Pin/Peg Field Programmable Gate Arrays (FPGA) 1,265

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3142-3PP132I

Xilinx

FPGA

Industrial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

144

No

CMOS

96

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Perpendicular

S-PPGA-P132

No

96

XC4052XL-3PG411C

Xilinx

FPGA

Other

Pin/Peg

411

HPGA

Square

Ceramic, Metal-Sealed Cofired

1936

No

3.6 V

1936

CMOS

352

33000

3.3

3.3 V

Grid Array, Heat Sink/Slug

SPGA411,39X39

Field Programmable Gate Arrays

3 V

2.54 mm

85 °C (185 °F)

1.6 ns

1936 CLBS, 33000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P411

5.969 mm

52.324 mm

No

Max usable 52000 Logic gates

166 MHz

352

52.324 mm

XC3042A-6PP132C

Xilinx

FPGA

Other

Pin/Peg

132

PGA

Square

Plastic/Epoxy

144

No

5.25 V

144

CMOS

96

2000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4.1 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P132

1

4.191 mm

37.084 mm

No

Typical gates = 2000-3000

135 MHz

96

37.084 mm

XC40150XV-08PG559C

Xilinx

FPGA

Other

Pin/Peg

559

HIPGA

Square

Ceramic, Metal-Sealed Cofired

5184

No

2.7 V

5184

CMOS

448

100000

2.5

2.5,3.3 V

Grid Array, Heat Sink/Slug, Interstitial Pitch

HSPGA559,43X43

Field Programmable Gate Arrays

2.3 V

2.54 mm

85 °C (185 °F)

1.1 ns

5184 CLBS, 100000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P559

5.969 mm

57.404 mm

No

Can also use 300000 gates

258 MHz

448

57.404 mm

XC40250XV-9PG559C

Xilinx

FPGA

Other

Pin/Peg

559

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

2.7 V

8464

CMOS

180000

2.5

Grid Array, Heat Sink/Slug, Interstitial Pitch

2.3 V

2.54 mm

85 °C (185 °F)

1.2 ns

8464 CLBS, 180000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P559

5.334 mm

57.404 mm

No

188 MHz

57.404 mm

XC3142-3PG132I

Xilinx

FPGA

Industrial

Pin/Peg

132

PGA

Square

Ceramic

144

No

CMOS

96

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Perpendicular

S-XPGA-P132

No

96

XC3142-2PG84I

Xilinx

FPGA

Pin/Peg

84

PGA

Square

Ceramic

144

No

CMOS

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

Perpendicular

S-XPGA-P84

No

323 MHz

74

XC4005-4PG156C

Xilinx

FPGA

Other

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

196

No

5.25 V

196

CMOS

112

4000

5

5 V

Grid Array

PGA156,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4 ns

196 CLBS, 4000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P156

3.683 mm

42.164 mm

No

616 flip-flops; typical gates = 4000-5000

133.3 MHz

112

42.164 mm

XC3042-100PG84BSPC0107

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

144

CMOS

2000

5

Grid Array

2.54 mm

125 °C (257 °F)

7 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

480 flip-flops; typical gates = 2000-3000

e3

100 MHz

27.94 mm

XC3195-4PG175I

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

5.5 V

484

CMOS

144

6500

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

3.3 ns

484 CLBS, 6500 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000

230 MHz

144

42.164 mm

XC3195A-4PG175I

Xilinx

FPGA

Pin/Peg

175

HPGA

Square

Ceramic, Metal-Sealed Cofired

484

No

5.5 V

484

CMOS

144

6500

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

3.3 ns

484 CLBS, 6500 Gates

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

Max usable 7500 Logic gates

227 MHz

144

42.164 mm

XC3030-70PG84ISPC0107

Xilinx

FPGA

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

100

CMOS

1500

5

Grid Array

4.5 V

2.54 mm

9 ns

100 CLBS, 1500 Gates

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

360 flip-flops; typical gates = 1500-2000

e3

70 MHz

27.94 mm

XC4020E-1PGG223M

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

784

CMOS

13000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

784 CLBS, 13000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

e3

166 MHz

47.244 mm

XC4028EX-3PG299C

Xilinx

FPGA

Other

Pin/Peg

299

HPGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

1024

CMOS

256

18000

5

5 V

Grid Array, Heat Sink/Slug

PGA299,20X20

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

1024 CLBS, 18000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

Max usable 28000 Logic gates

166 MHz

256

52.324 mm

XC3042-50PG84BSPC0107

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

144

CMOS

2000

5

Grid Array

2.54 mm

125 °C (257 °F)

14 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

480 flip-flops; typical gates = 2000-3000

50 MHz

27.94 mm

XC4013-5PG233I

Xilinx

FPGA

Industrial

Pin/Peg

223

PGA

Square

Ceramic

1368

No

CMOS

192

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Perpendicular

S-XPGA-P223

No

133.3 MHz

192

XC3120A-2PG84I

Xilinx

FPGA

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.5 V

64

CMOS

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

2.2 ns

64 CLBS, 1000 Gates

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1000-1500

323 MHz

64

27.94 mm

5962-8971301MZX

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

MIL-STD-883

5

Grid Array

2.54 mm

125 °C (257 °F)

14 ns

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

e4

37.084 mm

XC4010E-1PG191I

Xilinx

FPGA

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

400

CMOS

7000

5

Grid Array

4.5 V

2.54 mm

400 CLBS, 7000 Gates

Matte Tin

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

e3

166 MHz

47.244 mm

5962-9225201MXX

Xilinx

FPGA

Military

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

No

196

CMOS

4000

5

Grid Array

2.54 mm

125 °C (257 °F)

196 CLBS, 4000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

42.164 mm

XC3130A-4PG84C

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

1500

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

3.3 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1500-2000

227 MHz

74

27.94 mm

XC5204-6PG156C

Xilinx

FPGA

Other

Pin/Peg

156

HPGA

Square

Ceramic, Metal-Sealed Cofired

120

No

5.25 V

120

CMOS

124

4000

5

5 V

Grid Array, Heat Sink/Slug

PGA156,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

5.6 ns

120 CLBS, 4000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

MAX available 6000 Logic gates

83 MHz

124

42.164 mm

XC3090-100PG175MSPC0107

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

320

CMOS

5000

5

Grid Array

2.54 mm

125 °C (257 °F)

7 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000

100 MHz

42.164 mm

XC4005-6PG156B

Xilinx

FPGA

Military

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

196

No

5.5 V

196

CMOS

MIL-STD-883 Class B

112

4000

5

5 V

Grid Array

PGA156,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

125 °C (257 °F)

6 ns

196 CLBS, 4000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

616 flip-flops; typical gates = 4000-5000

90.9 MHz

112

42.164 mm

XC4008E-2PG191I

Xilinx

FPGA

Pin/Peg

191

HPGA

Square

Ceramic, Metal-Sealed Cofired

324

No

5.5 V

324

CMOS

144

6000

5

5 V

Grid Array, Heat Sink/Slug

PGA191M,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

1.6 ns

324 CLBS, 6000 Gates

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

Max usable 8000 Logic gates

125 MHz

144

47.244 mm

5962-01-397-0210

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic

224

No

CMOS

110

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Perpendicular

S-XPGA-P132

No

70 MHz

110

XC4010E-3PG225C

Xilinx

FPGA

Other

Pin/Peg

225

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

400

7000

5

Grid Array

4.75 V

85 °C (185 °F)

2 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P225

No

Can also use 20000 gates

e3

125 MHz

XC3064A-7PG132C

Xilinx

FPGA

Other

Pin/Peg

132

HPGA

Square

Ceramic, Metal-Sealed Cofired

224

No

5.25 V

224

CMOS

110

3500

5

5 V

Grid Array, Heat Sink/Slug

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

5.1 ns

224 CLBS, 3500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

Max usable 4500 Logic gates

113 MHz

110

37.084 mm

5962-8971303MXC

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.5 V

CMOS

MIL-STD-883

74

4200

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

125 °C (257 °F)

7 ns

4200 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

e4

100 MHz

74

27.94 mm

XC4010-6PG191B

Xilinx

FPGA

Military

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

400

No

5.5 V

400

CMOS

MIL-STD-883 Class B

160

8000

5

5 V

Grid Array

PGA191M,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

125 °C (257 °F)

6 ns

400 CLBS, 8000 Gates

-55 °C (-67 °F)

Tin Silver Copper

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

1120 flip-flops; typical gates = 8000-10000

e1

69 MHz

160

47.244 mm

XC4028EX-1PG299C

Xilinx

FPGA

Other

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

1024

CMOS

18000

5

Grid Array

4.75 V

2.54 mm

85 °C (185 °F)

1024 CLBS, 18000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

52.324 mm

XC3064-100PG132MSPC0107

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

No

224

CMOS

3500

5

Grid Array

2.54 mm

125 °C (257 °F)

7 ns

224 CLBS, 3500 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

688 flip-flops; typical gates = 3500-4500

100 MHz

37.084 mm

XC3190A-3PGG175I

Xilinx

FPGA

Pin/Peg

175

HPGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

320

CMOS

5000

5

Grid Array, Heat Sink/Slug

4.5 V

2.54 mm

2.7 ns

320 CLBS, 5000 Gates

Perpendicular

S-CPGA-P175

42.164 mm

Max usable 6000 Logic gates

270 MHz

42.164 mm

XC3195A-09PG175C

Xilinx

FPGA

Other

Pin/Peg

175

HPGA

Square

Ceramic, Metal-Sealed Cofired

484

No

5.25 V

484

CMOS

144

6500

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

1.5 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

Max usable 7500 Logic gates

370 MHz

144

42.164 mm

XC3142A-3PP132C

Xilinx

FPGA

Other

Pin/Peg

132

PGA

Square

Plastic/Epoxy

144

No

5.25 V

144

CMOS

96

2000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

2.7 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P132

1

4.191 mm

37.084 mm

No

Typical gates = 2000-3000

270 MHz

96

37.084 mm

XC4010E-3PGG191M

Xilinx

FPGA

Military

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

400

CMOS

7000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

400 CLBS, 7000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

e3

125 MHz

47.244 mm

XC4008E-3PGG191M

Xilinx

FPGA

Military

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

324

CMOS

6000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

324 CLBS, 6000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

e3

125 MHz

47.244 mm

XC3142A-5PG132M

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

144

CMOS

96

2000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

4.1 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

Typical gates = 2000-3000

188 MHz

96

37.084 mm

XC4062XL-08PG475C

Xilinx

FPGA

Other

Pin/Peg

475

HIPGA

Square

Ceramic, Metal-Sealed Cofired

2304

No

3.6 V

2304

CMOS

384

40000

3.3

3.3 V

Grid Array, Heat Sink/Slug, Interstitial Pitch

SPGA475,41X41

Field Programmable Gate Arrays

3 V

2.54 mm

85 °C (185 °F)

1.1 ns

2304 CLBS, 40000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P475

5.969 mm

54.864 mm

No

Typical gates = 40000-130000

238 MHz

384

54.864 mm

XC4008E-4PG191M

Xilinx

FPGA

Military

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

324

No

5.5 V

324

CMOS

144

6000

5

5 V

Grid Array

PGA191M,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

125 °C (257 °F)

324 CLBS, 6000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

111 MHz

144

47.244 mm

XC2064-33PG68I

Xilinx

FPGA

Industrial

Pin/Peg

68

PGA

Square

Ceramic

64

No

CMOS

58

5

5 V

Grid Array

PGA68,11X11

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Perpendicular

S-XPGA-P68

No

33 MHz

58

XC3090-70PP175ISPC0107

Xilinx

FPGA

Pin/Peg

175

PGA

Square

Plastic/Epoxy

No

5.5 V

320

CMOS

5000

5

Grid Array

4.5 V

2.54 mm

9 ns

320 CLBS, 5000 Gates

Perpendicular

S-PPGA-P175

3.937 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000

70 MHz

42.164 mm

XC4052XL-1PG411C

Xilinx

FPGA

Other

Pin/Peg

411

HPGA

Square

Ceramic, Metal-Sealed Cofired

1936

No

3.6 V

1936

CMOS

352

33000

3.3

3.3 V

Grid Array, Heat Sink/Slug

SPGA411,39X39

Field Programmable Gate Arrays

3 V

2.54 mm

85 °C (185 °F)

1.3 ns

1936 CLBS, 33000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P411

5.969 mm

52.324 mm

No

Max usable 52000 Logic gates

200 MHz

352

52.324 mm

XC3090-100PG175CSPC0109

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

320

CMOS

9000

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

7 ns

320 CLBS, 9000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.5052 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

100 MHz

42.164 mm

XC4025E-4PGG223M

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

784

CMOS

13000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

784 CLBS, 13000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

e3

111 MHz

47.244 mm

5962-01-395-2614

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

224

No

CMOS

110

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

S-PPGA-P132

No

70 MHz

110

XQ4085XL-1PG475M

Xilinx

FPGA

Military

Pin/Peg

475

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

3.6 V

3136

CMOS

MIL-PRF-38535

55000

3.3

Grid Array, Heat Sink/Slug, Interstitial Pitch

3 V

2.54 mm

125 °C (257 °F)

1.3 ns

3136 CLBS, 55000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P475

5.969 mm

54.864 mm

No

Typical gates = 55000 to 180000

e3

200 MHz

54.864 mm

5962-9851301QXA

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

3.6 V

576

CMOS

10000

3.3

Grid Array

3 V

2.54 mm

125 °C (257 °F)

1.6 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

e0

166 MHz

47.244 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.