Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx |
FPGA |
Military |
Flat |
228 |
GQFF |
Square |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
6912 |
Yes |
2.625 V |
1536 |
CMOS |
MIL-PRF-38535 Class Q |
316 |
322970 |
2.5 |
1.2/3.6,2.5 V |
Flatpack, Guard Ring |
TPAK228,2.5SQ,25 |
Field Programmable Gate Arrays |
2.375 V |
.635 mm |
125 °C (257 °F) |
1536 CLBS, 322970 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F228 |
3.302 mm |
39.37 mm |
No |
e0 |
316 |
39.37 mm |
|||||||||
Microchip Technology |
FPGA |
Flat |
352 |
GQFF |
Square |
300k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
Yes |
1.575 V |
CMOS |
198 |
2000000 |
1.5 |
Flatpack, Guard Ring |
TPAK352,2.9SQ,20 |
1.425 V |
.5 mm |
2000000 Gates |
Quad |
S-CQFP-F352 |
2.89 mm |
48 mm |
649 MHz |
198 |
48 mm |
|||||||||||||||||||
Microchip Technology |
FPGA |
Military |
Flat |
352 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
32256 |
Yes |
1.575 V |
21504 |
CMOS |
MIL-STD-883 Class B |
684 |
2000000 |
1.5 |
1.5,1.5/3.3,2.5/3.3 V |
Flatpack, Guard Ring |
TPAK352,2.9SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
125 °C (257 °F) |
0.84 ns |
21504 CLBS, 2000000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F352 |
2.89 mm |
48 mm |
No |
2000000 system gates avaiable |
e0 |
763 MHz |
684 |
48 mm |
|||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
295 |
Yes |
CMOS |
38535Q/M;38534H;883B |
57 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
57 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
QFF |
Square |
Ceramic |
295 |
Yes |
CMOS |
38535Q/M;38534H;883B |
57 |
5 |
5 V |
Flatpack |
QFL84,.65SQ,25 |
Field Programmable Gate Arrays |
.635 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-XQFP-F84 |
No |
57 |
||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
295 |
Yes |
CMOS |
57 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
57 |
||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
547 |
Yes |
CMOS |
38535Q/M;38534H;883B |
69 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
172 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
Yes |
5.5 V |
1232 |
CMOS |
MIL-STD-883 |
140 |
8000 |
5 |
5 V |
Flatpack |
TPAK172(UNSPEC) |
Field Programmable Gate Arrays |
4.5 V |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F172 |
No |
39 MHz |
140 |
|||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
295 |
Yes |
5.5 V |
CMOS |
MIL-STD-883 Class B |
57 |
1200 |
5 |
5 V |
Flatpack, Guard Ring |
TPAK84,1.63SQ,25 |
Field Programmable Gate Arrays |
4.5 V |
.635 mm |
125 °C (257 °F) |
1200 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F84 |
3.302 mm |
16.51 mm |
No |
57 |
16.51 mm |
|||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
172 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
Yes |
5.5 V |
1232 |
CMOS |
MIL-STD-883 Class B |
140 |
8000 |
5 |
5 V |
Flatpack |
TPAK172(UNSPEC) |
Field Programmable Gate Arrays |
4.5 V |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F172 |
No |
50 MHz |
140 |
|||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
QFF |
Square |
Ceramic |
295 |
Yes |
CMOS |
57 |
5 |
5 V |
Flatpack |
QFL84,.65SQ,25 |
Field Programmable Gate Arrays |
.635 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-XQFP-F84 |
No |
57 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
172 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
Yes |
5.5 V |
1232 |
CMOS |
MIL-STD-883 Class B |
140 |
8000 |
5 |
5 V |
Flatpack |
TPAK172(UNSPEC) |
Field Programmable Gate Arrays |
4.5 V |
.64 mm |
125 °C (257 °F) |
18.72 ns |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F172 |
3.3 mm |
26.665 mm |
No |
MAX 140 I/OS; 998 flip-flops |
39 MHz |
140 |
26.665 mm |
|||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
547 |
Yes |
5.5 V |
547 |
CMOS |
38535Q/M;38534H;883B |
69 |
2000 |
5 |
5 V |
Flatpack |
QFL84,.65SQ,25 |
Field Programmable Gate Arrays |
4.5 V |
.635 mm |
125 °C (257 °F) |
19.332 ns |
547 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F84 |
3.3 mm |
16.51 mm |
No |
MAX 69 I/OS; 273 flip-flops |
100 MHz |
69 |
16.51 mm |
|||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
QFF |
Square |
Ceramic |
295 |
Yes |
CMOS |
38535Q/M;38534H;883B |
57 |
5 |
5 V |
Flatpack |
QFL84,.65SQ,25 |
Field Programmable Gate Arrays |
.635 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-XQFP-F84 |
No |
57 |
||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
547 |
Yes |
CMOS |
38535Q/M;38534H;883B |
69 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
172 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
Yes |
5.5 V |
1232 |
CMOS |
MIL-STD-883 |
140 |
8000 |
5 |
5 V |
Flatpack |
TPAK172(UNSPEC) |
Field Programmable Gate Arrays |
4.5 V |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F172 |
No |
50 MHz |
140 |
|||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
295 |
Yes |
CMOS |
57 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
57 |
||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
295 |
Yes |
CMOS |
38535Q/M;38534H;883B |
57 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
57 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
69 |
||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
547 |
Yes |
CMOS |
38535Q/M;38534H;883B |
69 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
547 |
Yes |
5.5 V |
547 |
CMOS |
38535Q/M;38534H;883B |
69 |
2000 |
5 |
5 V |
Flatpack |
QFL84,.65SQ,25 |
Field Programmable Gate Arrays |
4.5 V |
.635 mm |
125 °C (257 °F) |
16.092 ns |
547 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F84 |
3.3 mm |
16.51 mm |
No |
MAX 69 I/OS; 273 flip-flops |
69 |
16.51 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
295 |
Yes |
5.5 V |
295 |
CMOS |
38535Q/M;38534H;883B |
57 |
1200 |
5 |
5 V |
Flatpack |
QFL84,.65SQ,25 |
Field Programmable Gate Arrays |
4.5 V |
.635 mm |
125 °C (257 °F) |
19.332 ns |
295 CLBS, 1200 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F84 |
3.3 mm |
16.51 mm |
No |
MAX 57 I/OS; 130 flip-flops |
100 MHz |
57 |
16.51 mm |
|||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
QFF |
Square |
Ceramic |
547 |
Yes |
CMOS |
38535Q/M;38534H;883B |
69 |
5 |
5 V |
Flatpack |
QFL84,.65SQ,25 |
Field Programmable Gate Arrays |
.635 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-XQFP-F84 |
No |
69 |
||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
QFF |
Square |
Ceramic |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Flatpack |
QFL84,.65SQ,25 |
Field Programmable Gate Arrays |
.635 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-XQFP-F84 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
547 |
Yes |
5.5 V |
547 |
CMOS |
69 |
2000 |
5 |
5 V |
Flatpack |
QFL84,.65SQ,25 |
Field Programmable Gate Arrays |
4.5 V |
.635 mm |
125 °C (257 °F) |
19.332 ns |
547 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F84 |
3.3 mm |
16.51 mm |
No |
MAX 69 I/OS; 273 flip-flops |
100 MHz |
69 |
16.51 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
QFF |
Square |
Ceramic |
295 |
Yes |
CMOS |
57 |
5 |
5 V |
Flatpack |
QFL84,.65SQ,25 |
Field Programmable Gate Arrays |
.635 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-XQFP-F84 |
No |
57 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
172 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.5 V |
1232 |
CMOS |
8000 |
5 |
Flatpack, Guard Ring |
4.5 V |
.635 mm |
125 °C (257 °F) |
6.1 ns |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F172 |
2.9464 mm |
29.972 mm |
No |
41 MHz |
29.972 mm |
|||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
69 |
||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
172 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.5 V |
1232 |
CMOS |
8000 |
5 |
Flatpack, Guard Ring |
4.5 V |
.635 mm |
125 °C (257 °F) |
5.2 ns |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F172 |
2.9464 mm |
29.972 mm |
No |
60 MHz |
29.972 mm |
|||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
172 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.5 V |
1232 |
CMOS |
8000 |
5 |
Flatpack, Guard Ring |
4.5 V |
.635 mm |
125 °C (257 °F) |
6.1 ns |
8000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F172 |
3.175 mm |
29.972 mm |
No |
e0 |
41 MHz |
30 s |
225 °C (437 °F) |
29.972 mm |
|||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
196 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.5 V |
CMOS |
11000 |
5 |
Flatpack |
4.5 V |
.635 mm |
125 °C (257 °F) |
11000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F196 |
3.302 mm |
34.29 mm |
No |
34.29 mm |
||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
547 |
Yes |
CMOS |
38535Q/M;38534H;883B |
69 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
172 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.5 V |
1232 |
CMOS |
8000 |
5 |
Flatpack, Guard Ring |
4.5 V |
.635 mm |
125 °C (257 °F) |
5.2 ns |
8000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F172 |
3.175 mm |
29.972 mm |
No |
e0 |
60 MHz |
30 s |
225 °C (437 °F) |
29.972 mm |
|||||||||||||
Xilinx |
FPGA |
Military |
Flat |
196 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.5 V |
400 |
MIL-STD-883 Class B |
7000 |
5 |
Flatpack, Guard Ring |
4.5 V |
.65 mm |
125 °C (257 °F) |
400 CLBS, 7000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F196 |
3.302 mm |
28.702 mm |
No |
28.702 mm |
|||||||||||||||||||
Xilinx |
FPGA |
Military |
Flat |
228 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
1368 |
Yes |
CMOS |
MIL-STD-883 |
192 |
5 |
5 V |
Flatpack, Guard Ring |
TPAK228,2.5SQ,25 |
Field Programmable Gate Arrays |
.65 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Quad |
S-CQFP-F228 |
3.302 mm |
39.37 mm |
No |
e4 |
90.9 MHz |
192 |
39.37 mm |
||||||||||||||
Xilinx |
FPGA |
Military |
Flat |
100 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
CMOS |
MIL-STD-883 |
5 |
Flatpack |
.635 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F100 |
3.683 mm |
17.272 mm |
No |
e0 |
17.272 mm |
|||||||||||||||||||||
Xilinx |
FPGA |
Military |
Flat |
164 |
QFF |
Square |
Yes |
5.5 V |
CMOS |
MIL-PRF-38535 Class N |
5000 |
5 |
Flatpack |
4.5 V |
.635 mm |
125 °C (257 °F) |
6 ns |
5000 Gates |
-55 °C (-67 °F) |
Quad |
S-XQFP-F164 |
2.92 mm |
28.702 mm |
No |
50 MHz |
28.702 mm |
||||||||||||||||||
Xilinx |
FPGA |
Military |
Flat |
164 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.5 V |
320 |
CMOS |
9000 |
5 |
Flatpack |
4.5 V |
.635 mm |
125 °C (257 °F) |
9 ns |
320 CLBS, 9000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F164 |
3.683 mm |
27.432 mm |
No |
MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C |
70 MHz |
27.432 mm |
||||||||||||||||
Xilinx |
FPGA |
Military |
Flat |
228 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
3.6 V |
2304 |
CMOS |
40000 |
3.3 |
Flatpack, Guard Ring |
3 V |
.65 mm |
125 °C (257 °F) |
2304 CLBS, 40000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F228 |
3.302 mm |
39.37 mm |
No |
39.37 mm |
|||||||||||||||||||
Xilinx |
FPGA |
Military |
Flat |
164 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
320 |
CMOS |
5000 |
5 |
Flatpack, Guard Ring |
.65 mm |
125 °C (257 °F) |
7 ns |
320 CLBS, 5000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F164 |
2.921 mm |
28.702 mm |
No |
928 flip-flops; typical gates = 5000-6000 |
e0 |
100 MHz |
28.702 mm |
||||||||||||||||
Xilinx |
FPGA |
Military |
Flat |
100 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
CMOS |
MIL-STD-883 |
5 |
Flatpack, Guard Ring |
.65 mm |
125 °C (257 °F) |
6 ns |
-55 °C (-67 °F) |
Gold |
Quad |
S-CQFP-F100 |
3.429 mm |
19.05 mm |
No |
e4 |
19.05 mm |
||||||||||||||||||||
Xilinx |
FPGA |
Military |
Flat |
228 |
GQFF |
Square |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
6912 |
Yes |
2.625 V |
1536 |
CMOS |
316 |
322970 |
2.5 |
1.2/3.6,2.5 V |
Flatpack, Guard Ring |
QFP228(UNSPEC) |
Field Programmable Gate Arrays |
2.375 V |
.635 mm |
125 °C (257 °F) |
1536 CLBS, 322970 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F228 |
3.302 mm |
39.37 mm |
No |
e0 |
316 |
39.37 mm |
||||||||||
Xilinx |
FPGA |
Military |
Flat |
100 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
64 |
CMOS |
1000 |
5 |
Flatpack, Guard Ring |
.65 mm |
125 °C (257 °F) |
7 ns |
64 CLBS, 1000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F100 |
2.921 mm |
19.05 mm |
No |
256 flip-flops; typical gates = 1000-1500 |
e0 |
100 MHz |
19.05 mm |
||||||||||||||||
Xilinx |
FPGA |
Military |
Flat |
228 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
3.6 V |
3136 |
CMOS |
MIL-PRF-38535 Class Q |
55000 |
3.3 |
Flatpack, Guard Ring |
3 V |
.635 mm |
125 °C (257 °F) |
1.3 ns |
3136 CLBS, 55000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F228 |
3.302 mm |
39.37 mm |
No |
e0 |
200 MHz |
39.37 mm |
||||||||||||||
Xilinx |
FPGA |
Military |
Flat |
164 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
320 |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
142 |
9000 |
5 |
5 V |
Flatpack, Guard Ring |
TAPEPAK,164P,.025 |
Field Programmable Gate Arrays |
4.5 V |
.635 mm |
125 °C (257 °F) |
9000 Gates |
-55 °C (-67 °F) |
Gold |
Quad |
S-CQFP-F164 |
2.921 mm |
28.702 mm |
No |
e4 |
100 MHz |
142 |
28.702 mm |
||||||||||
Xilinx |
FPGA |
Military |
Flat |
228 |
GQFF |
Square |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
15552 |
Yes |
2.625 V |
3456 |
CMOS |
MIL-PRF-38535 Class Q |
316 |
661111 |
2.5 |
1.2/3.6,2.5 V |
Flatpack, Guard Ring |
TPAK228,2.5SQ,25 |
Field Programmable Gate Arrays |
2.375 V |
.635 mm |
125 °C (257 °F) |
3456 CLBS, 661111 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F228 |
3.302 mm |
39.37 mm |
No |
e0 |
316 |
39.37 mm |
|||||||||
Xilinx |
FPGA |
Military |
Flat |
100 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
64 |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
64 |
2000 |
5 |
5 V |
Flatpack |
QFL100,.7SQ,25 |
Field Programmable Gate Arrays |
4.5 V |
.635 mm |
125 °C (257 °F) |
2000 Gates |
-55 °C (-67 °F) |
Gold |
Quad |
S-CQFP-F100 |
3.683 mm |
17.27 mm |
No |
e4 |
100 MHz |
64 |
17.27 mm |
||||||||||
Xilinx |
FPGA |
Military |
Flat |
100 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
144 |
Yes |
5.5 V |
144 |
CMOS |
MIL-STD-883 |
82 |
4200 |
5 |
5 V |
Flatpack, Guard Ring |
TPAK100,2.6SQ,25 |
Field Programmable Gate Arrays |
4.5 V |
.635 mm |
125 °C (257 °F) |
7 ns |
4200 Gates |
-55 °C (-67 °F) |
Gold |
Quad |
S-CQFP-F100 |
3.2258 mm |
19.05 mm |
No |
e4 |
100 MHz |
82 |
19.05 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.