Flat Field Programmable Gate Arrays (FPGA) 542

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
RT3PE3000L-1CQ256PROTO	Microchip Technology	FPGA		Flat	256	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	75264	CMOS			3000000	1.2		Flatpack, Guard Ring			1.14 V	.5 mm			75264 CLBS, 3000000 Gates			Quad	S-CQFP-F256		3.3 mm	36 mm								36 mm
RT3PE3000L-CQ256PROTO	Microchip Technology	FPGA		Flat	256	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	75264	CMOS			3000000	1.2		Flatpack, Guard Ring			1.14 V	.5 mm			75264 CLBS, 3000000 Gates		Tin Lead	Quad	S-CQFP-F256		3.3 mm	36 mm			e0		20 s		225 °C (437 °F)	36 mm
RT3PE3000L-1CQ256B	Microchip Technology	FPGA	Military	Flat	256	GQFF	Square		Ceramic, Metal-Sealed Cofired	75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B		3000000	1.2	1.2/1.5,1.2/3.3 V	Flatpack, Guard Ring	TPAK256,3SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F256		3.3 mm	36 mm	No			250 MHz				36 mm
RT3PE3000L-CQ256B	Microchip Technology	FPGA	Military	Flat	256	GQFF	Square		Ceramic, Metal-Sealed Cofired	75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B		3000000	1.2	1.2/1.5,1.2/3.3 V	Flatpack, Guard Ring	TPAK256,3SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.3 mm	36 mm	No		e0	250 MHz	20 s		225 °C (437 °F)	36 mm
RT4G150-CQ352B	Microchip Technology	FPGA		Flat	352	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V			MIL-STD-883 Class B	166		1.2		Flatpack, Guard Ring	TPAK352,2.9SQ,20		1.14 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F352			48 mm						166		48 mm
RT4G150-CQ352E	Microchip Technology	FPGA		Flat	352	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V				166		1.2		Flatpack, Guard Ring	TPAK352,2.9SQ,20		1.14 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F352			48 mm						166		48 mm
RT4G150-CQ352V	Microchip Technology	FPGA		Flat	352	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V			MIL-PRF-38535 Class V	166		1.2		Flatpack, Guard Ring	TPAK352,2.9SQ,20		1.14 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F352			48 mm						166		48 mm
M1AFS250-1PQG208I	Microsemi	FPGA	Industrial	Flat	208	QFF	Rectangular		Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5		Flatpack			1.425 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-F208	3	4.1 mm	28 mm	No		e3					30.6 mm
5962-0151801QYC	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.75 V		CMOS	MIL-PRF-38535 Class Q		32000	2.5		Flatpack, Guard Ring			2.25 V	.5 mm	125 °C (257 °F)		32000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F208		3.22 mm	29.21 mm	No	2.5 V, 3.3 V, and 5.0 V mixed voltage operation	e4					29.21 mm
A42MX36-1CQ208	Microchip Technology	FPGA	Commercial	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2438	CMOS			54000	3.3		Flatpack, Guard Ring			3 V	.5 mm	70 °C (158 °F)	2.3 ns	2438 CLBS, 54000 Gates	0 °C (32 °F)		Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	Also Operates at 5 V supply		83 MHz				29.21 mm
A42MX36-CQ208	Microchip Technology	FPGA	Commercial	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	2414	Yes	3.6 V	2438	CMOS			54000	3.3		Flatpack, Guard Ring			3 V	.5 mm	70 °C (158 °F)	2.7 ns	2438 CLBS, 54000 Gates	0 °C (32 °F)		Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	Also Operates at 5 V supply		73 MHz				29.21 mm
A54SX32-CQ208	Microchip Technology	FPGA	Commercial	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3	3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	70 °C (158 °F)	1 ns	2880 CLBS, 32000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246		29.21 mm
A54SX32-CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3	3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246		29.21 mm
A54SX32ACQ208	Microsemi	FPGA	Commercial	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	70 °C (158 °F)	1.2 ns	2880 CLBS, 48000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32A-CQ208	Microchip Technology	FPGA	Commercial	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	70 °C (158 °F)	1.2 ns	2880 CLBS, 48000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32CQ208	Actel	FPGA	Commercial	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3	3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	70 °C (158 °F)	1 ns	2880 CLBS, 32000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246	225 °C (437 °F)	29.21 mm
A54SX32CQ208B	Actel	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3	3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246	225 °C (437 °F)	29.21 mm
A54SX72A-CQ208M	Microchip Technology	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS		171	108000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	72000 typical gates available	e0	217 MHz		171		29.21 mm
A54SX72ACQ208M	Microsemi	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS		171	108000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	72000 typical gates available	e0	217 MHz		171		29.21 mm
APA1000-CQ208B	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	56320	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	1000000	2.5	2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		1000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm
APA1000-CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	56320	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	1000000	2.5	2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		1000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm
APA600-CQ208B	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	21504	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	600000	2.5	2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		600000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm
5962-0151802QYC	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.75 V		CMOS	MIL-PRF-38535 Class Q		32000	2.5		Flatpack, Guard Ring			2.25 V	.5 mm	125 °C (257 °F)		32000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F208		3.22 mm	29.21 mm	No	2.5 V, 3.3 V, and 5.0 V mixed voltage operation	e4					29.21 mm
A42MX36-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	2414	Yes	3.6 V	2438	CMOS			54000	3.3		Flatpack, Guard Ring			3 V	.5 mm	125 °C (257 °F)	2.3 ns	2438 CLBS, 54000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	Also Operates at 5 V supply	e0	83 MHz				29.21 mm
A54SX32-1CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3	3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	0.9 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	240 MHz		246		29.21 mm
A54SX32A-CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	174	48000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32A-CQ208M	Microchip Technology	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz	20 s	174	225 °C (437 °F)	29.21 mm
A54SX32ACQ208B	Microsemi	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	174	48000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32ACQ208M	Microsemi	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz	20 s	174	225 °C (437 °F)	29.21 mm
A54SX72A-CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS	MIL-STD-883 Class B	171	108000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	72000 typical gates available	e0	217 MHz		171		29.21 mm
A54SX72ACQ208B	Microsemi	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS	MIL-STD-883 Class B	171	108000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	72000 typical gates available	e0	217 MHz		171		29.21 mm
AX250-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	4224	Yes	1.575 V	2816	CMOS	MIL-STD-883 Class B	248	250000	1.5	1.5,1.5/3.3,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.84 ns	2816 CLBS, 250000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	250000 system gates avaiable	e0	763 MHz		248		29.21 mm
AX500-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	8064	Yes	1.575 V	5376	CMOS	MIL-STD-883 Class B	336	500000	1.5	1.5,1.5/3.3,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.84 ns	5376 CLBS, 500000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	500000 system gates avaiable	e0	763 MHz		336		29.21 mm
RTAX2000SL-1CQ352E	Microchip Technology	FPGA	Military	Flat	352	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	21504	CMOS		684	2000000	1.5	1.5/3.3 V	Flatpack	TPAK352,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.95 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F352		2.89 mm	48 mm	No	250000 ASIC gates also available	e0			684		48 mm
RTSX32SUCQ84B	Microchip Technology	FPGA	Military	Flat	84	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	227	48000	2.5	2.5,3.3/5 V	Flatpack, Guard Ring	TPAK84,1.63SQ,25	Field Programmable Gate Arrays	2.25 V	.635 mm	125 °C (257 °F)	1.4 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F84		2.4 mm	16.51 mm	No	32000 typical gates available	e0	310 MHz	20 s	227	225 °C (437 °F)	16.51 mm
RTSX32SU-CQ84B	Microsemi	FPGA	Military	Flat	84	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	227	48000	2.5	2.5,3.3/5 V	Flatpack, Guard Ring	TPAK84,1.63SQ,25	Field Programmable Gate Arrays	2.25 V	.635 mm	125 °C (257 °F)	1.4 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F84		2.4 mm	16.51 mm	No	32000 typical gates available	e0	310 MHz	20 s	227	225 °C (437 °F)	16.51 mm
A54SX32A-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.1 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	278 MHz		174		29.21 mm
RTAX2000SLCQ352B	Microchip Technology	FPGA	Military	Flat	352	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	21504	CMOS	MIL-STD-883 Class B	684	2000000	1.5	1.5/3.3 V	Flatpack	TPAK352,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F352		2.89 mm	48 mm	No	250000 ASIC gates also available	e0			684		48 mm
RTAX2000SL-CQ352B	Microsemi	FPGA	Military	Flat	352	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	21504	CMOS	MIL-STD-883 Class B	684	2000000	1.5	1.5/3.3 V	Flatpack	TPAK352,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F352		2.89 mm	48 mm	No	250000 ASIC gates also available	e0			684		48 mm
A54SX16-1CQ208B	Microsemi	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	1452	Yes	3.63 V	1452	CMOS	MIL-STD-883 Class B	172	16000	3.3	3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	0.9 ns	1452 CLBS, 16000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	24000 system gates avaiable	e0	240 MHz		172		29.21 mm
A54SX32-1CQ256M	Microsemi	FPGA	Military	Flat	256	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3	3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	0.9 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	240 MHz		246		36 mm
A54SX32-CQ256B	Microsemi	FPGA	Military	Flat	256	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3	3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	205 MHz		246		36 mm
A54SX32-CQ256M	Microsemi	FPGA	Military	Flat	256	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3	3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	205 MHz	20 s	246	225 °C (437 °F)	36 mm
A54SX32CQ256B	Actel	FPGA	Military	Flat	256	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3	3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	205 MHz		246	225 °C (437 °F)	36 mm
A54SX32CQ256M	Actel	FPGA	Military	Flat	256	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3	3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	205 MHz		246	225 °C (437 °F)	36 mm
A54SX72ACQ256M	Microsemi	FPGA	Military	Flat	256	QFF	Square		Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS		213	108000	2.5	2.5,3.3/5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.3 mm	36 mm	No	72000 typical gates available	e0	217 MHz		213		36 mm
A54SX72A-CQ256M	Microchip Technology	FPGA	Military	Flat	256	QFF	Square		Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS		213	108000	2.5	2.5,3.3/5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.3 mm	36 mm	No	72000 typical gates available	e0	217 MHz		213		36 mm
APA600-CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	21504	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	600000	2.5	2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		600000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.