Military Field Programmable Gate Arrays (FPGA) 1,437

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP1SGX25CF1020I5N

Altera

FPGA

Military

Ball

1020

BGA

Square

Plastic/Epoxy

25660

Yes

1.575 V

CMOS

607

1.5

1.5,1.5/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

1.425 V

1 mm

135 °C (275 °F)

-65 °C (-85 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

40 s

607

245 °C (473 °F)

33 mm

EP4SGX110FF35M3

Altera

FPGA

Military

Ball

1152

BGA

Square

Plastic/Epoxy

105600

Yes

.93 V

4224

488

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

125 °C (257 °F)

4224 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

488

35 mm

EP4SGX530NF45M3N

Altera

FPGA

Military

Ball

1932

BGA

Square

Plastic/Epoxy

531200

Yes

.93 V

21248

920

0.9

Grid Array

BGA1932,44X44,40

.87 V

1 mm

125 °C (257 °F)

21248 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1932

3.5 mm

45 mm

920

45 mm

EP1SGX25FF1020I6N

Altera

FPGA

Military

Ball

1020

BGA

Square

Plastic/Epoxy

25660

Yes

1.575 V

2852

CMOS

607

1.5

1.5,1.5/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

1.425 V

1 mm

135 °C (275 °F)

2852 CLBS

-65 °C (-85 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e1

30 s

607

245 °C (473 °F)

33 mm

EP4SGX360KF40M3

Altera

FPGA

Military

Ball

1517

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

744

0.9

Grid Array

BGA1517,39X39,40

.87 V

1 mm

125 °C (257 °F)

14144 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

637.5 MHz

744

40 mm

EP4SE230F29M3N

Altera

FPGA

Military

Ball

780

BGA

Square

Plastic/Epoxy

228000

Yes

.93 V

9120

488

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

125 °C (257 °F)

9120 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B780

3.4 mm

29 mm

488

29 mm

EP1SGX25CF672I7

Altera

FPGA

Military

Ball

672

BGA

Square

Plastic/Epoxy

25660

Yes

CMOS

455

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

135 °C (275 °F)

-65 °C (-85 °F)

Bottom

S-PBGA-B672

3

No

455

220 °C (428 °F)

EP4SE530H35M3N

Altera

FPGA

Military

Ball

1152

BGA

Square

Plastic/Epoxy

531200

Yes

.93 V

21248

TSMC

744

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

125 °C (257 °F)

21248 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1152

3.5 mm

42 mm

744

42 mm

EP1SGX10CF672I5

Altera

FPGA

Military

Ball

672

BGA

Square

Plastic/Epoxy

10570

Yes

CMOS

362

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

135 °C (275 °F)

-65 °C (-85 °F)

Bottom

S-PBGA-B672

3

No

362

220 °C (428 °F)

EP4SGX360FH29M3

Altera

FPGA

Military

Ball

780

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

289

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

125 °C (257 °F)

14144 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B780

3.4 mm

33 mm

289

33 mm

EP4SE820H40M3N

Altera

FPGA

Military

Ball

1517

BGA

Square

Plastic/Epoxy

813050

Yes

.93 V

32522

976

0.9

Grid Array

BGA1517,39X39,40

.87 V

1 mm

125 °C (257 °F)

32522 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1517

3.5 mm

42.5 mm

976

42.5 mm

EP4SGX70DF29M3

Altera

FPGA

Military

Ball

780

BGA

Square

Plastic/Epoxy

72600

Yes

.93 V

2904

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

125 °C (257 °F)

2048 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B780

3.3 mm

29 mm

637.5 MHz

372

29 mm

EP4SGX180FF35M3

Altera

FPGA

Military

Ball

1152

BGA

Square

Plastic/Epoxy

175750

Yes

.93 V

7030

564

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

125 °C (257 °F)

7030 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1152

3.4 mm

35 mm

564

35 mm

EP4SGX290HF35M3N

Altera

FPGA

Military

Ball

1152

BGA

Square

Plastic/Epoxy

291200

Yes

.93 V

11648

564

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

125 °C (257 °F)

11648 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

564

35 mm

EP1SGX10DF672I6

Altera

FPGA

Military

Ball

672

BGA

Square

Plastic/Epoxy

10570

Yes

1.575 V

1200

CMOS

362

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

135 °C (275 °F)

1200 CLBS

-65 °C (-85 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

20 s

362

220 °C (428 °F)

27 mm

EP4SGX360HF35M3N

Altera

FPGA

Military

Ball

1152

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

564

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

125 °C (257 °F)

14144 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

564

35 mm

EP1SGX40GF1020I7N

Altera

FPGA

Military

Ball

1020

BGA

Square

Plastic/Epoxy

41250

Yes

1.575 V

CMOS

624

1.5

1.5,1.5/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

1.425 V

1 mm

135 °C (275 °F)

-65 °C (-85 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e1

40 s

624

245 °C (473 °F)

33 mm

EP1SGX25FF1020I6

Altera

FPGA

Military

Ball

1020

BGA

Square

Plastic/Epoxy

25660

Yes

1.575 V

2852

CMOS

607

1.5

1.5,1.5/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

1.425 V

1 mm

135 °C (275 °F)

2852 CLBS

-65 °C (-85 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

20 s

607

220 °C (428 °F)

33 mm

EP4SGX110DF29M3

Altera

FPGA

Military

Ball

780

BGA

Square

Plastic/Epoxy

105600

Yes

.93 V

4224

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

125 °C (257 °F)

4224 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B780

3.3 mm

29 mm

372

29 mm

EP1SGX25CF1020I7N

Altera

FPGA

Military

Ball

1020

BGA

Square

Plastic/Epoxy

25660

Yes

1.575 V

CMOS

607

1.5

1.5,1.5/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

1.425 V

1 mm

135 °C (275 °F)

-65 °C (-85 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

40 s

607

245 °C (473 °F)

33 mm

EP4SE530H40M3

Altera

FPGA

Military

Ball

1517

BGA

Square

Plastic/Epoxy

531200

Yes

.93 V

21248

TSMC

976

0.9

Grid Array

BGA1517,39X39,40

.87 V

1 mm

125 °C (257 °F)

21248 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1517

3.5 mm

42.5 mm

976

42.5 mm

EP4SGX530KH40M3

Altera

FPGA

Military

Ball

1517

BGA

Square

Plastic/Epoxy

531200

Yes

.93 V

21248

0.9

Grid Array

BGA1517,39X39,40

.87 V

1 mm

125 °C (257 °F)

21248 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1517

3.5 mm

42.5 mm

42.5 mm

EP4SGX110HF35M3

Altera

FPGA

Military

Ball

1152

BGA

Square

Plastic/Epoxy

105600

Yes

.93 V

4224

488

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

125 °C (257 °F)

4224 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

488

35 mm

EP4SGX360HF35M3

Altera

FPGA

Military

Ball

1152

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

564

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

125 °C (257 °F)

14144 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1152

3.4 mm

35 mm

564

35 mm

EP4SGX70HF35M3

Altera

FPGA

Military

Ball

1152

BGA

Square

Plastic/Epoxy

72600

Yes

.93 V

2904

488

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

125 °C (257 °F)

2904 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1152

3.4 mm

35 mm

488

35 mm

EP4SGX530HH35M3

Altera

FPGA

Military

Ball

1152

BGA

Square

Plastic/Epoxy

531200

Yes

.93 V

21248

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

125 °C (257 °F)

21248 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1152

3.5 mm

42.5 mm

42.5 mm

EP1SGX25CF1020I7

Altera

FPGA

Military

Ball

1020

BGA

Square

Plastic/Epoxy

25660

Yes

CMOS

607

1.5,1.5/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

1 mm

135 °C (275 °F)

-65 °C (-85 °F)

Bottom

S-PBGA-B1020

No

607

EP4SE820H40M3

Altera

FPGA

Military

Ball

1517

BGA

Square

Plastic/Epoxy

813050

Yes

.93 V

32522

976

0.9

Grid Array

BGA1517,39X39,40

.87 V

1 mm

125 °C (257 °F)

32522 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1517

3.5 mm

42.5 mm

976

42.5 mm

EP1SGX25FF1020I5

Altera

FPGA

Military

Ball

1020

BGA

Square

Plastic/Epoxy

25660

Yes

CMOS

607

1.5,1.5/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

1 mm

135 °C (275 °F)

-65 °C (-85 °F)

Bottom

S-PBGA-B1020

3

No

607

220 °C (428 °F)

EP1SGX10CF672I6N

Altera

FPGA

Military

Ball

672

BGA

Square

Plastic/Epoxy

10570

Yes

1.575 V

CMOS

362

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

135 °C (275 °F)

-65 °C (-85 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

40 s

362

245 °C (473 °F)

27 mm

EP1SGX25DF1020I6

Altera

FPGA

Military

Ball

1020

BGA

Square

Plastic/Epoxy

25660

Yes

CMOS

607

1.5,1.5/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

1 mm

135 °C (275 °F)

-65 °C (-85 °F)

Bottom

S-PBGA-B1020

3

No

607

220 °C (428 °F)

EP4SGX110FF35M3N

Altera

FPGA

Military

Ball

1152

BGA

Square

Plastic/Epoxy

105600

Yes

.93 V

4224

488

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

125 °C (257 °F)

4224 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1152

3.4 mm

35 mm

488

35 mm

EP4SGX230DF29M3

Altera

FPGA

Military

Ball

780

BGA

Square

Plastic/Epoxy

228000

Yes

.93 V

9120

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

125 °C (257 °F)

9120 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B780

3.5 mm

29 mm

372

29 mm

EPB1400JM

Altera

FPGA

Military

J Bend

44

QCCJ

Square

Ceramic

Yes

CMOS

Chip Carrier

LDCC44,.7SQ

Field Programmable Gate Arrays

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-XQCC-J44

No

e0

220 °C (428 °F)

EP4SE820F43M3

Altera

FPGA

Military

Ball

1760

BGA

Square

Plastic/Epoxy

813050

Yes

.93 V

32522

1120

0.9

Grid Array

BGA1760,42X42,40

.87 V

1 mm

125 °C (257 °F)

32522 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1760

3.5 mm

42.5 mm

1120

42.5 mm

EP1SGX40GF1020I6N

Altera

FPGA

Military

Ball

1020

BGA

Square

Plastic/Epoxy

41250

Yes

1.575 V

4697

CMOS

624

1.5

1.5,1.5/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

1.425 V

1 mm

135 °C (275 °F)

4697 CLBS

-65 °C (-85 °F)

Tin Silver Copper

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e1

30 s

624

245 °C (473 °F)

33 mm

EP4SGX230DF29M3N

Altera

FPGA

Military

Ball

780

BGA

Square

Plastic/Epoxy

228000

Yes

.93 V

9120

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

125 °C (257 °F)

9120 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B780

3.5 mm

29 mm

372

29 mm

EP1SGX25CF672I6N

Altera

FPGA

Military

Ball

672

BGA

Square

Plastic/Epoxy

25660

Yes

1.575 V

2852

CMOS

455

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

135 °C (275 °F)

2852 CLBS

-65 °C (-85 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

30 s

455

245 °C (473 °F)

27 mm

EP1SGX25DF1020I7

Altera

FPGA

Military

Ball

1020

BGA

Square

Plastic/Epoxy

25660

Yes

CMOS

607

1.5,1.5/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

1 mm

135 °C (275 °F)

-65 °C (-85 °F)

Bottom

S-PBGA-B1020

3

No

607

220 °C (428 °F)

EP1SGX10CF672I5N

Altera

FPGA

Military

Ball

672

BGA

Square

Plastic/Epoxy

10570

Yes

1.575 V

CMOS

362

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

135 °C (275 °F)

-65 °C (-85 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

40 s

362

245 °C (473 °F)

27 mm

EP4SGX290NF45M3N

Altera

FPGA

Military

Ball

1932

BGA

Square

Plastic/Epoxy

291200

Yes

.93 V

11648

920

0.9

Grid Array

BGA1932,44X44,40

.87 V

1 mm

125 °C (257 °F)

11648 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1932

3.5 mm

45 mm

920

45 mm

EP4SGX110DF29M3N

Altera

FPGA

Military

Ball

780

BGA

Square

Plastic/Epoxy

105600

Yes

.93 V

4224

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

125 °C (257 °F)

4224 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B780

3.3 mm

29 mm

372

29 mm

EP1SGX25CF672I5

Altera

FPGA

Military

Ball

672

BGA

Square

Plastic/Epoxy

25660

Yes

CMOS

455

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

135 °C (275 °F)

-65 °C (-85 °F)

Bottom

S-PBGA-B672

3

No

455

220 °C (428 °F)

EP4SGX290FH29M3N

Altera

FPGA

Military

Ball

780

BGA

Square

Plastic/Epoxy

291200

Yes

.93 V

11648

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

125 °C (257 °F)

11648 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B780

3.4 mm

33 mm

33 mm

EP4SE530H35M3

Altera

FPGA

Military

Ball

1152

BGA

Square

Plastic/Epoxy

531200

Yes

.93 V

21248

TSMC

744

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

125 °C (257 °F)

21248 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1152

3.5 mm

42 mm

744

42 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.