Pin/Peg Field Programmable Gate Arrays (FPGA) 1,265

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
XC3190A-2PGG175I	Xilinx	FPGA		Pin/Peg	175	HPGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	320	CMOS			5000	5		Grid Array, Heat Sink/Slug			4.5 V	2.54 mm		2.2 ns	320 CLBS, 5000 Gates			Perpendicular	S-CPGA-P175			42.164 mm		Max usable 6000 Logic gates		323 MHz		42.164 mm
XC3164-5PG132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	224	No	5.25 V	224	CMOS		110	4000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4.1 ns	224 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500		190 MHz	110	37.084 mm
XC4044XL-09PG411C	Xilinx	FPGA	Other	Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired	1600	No	3.6 V	1600	CMOS		320	27000	3.3	3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	SPGA411,39X39	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.2 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P411		5.969 mm	52.324 mm	No	Typical gates = 27000-80000		217 MHz	320	52.324 mm
XC3030-100PG84MSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		100	CMOS			1500	5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns	100 CLBS, 1500 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	360 flip-flops; typical gates = 1500-2000	e3	100 MHz		27.94 mm
XC3042A-6PG84C	Xilinx	FPGA	Other	Pin/Peg	84	HPGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS		74	2000	5	5 V	Grid Array, Heat Sink/Slug	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Max usable 3000 Logic gates		135 MHz	74	27.94 mm
XC3064-100PG132ISPC0107	Xilinx	FPGA		Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	224	CMOS			3500	5		Grid Array			4.5 V	2.54 mm		7 ns	224 CLBS, 3500 Gates			Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500		100 MHz		37.084 mm
XC3064-50PG132ISPC0107	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	224	CMOS			6400	5		Grid Array			4.5 V	2.54 mm	85 °C (185 °F)		224 CLBS, 6400 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		50 MHz		37.084 mm
XC3130A-5PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.25 V	100	CMOS		74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1500-2000		188 MHz	74	27.94 mm
XC4036XL-2PG411C	Xilinx	FPGA	Other	Pin/Peg	411	HPGA	Square	Ceramic, Metal-Sealed Cofired	1296	No	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Grid Array, Heat Sink/Slug	SPGA411,39X39	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.5 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P411		5.969 mm	52.324 mm	No	Max usable 36000 Logic gates		179 MHz	288	52.324 mm
XC4005A-6PG156C	Xilinx	FPGA	Other	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.25 V	196	CMOS		112	4000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	6 ns	196 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P156		3.683 mm	42.164 mm	No	616 flip-flops; typical gates = 4000-5000		90.9 MHz	112	42.164 mm
5962-9957501QXC	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	3136	CMOS	MIL-PRF-38535 Class Q		55000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P475		5.969 mm	54.864 mm	No		e4	200 MHz		54.864 mm
XC3190A-2PP175C	Xilinx	FPGA	Other	Pin/Peg	175	HPGA	Square	Plastic/Epoxy	320	No	5.25 V	320	CMOS		144	5000	5	5 V	Grid Array, Heat Sink/Slug	PGA175,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2.2 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P175		4.191 mm	42.164 mm	No	Max usable 6000 Logic gates		323 MHz	144	42.164 mm
XC4044XL-09CPG411C	Xilinx	FPGA	Other	Pin/Peg	411	HPGA	Square	Ceramic, Metal-Sealed Cofired	3800	No	3.6 V	1600	CMOS		320	27000	3.3	3.3 V	Grid Array, Heat Sink/Slug	SPGA411,39X39	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.2 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P411		5.969 mm	52.324 mm	No	Max usable 44000 Logic gates		217 MHz	320	52.324 mm
XC3064-50PP132CSPC0107	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.25 V	224	CMOS			6400	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		224 CLBS, 6400 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132		4.191 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		50 MHz		37.084 mm
XC3195-4PG223C	Xilinx	FPGA	Commercial	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.25 V	484	CMOS		176	6500	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	3.3 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P223	1	4.064 mm	47.244 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000	e0	230 MHz	176	47.244 mm
5962-9561202MXX	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No		e4			42.164 mm
XC5206L-4PG191C	Xilinx	FPGA		Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	196	CMOS			6000	3.3		Grid Array			3 V	2.54 mm			196 CLBS, 6000 Gates			Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	Typical gates = 6000-10000				47.244 mm
XC5202-5PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.25 V	64	CMOS		84	2000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	MAX available 3000 Logic gates		83 MHz	84	42.164 mm
XQ4085XL-3PG475M	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	3136				55000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	2.9 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P475		5.969 mm	54.864 mm	No	Maximum usable gates 180000	e0	166 MHz		54.864 mm
XC4025E-4PG299B	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired	1024	No	5.5 V	1024	CMOS	MIL-STD-883 Class B	256	15000	5	5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.7 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Typical gates = 15000-45000	e0	111 MHz	256	52.324 mm
XC3142A-5PP132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No	5.25 V	144	CMOS		96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	Typical gates = 2000-3000		188 MHz	96	37.084 mm
5962-8971303MZC	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.5 V		CMOS	MIL-STD-883	96	4200	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	7 ns	4200 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No		e4	100 MHz	96	37.084 mm
XC3064-50PG132CSPC0107	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	224	CMOS			6400	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		224 CLBS, 6400 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		50 MHz		37.084 mm
XC4025E-3PG299I	Xilinx	FPGA		Pin/Peg	299	HPGA	Square	Ceramic, Metal-Sealed Cofired	1024	No	5.5 V	1024	CMOS		256	15000	5	5 V	Grid Array, Heat Sink/Slug	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm		2 ns	1024 CLBS, 15000 Gates			Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Max usable 25000 Logic gates		125 MHz	256	52.324 mm
XC5210-6PG223C	Xilinx	FPGA	Other	Pin/Peg	223	HPGA	Square	Ceramic, Metal-Sealed Cofired	324	No	5.25 V	324	CMOS		196	10000	5	5 V	Grid Array, Heat Sink/Slug	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	5.6 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P223	1	4.318 mm	47.244 mm	No	MAX available 16000 Logic gates	e0	83 MHz	196	47.244 mm
XC4036EX-1PG411C	Xilinx	FPGA	Other	Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	1296	CMOS			22000	5		Grid Array, Heat Sink/Slug, Interstitial Pitch			4.75 V	2.54 mm	85 °C (185 °F)		1296 CLBS, 22000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P411		5.334 mm	52.324 mm	No					52.324 mm
5962-9561001MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		144	CMOS	MIL-STD-883		2000	5		Grid Array				2.54 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 2000-3000	e4	188 MHz		27.94 mm
5962-8994801MXC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		64	CMOS	MIL-STD-883		1000	5		Grid Array				2.54 mm	125 °C (257 °F)		64 CLBS, 1000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4			27.94 mm
XC3020-100PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.25 V	64	CMOS		64	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	7 ns	64 CLBS, 1000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA		100 MHz	64	27.94 mm
XC4028XL-09CPG299C	Xilinx	FPGA	Other	Pin/Peg	299	HPGA	Square	Ceramic, Metal-Sealed Cofired	2432	No	3.6 V	1024	CMOS		256	18000	3.3	3.3 V	Grid Array, Heat Sink/Slug	PGA299,20X20	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.2 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Max usable 28000 Logic gates		217 MHz	256	52.324 mm
5962-9851001QXX	Xilinx	FPGA	Military	Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	1296	CMOS	MIL-PRF-38535 Class Q		22000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P411		5.334 mm	52.324 mm	No			166 MHz		52.324 mm
XC4020E-2PGG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e3	125 MHz		47.244 mm
XC5210-3PG223C	Xilinx	FPGA	Other	Pin/Peg	223	HPGA	Square	Ceramic, Metal-Sealed Cofired	324	No	5.25 V	324	CMOS		196	10000	5	5 V	Grid Array, Heat Sink/Slug	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	3 ns	324 CLBS, 10000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P223	1	4.318 mm	47.244 mm	No	MAX available 16000 Logic gates		83 MHz	196	47.244 mm
XC4005E-1PG156I	Xilinx	FPGA		Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.5 V	196	CMOS		112	3000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm			196 CLBS, 3000 Gates		Matte Tin	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No		e3	166 MHz	112	42.164 mm
XC40150XV-9PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	5184	CMOS			100000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm	85 °C (185 °F)	1.2 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P559		5.334 mm	57.404 mm	No			188 MHz		57.404 mm
5962-9225202MXC	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired	466	No		196	CMOS	MIL-STD-883	112	4000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	6 ns	196 CLBS, 4000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No		e4		112	42.164 mm
XC4036EX-3PG411C	Xilinx	FPGA	Other	Pin/Peg	411	HPGA	Square	Ceramic, Metal-Sealed Cofired	1296	No		1296	CMOS		288	22000	5	5 V	Grid Array, Heat Sink/Slug	SPGA411,39X39	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)		1296 CLBS, 22000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P411		5.969 mm	52.324 mm	No	Max usable 36000 Logic gates		166 MHz	288	52.324 mm
XC5215-5PQ299I	Xilinx	FPGA		Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	484				15000	5		Grid Array			4.5 V	2.54 mm		4.6 ns	484 CLBS, 15000 Gates		Tin Lead	Perpendicular	S-CPGA-P299		4.2418 mm	52.324 mm	No	23000 Logic gates can also be used	e0	42 MHz		52.324 mm
XC4005A-5PG156C	Xilinx	FPGA	Other	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.25 V	196	CMOS		112	4000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.5 ns	196 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P156		3.683 mm	42.164 mm	No	616 flip-flops; typical gates = 4000-5000		133.3 MHz	112	42.164 mm
XC5410-4PG223C	Xilinx	FPGA		Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array				2.54 mm						Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No					47.244 mm
XC3042-100PG132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.5 V	144	CMOS		96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	7 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		100 MHz	96	37.084 mm
XC5206-4PG191C	Xilinx	FPGA	Other	Pin/Peg	191	HPGA	Square	Ceramic, Metal-Sealed Cofired	784	No	5.25 V	196	CMOS		148	6000	5	5 V	Grid Array, Heat Sink/Slug	PGA191M,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	3.8 ns	196 CLBS, 6000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	MAX available 10000 Logic gates		83 MHz	148	47.244 mm
XC6236-2PG299C	Xilinx	FPGA		Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired	9216	No	5.25 V	9216	CMOS			36000	5		Grid Array			4.75 V	2.54 mm	85 °C (185 °F)	3 ns	9216 CLBS, 36000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	9216 flip-flops; typical gates = 36000-55000	e3	111 MHz		52.324 mm
XC40150XV-7PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	5184	CMOS			100000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm	85 °C (185 °F)	0.9 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P559		5.334 mm	57.404 mm	No			250 MHz		57.404 mm
5962-8994802MXC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4			27.94 mm
XC3090-100PG175B	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No		320	CMOS	MIL-STD-883 Class B	144	5000	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA		100 MHz	144	42.164 mm
XC3042-125PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS		74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	5.5 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		125 MHz	74	27.94 mm
XC5210-4PG223I	Xilinx	FPGA		Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	324	No	5.5 V	324	CMOS		196	10000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm		3.8 ns	324 CLBS, 10000 Gates			Perpendicular	S-CPGA-P223	1	4.318 mm	47.244 mm	No	Typical gates = 10000-16000		83 MHz	196	47.244 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.