Flat Field Programmable Gate Arrays (FPGA) 542

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5962-8971301MMX

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

19.05 mm

5962-9225201MYC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

466

Yes

CMOS

MIL-STD-883

112

5

5 V

Flatpack, Guard Ring

TPAK164,2.5SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

112

28.702 mm

5962-8994803MNX

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

7 ns

-55 °C (-67 °F)

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

19.05 mm

XC3142A-5CB100M

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

144

CMOS

82

2000

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

4.1 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

1

3.429 mm

19.05 mm

No

Typical gates = 2000-3000

e0

188 MHz

82

19.05 mm

5962-8982301MTX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

28.702 mm

5962-8994803MMX

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

19.05 mm

XC4010-6CB196M

Xilinx

FPGA

Military

Flat

196

GQFF

Square

Ceramic, Metal-Sealed Cofired

950

Yes

5.5 V

400

CMOS

160

8000

5

5 V

Flatpack, Guard Ring

TPAK196,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.65 mm

125 °C (257 °F)

6 ns

400 CLBS, 8000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F196

1

2.921 mm

34.29 mm

No

1120 flip-flops; typical gates = 8000-10000

e0

90.9 MHz

160

34.29 mm

5962-8994801YC

Xilinx

FPGA

Military

Flat

100

QFF

Square

Yes

5.5 V

64

CMOS

MIL-STD-883

2000

5

Flatpack

4.5 V

.635 mm

125 °C (257 °F)

14 ns

64 CLBS, 2000 Gates

-55 °C (-67 °F)

Gold

Quad

S-XQFP-F100

3.68 mm

17.27 mm

No

e4

16 MHz

17.27 mm

5962-9850901QYC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

2432

Yes

5.5 V

CMOS

MIL-PRF-38535 Class Q

192

28000

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

2.2 ns

28000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.0226 mm

39.68 mm

No

e4

143 MHz

192

39.68 mm

5962-9561101MZC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

CMOS

MIL-STD-883

142

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

190 MHz

142

28.702 mm

5962-8971302QTX

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

144

CMOS

MIL-PRF-38535 Class Q

4200

5

Flatpack

4.5 V

125 °C (257 °F)

9 ns

144 CLBS, 4200 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

70 MHz

5962-9851001QYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

1296

CMOS

MIL-PRF-38535 Class Q

22000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 65000

166 MHz

39.37 mm

5962-9851101QZC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

5472

Yes

3.6 V

2304

CMOS

MIL-PRF-38535 Class Q

192

40000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

2304 CLBS, 40000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 130000

e4

166 MHz

192

39.37 mm

XQ4013E-4CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

1368

Yes

5.5 V

576

CMOS

MIL-PRF-38535

192

10000

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

2.7 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates = 30000

e0

111 MHz

192

39.37 mm

XC3042-70CB100BSPC0107

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

144

CMOS

2000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

9 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

480 flip-flops; typical gates = 2000-3000

70 MHz

19.05 mm

5962-8982303MZX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

7 ns

-55 °C (-67 °F)

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

28.702 mm

XC3190A-5CB164B

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

320

CMOS

38535Q/M;38534H;883B

142

5000

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

4.1 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

Typical gates = 5000-6000

e0

188 MHz

142

28.702 mm

5962-9561001MYX

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

144

CMOS

MIL-STD-883

2000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

4.1 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

Typical gates = 2000-3000

e4

188 MHz

19.05 mm

XC3090-50CQ164BSPC0109

Xilinx

FPGA

Military

Flat

164

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

320

CMOS

9000

5

Flatpack

4.5 V

.635 mm

125 °C (257 °F)

320 CLBS, 9000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F164

3.683 mm

27.432 mm

No

MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

50 MHz

27.432 mm

5962-9752501QZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

1024

MIL-PRF-38535 Class Q

15000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

1024 CLBS, 15000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Typical gates = 15000-45000

39.37 mm

5962-9850901QYX

Xilinx

FPGA

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

MIL-PRF-38535 Class Q

3.3

Flatpack, Guard Ring

3 V

.635 mm

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

39.37 mm

XQVR300-4CB228V

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

6912

Yes

2.625 V

1536

CMOS

316

322970

2.5

1.5/3.3,2.5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

2.375 V

.635 mm

125 °C (257 °F)

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e0

316

39.37 mm

XC3020-100CQ100CSPC0110

Xilinx

FPGA

Commercial

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

64

CMOS

2000

5

Flatpack

4.75 V

.635 mm

70 °C (158 °F)

7 ns

64 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

e0

100 MHz

17.272 mm

XC4028EX-4CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

1024

CMOS

18000

3.3

Flatpack, Guard Ring

3 V

.65 mm

125 °C (257 °F)

1024 CLBS, 18000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

39.37 mm

5962-9561001MZC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

CMOS

MIL-STD-883

82

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

190 MHz

82

19.05 mm

5962-9230502MZC

Xilinx

FPGA

Military

Flat

196

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

400

CMOS

MIL-STD-883

8000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

400 CLBS, 8000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F196

3.302 mm

28.702 mm

No

e4

28.702 mm

5962-8982302MTC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

CMOS

MIL-STD-883

142

5

5 V

Flatpack, Guard Ring

TPAK164,2.5SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

70 MHz

142

28.702 mm

XC3120A-5CB100B

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

64

Yes

64

CMOS

38535Q/M;38534H;883B

64

1300

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

4.1 ns

64 CLBS, 1300 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

1

2.921 mm

19.05 mm

No

MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800

190 MHz

64

19.05 mm

XC3042-50CQ100MSPC0107

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

144

CMOS

4200

5

Flatpack

4.5 V

.635 mm

125 °C (257 °F)

144 CLBS, 4200 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C

e0

50 MHz

17.272 mm

5962R9957301QZC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

15552

Yes

2.625 V

3456

CMOS

MIL-PRF-38535 Class Q

162

661111

2.5

1.2/3.6,2.5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

661111 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.0226 mm

39.37 mm

Yes

e4

162

39.37 mm

XC3142-5CB100B

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

144

CMOS

38535Q/M;38534H;883B

82

3000

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

4.1 ns

144 CLBS, 3000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

1

2.921 mm

19.05 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

190 MHz

82

19.05 mm

XC3190A-4CB164B

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

320

CMOS

MIL-STD-883 Class B

5000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

3.3 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e0

28.702 mm

5962-9561102MZX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

28.702 mm

XQ4062XL-3CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

5472

Yes

3.6 V

2304

CMOS

MIL-PRF-38535

192

40000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

2304 CLBS, 40000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

1

3.302 mm

39.37 mm

No

Typical gates = 40000 to 130000

e0

166 MHz

192

39.37 mm

5962-9957501QZB

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

3136

CMOS

MIL-PRF-38535 Class Q

55000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.3 ns

3136 CLBS, 55000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e0

200 MHz

39.37 mm

XC3020-50CQ100C

Xilinx

FPGA

Commercial

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

64

Yes

5.25 V

64

CMOS

64

2000

5

5 V

Flatpack

QFL100,.7SQ,25

Field Programmable Gate Arrays

4.75 V

.635 mm

70 °C (158 °F)

64 CLBS, 2000 Gates

0 °C (32 °F)

Quad

S-CQFP-F100

1

3.683 mm

17.272 mm

No

MAX 64 I/OS; 256 flip-flops

50 MHz

64

17.272 mm

5962-9851001QYB

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

1296

CMOS

MIL-PRF-38535 Class Q

22000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 65000

e0

166 MHz

39.37 mm

XC3020-50CQ100M

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

64

Yes

5.5 V

64

CMOS

64

2000

5

5 V

Flatpack

QFL100,.7SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

64 CLBS, 2000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

1

3.683 mm

17.272 mm

No

MAX 64 I/OS; 256 flip-flops

50 MHz

64

17.272 mm

XQR4013XL-3CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

60k Rad(Si)

Ceramic, Metal-Sealed Cofired

1368

Yes

3.6 V

576

CMOS

192

10000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

1

3.302 mm

39.37 mm

No

Typical gates = 10000 to 30000

e0

166 MHz

192

39.37 mm

5962-9851001QX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

1296

CMOS

MIL-PRF-38535

22000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Typical gates = 22000 to 65000

166 MHz

39.37 mm

5962-8971302MMC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

CMOS

MIL-STD-883

82

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

70 MHz

82

19.05 mm

5962-8994801MNC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

19.05 mm

XC3190-5CB164B

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

320

CMOS

38535Q/M;38534H;883B

142

5000

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

4.1 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F164

1

2.921 mm

28.702 mm

No

MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500

190 MHz

142

28.702 mm

XQVR300-4CBG228V

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

1536

CMOS

322970

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Matte Tin

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e3

39.37 mm

5962-9561201MYX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

484

CMOS

MIL-STD-883

6500

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

4.1 ns

484 CLBS, 6500 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

Typical gates = 6500-7500

e4

188 MHz

28.702 mm

XC3020-70CB100BSPC0107

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

64

CMOS

1000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

9 ns

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

256 flip-flops; typical gates = 1000-1500

70 MHz

19.05 mm

5962-8994804QUX

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

64

CMOS

MIL-PRF-38535 Class Q

2000

5

Flatpack

4.5 V

125 °C (257 °F)

5.5 ns

64 CLBS, 2000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

125 MHz

XC3020-50CQ100MSPC0107

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

64

CMOS

2000

5

Flatpack

4.5 V

.635 mm

125 °C (257 °F)

64 CLBS, 2000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

e0

50 MHz

17.272 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.