA-S283	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147AZE-S255T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
KTY11	Infineon Technologies
CY8C4147LQS-S253	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147LQA-S253	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4146LQE-S263	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4247AZA-M485	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	1.8 V		.5 mm	S-PQFP-G64	3
CY8C4146AZA-S255	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4127AZS-S445T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147LQE-S253T	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4146AZS-S245T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZA-S295T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	30	260	10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4146AZE-S455T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64
SLE66C40S-V5-T85M4	Infineon Technologies
CY8C4146AZS-S455T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V		.5 mm	S-PQFP-G64	3
KTY19-6	Infineon Technologies

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.