Flat Field Programmable Gate Arrays (FPGA) 542

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
5962-9473002MZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	1368	Yes			CMOS	MIL-STD-883	192		5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4	90.9 MHz	192	39.37 mm
5962-8994801MYC	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0			17.272 mm
XC3020-125CQ100CSPC0110	Xilinx	FPGA	Commercial	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.25 V	64	CMOS			2000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	5.5 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	125 MHz		17.272 mm
XC3195A-4CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		484	CMOS	MIL-STD-883 Class B		6500	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	3.3 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No					28.702 mm
5962-9225202MYX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		196	CMOS	MIL-STD-883		4000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		196 CLBS, 4000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4			28.702 mm
XC3042-50CQ100C	Xilinx	FPGA	Commercial	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes	5.25 V	144	CMOS		82	4200	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.75 V	.635 mm	70 °C (158 °F)		144 CLBS, 4200 Gates	0 °C (32 °F)		Quad	S-CQFP-F100	1	3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops		50 MHz	82	17.272 mm
5962-9957201QYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	6912	Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q	162	322970	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	322970 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.0226 mm	39.37 mm	Yes		e4		162	39.37 mm
XC4005E-4CBG164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	196	CMOS			3000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	2.7 ns	196 CLBS, 3000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	Typical gates = 3000-9000	e3	111 MHz		28.702 mm
5962-8994802YC	Xilinx	FPGA	Military	Flat	100	QFF	Square				Yes	5.5 V	64	CMOS	MIL-STD-883		2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-XQFP-F100		3.68 mm	17.27 mm	No		e4	25 MHz		17.27 mm
XC4005-10CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	196	CMOS			4000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		196 CLBS, 4000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	616 flip-flops; typical gates = 4000-5000				28.702 mm
XC3020-70CQ100M	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes	5.5 V	64	CMOS		64	2000	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops	e0	70 MHz	64	17.272 mm
5962-8971303MNC	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes	5.5 V		CMOS	MIL-STD-883	82	4200	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		4200 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.683 mm	17.27 mm	No		e4	100 MHz	82	17.27 mm
5962-9471201MYX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	238	Yes			CMOS	MIL-STD-883	77		5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4	50 MHz	77	19.05 mm
5962-9561002MYX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4			19.05 mm
XC3020-70CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS	MIL-STD-883 Class B	64	1000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.429 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	70 MHz	64	19.05 mm
XC3090-70CQ164B	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes	5.5 V	320	CMOS	38535Q/M;38534H;883B	142	9000	5	5 V	Flatpack	QFL164,1.2SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	9 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164	1	3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops	e0	70 MHz	142	27.432 mm
5962-8971301M9X	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4			19.05 mm
5962-8982301MUX	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0			27.432 mm
XC3020-70CQ100BSPC0107	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz		17.272 mm
5962-9957301QYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	15552	Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class Q	162	661111	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	661111 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.0226 mm	39.37 mm	Yes		e4		162	39.37 mm
XC3190-5CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS		142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164	1	2.921 mm	28.702 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500	e0	190 MHz	142	28.702 mm
XC4010-5CB196B	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	400		MIL-STD-883 Class B		7000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		400 CLBS, 7000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	28.702 mm	No					28.702 mm
5962-9473002MYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	1368	Yes			CMOS	MIL-STD-883	192		5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4	90.9 MHz	192	39.37 mm
5962-8971303MYA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0			17.272 mm
5962-9230502NYX	Xilinx	FPGA	Military	Flat	164	QFF	Square				Yes	5.5 V		CMOS	MIL-PRF-38535 Class N		5000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	6 ns	5000 Gates	-55 °C (-67 °F)		Quad	S-XQFP-F164		2.92 mm	28.702 mm	No			50 MHz		28.702 mm
XC3090-70CQ164MSPC0107	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	320	CMOS			9000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		70 MHz		27.432 mm
XC4062XL-3CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2304	CMOS			40000	3.3		Flatpack, Guard Ring			3 V	.65 mm	125 °C (257 °F)		2304 CLBS, 40000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No					39.37 mm
XC3090-100CB164MSPC0107	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000	e0	100 MHz		28.702 mm
5962-9471202MYC	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	6 ns		-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4			19.05 mm
XQVR300-4CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	6912	Yes	2.625 V	1536	CMOS		316	322970	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	QFP228(UNSPEC)	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)		1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0		316	39.37 mm
XC3020-100CB100MSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		64	CMOS			1000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500	e0	100 MHz		19.05 mm
5962-9957501QYB	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	3136	CMOS	MIL-PRF-38535 Class Q		55000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0	200 MHz		39.37 mm
5962-8982303MTC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes	5.5 V		CMOS	MIL-STD-883	142	9000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		9000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No		e4	100 MHz	142	28.702 mm
XQVR600-4CB228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	15552	Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class Q	316	661111	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)		3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0		316	39.37 mm
5962-8994803MYC	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes	5.5 V		CMOS	MIL-STD-883	64	2000	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.683 mm	17.27 mm	No		e4	100 MHz	64	17.27 mm
5962-8971303M9C	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes	5.5 V	144	CMOS	MIL-STD-883	82	4200	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	7 ns	4200 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.2258 mm	19.05 mm	No		e4	100 MHz	82	19.05 mm
5962-8971301MMX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4			19.05 mm
5962-9225201MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	466	Yes			CMOS	MIL-STD-883	112		5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4		112	28.702 mm
5962-8994803MNX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns		-55 °C (-67 °F)		Quad	S-CQFP-F100		3.429 mm	19.05 mm	No					19.05 mm
XC3142A-5CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS		82	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.429 mm	19.05 mm	No	Typical gates = 2000-3000	e0	188 MHz	82	19.05 mm
5962-8982301MTX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS				5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No					28.702 mm
5962-8994803MMX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F100		3.429 mm	19.05 mm	No					19.05 mm
XC4010-6CB196M	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS		160	8000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	6 ns	400 CLBS, 8000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F196	1	2.921 mm	34.29 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	90.9 MHz	160	34.29 mm
5962-8994801YC	Xilinx	FPGA	Military	Flat	100	QFF	Square				Yes	5.5 V	64	CMOS	MIL-STD-883		2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	14 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-XQFP-F100		3.68 mm	17.27 mm	No		e4	16 MHz		17.27 mm
5962-9850901QYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	2432	Yes	5.5 V		CMOS	MIL-PRF-38535 Class Q	192	28000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.2 ns	28000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.0226 mm	39.68 mm	No		e4	143 MHz	192	39.68 mm
5962-9561101MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes			CMOS	MIL-STD-883	142		5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	190 MHz	142	28.702 mm
5962-8971302QTX	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS	MIL-PRF-38535 Class Q		4200	5		Flatpack			4.5 V		125 °C (257 °F)	9 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							70 MHz
5962-9851001QYX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class Q		22000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 65000		166 MHz		39.37 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.