Flat Field Programmable Gate Arrays (FPGA) 542

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3042-70CQ100CSPC0107

Xilinx

FPGA

Commercial

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

144

CMOS

4200

5

Flatpack

4.75 V

.635 mm

70 °C (158 °F)

9 ns

144 CLBS, 4200 Gates

0 °C (32 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C

e0

70 MHz

17.272 mm

XC3090-50CQ164ISPC0109

Xilinx

FPGA

Industrial

Flat

164

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

320

CMOS

9000

5

Flatpack

4.5 V

.635 mm

85 °C (185 °F)

320 CLBS, 9000 Gates

-40 °C (-40 °F)

Quad

S-CQFP-F164

3.683 mm

27.432 mm

No

MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

50 MHz

27.432 mm

5962-8982303MYX

Xilinx

FPGA

Military

Flat

164

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack

.635 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQFP-F164

3.683 mm

27.432 mm

No

27.432 mm

5962-9473001MZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e4

39.37 mm

XC3090-70CQ164CSPC0109

Xilinx

FPGA

Commercial

Flat

164

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

320

CMOS

9000

5

Flatpack

4.75 V

.635 mm

70 °C (158 °F)

9 ns

320 CLBS, 9000 Gates

0 °C (32 °F)

Quad

S-CQFP-F164

3.683 mm

27.432 mm

No

MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

70 MHz

27.432 mm

5962-9851101QYB

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

2304

CMOS

MIL-PRF-38535 Class Q

40000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

2304 CLBS, 40000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 130000

e0

166 MHz

39.37 mm

XC3090-100CB164CSPC0107

Xilinx

FPGA

Other

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

320

CMOS

5000

5

Flatpack, Guard Ring

4.75 V

.65 mm

85 °C (185 °F)

7 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-CQFP-F164

2.921 mm

28.702 mm

No

928 flip-flops; typical gates = 5000-6000

e0

100 MHz

28.702 mm

XC3020-100CQ100C

Xilinx

FPGA

Commercial

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

64

Yes

5.25 V

64

CMOS

64

2000

5

5 V

Flatpack

QFL100,.7SQ,25

Field Programmable Gate Arrays

4.75 V

.635 mm

70 °C (158 °F)

7 ns

64 CLBS, 2000 Gates

0 °C (32 °F)

Quad

S-CQFP-F100

1

3.683 mm

17.272 mm

No

MAX 64 I/OS; 256 flip-flops

100 MHz

64

17.272 mm

5962-9851001QZC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

3078

Yes

3.6 V

1296

CMOS

MIL-PRF-38535 Class Q

192

22000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 65000

e4

166 MHz

192

39.37 mm

5962-9851001QZB

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

1296

CMOS

MIL-PRF-38535 Class Q

22000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 65000

e0

166 MHz

39.37 mm

XC3090-50CQ164I

Xilinx

FPGA

Industrial

Flat

164

QFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

5.5 V

320

CMOS

142

9000

5

5 V

Flatpack

QFL164,1.2SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

85 °C (185 °F)

320 CLBS, 9000 Gates

-40 °C (-40 °F)

Quad

S-CQFP-F164

1

3.683 mm

27.432 mm

No

MAX 142 I/OS; 928 flip-flops

50 MHz

142

27.432 mm

XC3020-50CQ100ISPC0110

Xilinx

FPGA

Industrial

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

64

CMOS

2000

5

Flatpack

4.5 V

.635 mm

85 °C (185 °F)

64 CLBS, 2000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

e0

50 MHz

17.272 mm

XC3090-100CB164M

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

320

CMOS

142

5000

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

7 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

1

2.921 mm

28.702 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

e0

100 MHz

142

28.702 mm

5962-9230503MZX

Xilinx

FPGA

Military

Flat

196

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQFP-F196

3.302 mm

28.702 mm

No

28.702 mm

5962-9851301QYC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

1368

Yes

3.6 V

576

CMOS

MIL-PRF-38535 Class Q

192

10000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 30000

e4

166 MHz

192

39.37 mm

XC3042-100CB100M

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

144

CMOS

82

2000

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

7 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

1

2.921 mm

19.05 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

e0

100 MHz

82

19.05 mm

5962-8971301M9C

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

CMOS

MIL-STD-883

82

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

50 MHz

82

19.05 mm

5962-9561002MZX

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

19.05 mm

5962-9471201MZC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

19.05 mm

5962-8994802QUA

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

64

CMOS

MIL-PRF-38535 Class Q

2000

5

Flatpack

4.5 V

125 °C (257 °F)

9 ns

64 CLBS, 2000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

70 MHz

5962-8971303MYC

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

5.5 V

CMOS

MIL-STD-883

82

4200

5

5 V

Flatpack

QFL100,.7SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

4200 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.683 mm

17.27 mm

No

e4

100 MHz

82

17.27 mm

XQ4036XL-3CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

3078

Yes

3.6 V

1296

CMOS

MIL-PRF-38535

192

22000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

1

3.302 mm

39.37 mm

No

Typical gates = 22000 to 65000

e0

166 MHz

192

39.37 mm

XC4005E-4CB164M

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

466

Yes

5.5 V

196

CMOS

112

3000

5

5 V

Flatpack, Guard Ring

TPAK164,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

2.7 ns

196 CLBS, 3000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

1

3.302 mm

28.702 mm

No

Typical gates = 3000-9000

e0

111 MHz

112

28.702 mm

XC3042-70CQ100ISPC0107

Xilinx

FPGA

Industrial

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

144

CMOS

4200

5

Flatpack

4.5 V

.635 mm

85 °C (185 °F)

9 ns

144 CLBS, 4200 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C

e0

70 MHz

17.272 mm

5962-8994801MTX

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

64

Yes

CMOS

MIL-STD-883

64

5

5 V

Flatpack

QFL100,.7SQ,25

Field Programmable Gate Arrays

.635 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

e0

50 MHz

64

17.272 mm

XC3020-70CQ100CSPC0110

Xilinx

FPGA

Commercial

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

64

CMOS

2000

5

Flatpack

4.75 V

.635 mm

70 °C (158 °F)

9 ns

64 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

e0

70 MHz

17.272 mm

5962R9957201QYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

1536

CMOS

MIL-PRF-38535 Class Q

322970

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

Yes

39.37 mm

XC4025E-4CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

2432

Yes

5.5 V

1024

CMOS

192

15000

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

1024 CLBS, 15000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Typical gates = 15000-45000

e0

111 MHz

192

39.37 mm

XQ4013E-4CB228B

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic

1368

Yes

576

CMOS

38535Q/M;38534H;883B

192

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

.635 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-XQFP-F228

39.37 mm

No

e0

111 MHz

192

39.37 mm

5962-9752301QYC

Xilinx

FPGA

Military

Flat

196

GQFF

Square

Ceramic, Metal-Sealed Cofired

950

Yes

5.5 V

400

CMOS

MIL-PRF-38535 Class Q

160

7000

5

5 V

Flatpack, Guard Ring

TPAK196,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

400 CLBS, 7000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F196

3.302 mm

34.29 mm

No

Typical gates = 7000-20000

e4

111 MHz

160

34.29 mm

XQVR300-4CBG228Q

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

1536

CMOS

MIL-PRF-38535 Class Q

322970

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Matte Tin

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e3

39.37 mm

XC3042-50CQ100I

Xilinx

FPGA

Industrial

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

5.5 V

144

CMOS

82

4200

5

5 V

Flatpack

QFL100,.7SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

85 °C (185 °F)

144 CLBS, 4200 Gates

-40 °C (-40 °F)

Quad

S-CQFP-F100

1

3.683 mm

17.272 mm

No

MAX 82 I/OS; 480 flip-flops

50 MHz

82

17.272 mm

XQVR600-4CB228V

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

15552

Yes

2.625 V

3456

CMOS

316

661111

2.5

1.5/3.3,2.5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

2.375 V

.635 mm

125 °C (257 °F)

3456 CLBS, 661111 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e0

316

39.37 mm

XC3020-50CQ100ISPC0107

Xilinx

FPGA

Industrial

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

64

CMOS

2000

5

Flatpack

4.5 V

.635 mm

85 °C (185 °F)

64 CLBS, 2000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

e0

50 MHz

17.272 mm

5962-9752501QZC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

2432

Yes

5.5 V

1024

CMOS

MIL-PRF-38535 Class Q

192

15000

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

1024 CLBS, 15000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Typical gates = 15000-45000

e4

192

39.37 mm

XC3090-70CB164C

Xilinx

FPGA

Other

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

5.25 V

320

CMOS

142

5000

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

9 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Quad

S-CQFP-F164

1

2.921 mm

28.702 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

70 MHz

142

28.702 mm

5962-9225201MZC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

28.702 mm

5962-8971301MMC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

CMOS

MIL-STD-883

82

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

50 MHz

82

19.05 mm

5962-8971303MYX

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack

.635 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

e0

17.272 mm

5962-9473001MYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e4

39.37 mm

XC3020-70CB100CSPC0107

Xilinx

FPGA

Other

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

64

CMOS

1000

5

Flatpack, Guard Ring

4.75 V

.65 mm

85 °C (185 °F)

9 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

256 flip-flops; typical gates = 1000-1500

e0

70 MHz

19.05 mm

5962-9752201QZX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

196

MIL-PRF-38535 Class Q

3000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

196 CLBS, 3000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

Typical gates = 3000-9000

28.702 mm

5962-9752301QYX

Xilinx

FPGA

Military

Flat

196

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

400

MIL-PRF-38535 Class Q

7000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

400 CLBS, 7000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F196

3.302 mm

34.29 mm

No

Typical gates = 7000-20000

34.29 mm

XC3090-70CQ164BSPC0107

Xilinx

FPGA

Military

Flat

164

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

320

CMOS

9000

5

Flatpack

4.5 V

.635 mm

125 °C (257 °F)

9 ns

320 CLBS, 9000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F164

3.683 mm

27.432 mm

No

MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

70 MHz

27.432 mm

5962R9957201QYC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

6912

Yes

2.625 V

1536

CMOS

MIL-PRF-38535 Class Q

162

322970

2.5

1.2/3.6,2.5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

322970 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.0226 mm

39.37 mm

Yes

e4

162

39.37 mm

XC4003A-10CB100M

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

100

CMOS

2500

5

Flatpack, Guard Ring

4.5 V

.65 mm

125 °C (257 °F)

100 CLBS, 2500 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

360 flip-flops; typical gates = 2500-3000

19.05 mm

XC3195A-5CB164B

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

484

Yes

484

CMOS

38535Q/M;38534H;883B

176

6500

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

4.1 ns

484 CLBS, 6500 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F164

1

3.302 mm

28.702 mm

No

Typical gates = 6500-7500

188 MHz

176

28.702 mm

5962-9471201MZX

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

238

Yes

CMOS

MIL-STD-883

77

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

50 MHz

77

19.05 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.