Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3120-5CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS	38535Q/M;38534H;883B	64	1300	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	64 CLBS, 1300 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800		190 MHz		64		19.05 mm
XC3042-70CQ100BSPC0107	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS			4200	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				17.272 mm
5962-8994804QUA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS	MIL-PRF-38535 Class Q		2000	5		Flatpack			4.5 V		125 °C (257 °F)	5.5 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							125 MHz
5962-9561202MXX	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No		e4					42.164 mm
XQ4085XL-3PG475M	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square		Ceramic, Metal-Sealed Cofired		No	3.6 V	3136				55000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	2.9 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P475		5.969 mm	54.864 mm	No	Maximum usable gates 180000	e0	166 MHz				54.864 mm
XQV300-4CB228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q		322970	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0					39.37 mm
XC4025E-4PG299B	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square		Ceramic, Metal-Sealed Cofired	1024	No	5.5 V	1024	CMOS	MIL-STD-883 Class B	256	15000	5	5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.7 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Typical gates = 15000-45000	e0	111 MHz		256		52.324 mm
5962-8971303MZC	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No	5.5 V		CMOS	MIL-STD-883	96	4200	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	7 ns	4200 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No		e4	100 MHz		96		37.084 mm
XC4013-10CB228B	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	576		MIL-STD-883 Class B		13000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		576 CLBS, 13000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No							39.37 mm
5962-9561001MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No		144	CMOS	MIL-STD-883		2000	5		Grid Array				2.54 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 2000-3000	e4	188 MHz				27.94 mm
5962-9752401QZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	576		MIL-PRF-38535 Class Q		10000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 10000-30000						39.37 mm
5962-8994801MXC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No		64	CMOS	MIL-STD-883		1000	5		Grid Array				2.54 mm	125 °C (257 °F)		64 CLBS, 1000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4					27.94 mm
5962-9225203MYX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No							28.702 mm
5962-9851001QXX	Xilinx	FPGA	Military	Pin/Peg	411	HIPGA	Square		Ceramic, Metal-Sealed Cofired		No	3.6 V	1296	CMOS	MIL-PRF-38535 Class Q		22000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P411		5.334 mm	52.324 mm	No			166 MHz				52.324 mm
XC7V2000T-2FFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square		Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V		125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
XQR4VFX60-10CF1144V	Xilinx	FPGA	Military		1144	CGA	Square		Ceramic, Metal-Sealed Cofired	56880	Yes	1.26 V	6656	CMOS	38535V;38534K;883S	576		1.2	1.2,2.5,3.3 V	Grid Array	PGA1144,34X34,39	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		6656 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1144		9.56 mm	35 mm	No			1028 MHz		576		35 mm
XC4020E-2PGG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e3	125 MHz				47.244 mm
5962-9851301QZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	576	CMOS	MIL-PRF-38535 Class Q		10000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 30000		166 MHz				39.37 mm
5962-9225202MXC	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired	466	No		196	CMOS	MIL-STD-883	112	4000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	6 ns	196 CLBS, 4000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No		e4			112		42.164 mm
XC7V855T-3FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square		Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
5962R9957201QZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q		322970	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)		1536 CLBS, 322970 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	Yes							39.37 mm
XC7VX485T-1LFFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square		Plastic/Epoxy		Yes		75900							Grid Array					125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
XC7V450T-1LFFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XQ4VLX60-10FFG668M	Xilinx	FPGA	Military	Ball	668	BGA	Square		Plastic/Epoxy		Yes	1.26 V		CMOS						Grid Array	BGA668,26X26,40		1.14 V	1 mm	125 °C (257 °F)	0.78 ns		-55 °C (-67 °F)		Bottom	S-PBGA-B668		2.85 mm	27 mm								27 mm
5962-9561002MYC	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes			CMOS	MIL-STD-883	82		5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4	230 MHz		82		19.05 mm
5962-8982303MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes	5.5 V		CMOS	MIL-STD-883	142	9000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	7 ns	9000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	100 MHz		142		28.702 mm
XQ4028EX-4HQ240N	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy	2432	Yes	5.5 V	1024	CMOS	MIL-PRF-38535	193	18000	5	5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	125 °C (257 °F)	2.2 ns	1024 CLBS, 18000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Maximum usable gates = 50000	e0	143 MHz	30 s	193	225 °C (437 °F)	32 mm
5962-8994802MXC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4					27.94 mm
XC3090-100PG175B	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired	320	No		320	CMOS	MIL-STD-883 Class B	144	5000	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA		100 MHz		144		42.164 mm
XC3042-50CQ100M	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes	5.5 V	144	CMOS		82	4200	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		144 CLBS, 4200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100	1	3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops		50 MHz		82		17.272 mm
XQV600-4CBG228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class Q		661111	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3					39.37 mm
5962-9473002MZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	1368	Yes			CMOS	MIL-STD-883	192		5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4	90.9 MHz		192		39.37 mm
5962-9957501NUA	Xilinx	FPGA	Military	Ball	432	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	3136	CMOS	MIL-PRF-38535		55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432		1.7 mm	40 mm	No	Typical gates = 55000 to 180000	e0	200 MHz				40 mm
XQR2V1000-4FGG456R	Xilinx	FPGA	Military	Ball	456	BGA	Square		Plastic/Epoxy		Yes	1.575 V	1280	CMOS			1000000	1.5		Grid Array			1.425 V	1 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	650 MHz	30 s		250 °C (482 °F)	23 mm
XQR2V1000-4FG456R	Xilinx	FPGA	Military	Ball	456	BGA	Square		Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		324	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	650 MHz	30 s	324	225 °C (437 °F)	23 mm
5962-8994801MYC	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
5962R9957201NTB	Xilinx	FPGA	Military	Gull Wing	240	QFP	Square		Plastic/Epoxy	6912	Yes	2.625 V		CMOS	MIL-PRF-38535	166	322970	2.5	1.2/3.6,2.5 V	Flatpack	QFP240,1.3SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)	0.8 ns	322970 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQFP-G240				Yes		e0			166
5962-9850901NTB	Xilinx	FPGA	Military	Gull Wing	240	HQFP	Square			2432	Yes	5.5 V		CMOS	MIL-PRF-38535	193	28000	5	5 V	Flatpack, Heat Sink/Slug	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	125 °C (257 °F)	2.2 ns	28000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-XQFP-G240		4.1 mm	32 mm	No		e0	143 MHz		193		32 mm
XC4020E-3PGG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e3	125 MHz				47.244 mm
XC3020-50PG84MSPC0110	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	64	CMOS			2000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		64 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz				27.94 mm
5962-8994802MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array				2.54 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm
XC4013-6PGG223B	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	576	CMOS	MIL-STD-883 Class B		10000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No	1536 flip-flops; typical gates = 10000-13000	e3					47.244 mm
5962-9473002MXC	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired	1368	No		576	CMOS	MIL-STD-883	192	10000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e4	90.9 MHz		192		47.244 mm
XC4025E-3PGG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No		e3	125 MHz				52.324 mm
XC3195A-4CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		484	CMOS	MIL-STD-883 Class B		6500	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	3.3 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No							28.702 mm
5962-9225202MYX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		196	CMOS	MIL-STD-883		4000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		196 CLBS, 4000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4					28.702 mm
5962-9851301NX	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535		10000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Typical gates = 10000 to 30000		166 MHz				32 mm
XC4020E-3PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			125 MHz				47.244 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.