Flat Field Programmable Gate Arrays (FPGA) 542

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4028EX-4CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	1024	CMOS			18000	3.3		Flatpack, Guard Ring			3 V	.65 mm	125 °C (257 °F)		1024 CLBS, 18000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No						39.37 mm
5962-9561001MZC	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes			CMOS	MIL-STD-883	82		5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4	190 MHz	82		19.05 mm
5962-9230502MZC	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		400	CMOS	MIL-STD-883		8000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4				28.702 mm
5962-8982302MTC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes			CMOS	MIL-STD-883	142		5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	70 MHz	142		28.702 mm
XC3120A-5CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS	38535Q/M;38534H;883B	64	1300	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	64 CLBS, 1300 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800		190 MHz	64		19.05 mm
XC3042-50CQ100MSPC0107	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS			4200	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)		144 CLBS, 4200 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz			17.272 mm
XQV300-4CBG228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.625 V	1536	CMOS	MIL-PRF-38535		322970	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3				39.37 mm
XC4003A-6CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	238	Yes	5.5 V	100	CMOS		77	2500	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	6 ns	100 CLBS, 2500 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	360 flip-flops; typical gates = 2500-3000		90.9 MHz	77		19.05 mm
XC3042-70CQ100M	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes	5.5 V	144	CMOS		82	4200	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	9 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops	e0	70 MHz	82		17.272 mm
5962-9230503MYX	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	28.702 mm	No						28.702 mm
5962-9561001MYC	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS	MIL-STD-883	82	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No	Typical gates = 2000-3000	e4	188 MHz	82		19.05 mm
5962-9561101MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4				28.702 mm
XC3195A-5CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	484	Yes		484	CMOS		176	6500	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164	1	3.302 mm	28.702 mm	No	Typical gates = 6500-7500		188 MHz	176		28.702 mm
5962-8971301QTX	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS	MIL-PRF-38535 Class Q		4200	5		Flatpack			4.5 V		125 °C (257 °F)	14 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							50 MHz
XC4010-10CB196M	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	400	CMOS			8000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		2.921 mm	34.29 mm	No	1120 flip-flops; typical gates = 8000-10000					34.29 mm
5962-9851301QYB	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	576	CMOS	MIL-PRF-38535 Class Q		10000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 30000	e0	166 MHz			39.37 mm
5962-9851301QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	1368	Yes	3.6 V	576	CMOS	MIL-PRF-38535 Class Q	192	10000	3.3	3.3 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	3 V	.635 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 30000	e4	166 MHz	192		39.37 mm
5962-8994801MTA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0				17.272 mm
5962-8982301MYA	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	14 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0				27.432 mm
5962-9957201QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	6912	Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q	162	322970	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	322970 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.0226 mm	39.37 mm	Yes		e4		162		39.37 mm
5962-9473001MYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4				39.37 mm
XC3190A-5CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS		142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164	1	3.302 mm	28.702 mm	No	Typical gates = 5000-6000	e0	188 MHz	142		28.702 mm
XQVR600-4CBG228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	3456	CMOS			661111	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)		3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3				39.37 mm
XC3020-70CQ100ISPC0107	Xilinx	FPGA	Industrial	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.635 mm	85 °C (185 °F)	9 ns	64 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz			17.272 mm
5962-8982302MYA	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0				27.432 mm
XC3090-50CQ164CSPC0109	Xilinx	FPGA	Commercial	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.25 V	320	CMOS			9000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz			27.432 mm
XC4010-6CB196B	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS	MIL-STD-883 Class B	160	8000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	6 ns	400 CLBS, 8000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F196	1	3.302 mm	28.702 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	69 MHz	160		28.702 mm
XQV100-4CBG228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	2700	Yes	2.625 V	600	CMOS	MIL-PRF-38535	162	108904	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	600 CLBS, 108904 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3		162		39.37 mm
XC4005-10CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	196	CMOS	MIL-STD-883 Class B		4000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		196 CLBS, 4000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	616 flip-flops; typical gates = 4000-5000					28.702 mm
5962-8994802MMC	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4				19.05 mm
5962-9957501QZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	3136	CMOS	MIL-PRF-38535 Class Q		55000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No			200 MHz			39.37 mm
5962-9561101MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS	MIL-STD-883	142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	Typical gates = 5000-6000	e4	188 MHz	142		28.702 mm
5962-8994803MYA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0				17.272 mm
5962-8994802YA	Xilinx	FPGA	Military	Flat	100	QFF	Square				Yes	5.5 V	64	CMOS	MIL-STD-883		2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-XQFP-F100		3.68 mm	17.27 mm	No		e4	25 MHz			17.27 mm
5962-9851101QY	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2304	CMOS	MIL-PRF-38535		40000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 40000 to 130000		166 MHz			39.37 mm
5962-8971301QTA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS	MIL-PRF-38535 Class Q		4200	5		Flatpack			4.5 V		125 °C (257 °F)	14 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							50 MHz
5962-8971302M9C	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes			CMOS	MIL-STD-883	82		5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4	70 MHz	82		19.05 mm
5962-9230502MYC	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	6 ns		-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4				28.702 mm
5962-9851101QZB	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2304	CMOS	MIL-PRF-38535 Class Q		40000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 130000	e0	166 MHz			39.37 mm
XC3090-50CQ164B	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes	5.5 V	320	CMOS	38535Q/M;38534H;883B	142	9000	5	5 V	Flatpack	QFL164,1.2SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	14 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164	1	3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops	e0	50 MHz	142		27.432 mm
XC4025E-4CBG228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	1024	CMOS			15000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 15000-45000	e3	111 MHz			39.37 mm
5962-9957501QYX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	3136	CMOS	MIL-PRF-38535 Class Q		55000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No			200 MHz			39.37 mm
5962R9957301QYX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class Q		661111	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)		3456 CLBS, 661111 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	Yes						39.37 mm
XC3020-70CQ100ISPC0110	Xilinx	FPGA	Industrial	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.635 mm	85 °C (185 °F)	9 ns	64 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz			17.272 mm
XC3020-100CQ100CSPC0107	Xilinx	FPGA	Commercial	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.25 V	64	CMOS			2000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	7 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	100 MHz			17.272 mm
XC3020-70CQ100B	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes	5.5 V	64	CMOS	38535Q/M;38534H;883B	64	2000	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops	e0	70 MHz	64		17.272 mm
5962-9851301QYX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	576	CMOS	MIL-PRF-38535 Class Q		10000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 30000		166 MHz			39.37 mm
XC4010E-4CB196M	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS		160	7000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.7 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F196	1	3.302 mm	34.29 mm	No	Typical gates = 7000-20000	e0	111 MHz	160	225 °C (437 °F)	34.29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.