Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5962-9851301QXA	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	2.54 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e0	166 MHz				47.244 mm
5962-8982302MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS	MIL-STD-883	142	5000	5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	70 MHz		142		28.702 mm
5962-9473001MZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4					39.37 mm
XQ6VLX130T-1LFFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes		10000	CMOS		600				Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	10000 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XC7V2000T-1LFFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes		305400							Grid Array				1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
5962-9225203MXX	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No							42.164 mm
XC7V855T-1LFFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XC7V285T-1LFFG1157E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
5962-01-394-1568	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic	100	No			CMOS		74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P84				No			70 MHz		74
XC4010-5PG191B	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	400		MIL-STD-883 Class B		7000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		400 CLBS, 7000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No							47.244 mm
XQ4036XL-3BG352N	Xilinx	FPGA	Military	Ball	352	LBGA	Square	Plastic/Epoxy	3078	Yes	3.6 V	1296	CMOS	MIL-PRF-38535	288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Typical gates = 22000 to 65000	e0	166 MHz	30 s	288	225 °C (437 °F)	35 mm
XC4025E-1PG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired	1024	No	5.5 V	784	CMOS		256	13000	5	5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No		e0	166 MHz		256		52.324 mm
XC3042-100CB100MSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		144	CMOS			2000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000	e0	100 MHz				19.05 mm
5962R9957301NTB	Xilinx	FPGA	Military	Gull Wing	240	QFP	Square	Plastic/Epoxy	15552	Yes	2.625 V		CMOS	MIL-PRF-38535	166	661111	2.5	1.2/3.6,2.5 V	Flatpack	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)	0.8 ns	661111 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQFP-G240				Yes		e0			166
XC3195-5PG175M	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No		484	CMOS		144	6500	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000		190 MHz		144		42.164 mm
5962-8994801MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		64	CMOS			1000	5		Grid Array				2.54 mm	125 °C (257 °F)		64 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm
XQVR600-4CB228B	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic	15552	Yes			CMOS	38535Q/M;38534H;883B	162			1.5/3.3,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQFP-F228				No		e0			162
5962-9957501QY	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	3136	CMOS	MIL-PRF-38535		55000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 55000 to 180000		200 MHz				39.37 mm
XC7V285T-1LFFG484E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4			No		e1		30 s		250 °C (482 °F)
5962R9957401NUA	Xilinx	FPGA	Military	Ball	560	LBGA	Square	Plastic/Epoxy	27648	Yes	2.625 V		CMOS	MIL-PRF-38535	404	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)		1124022 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B560		1.7 mm	42.5 mm	Yes		e0			404		42.5 mm
XC3020-50PG84M	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No		64	CMOS		64	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)		64 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA		50 MHz		64		27.94 mm
5962-8982301MXC	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No		320	CMOS	MIL-STD-883	144	9000	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)		320 CLBS, 9000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No		e4	50 MHz		144		42.164 mm
XQ4085XL-1CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	3136	CMOS	MIL-PRF-38535		55000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228	1	3.302 mm	39.37 mm	No	Typical gates = 55000 to 180000	e0	200 MHz				39.37 mm
XC3142-5PQ100M	Xilinx	FPGA	Military	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes		144	CMOS		82	3000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 3000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz	30 s	82	225 °C (437 °F)	20 mm
5962-9851301QYA	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	576	CMOS			10000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 30000	e0	166 MHz				39.37 mm
XQKU15P-1FFRE1517M	Xilinx	FPGA	Military	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		MIL-PRF-38535	564		0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	125 °C (257 °F)		65340 CLBs	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.71 mm	40 mm			e0		20 s	564	225 °C (437 °F)	40 mm
5962-8994801XX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Rectangular	Ceramic, Metal-Sealed Cofired		No	5.5 V	64	CMOS	MIL-STD-883		2000	5		Grid Array			4.5 V		125 °C (257 °F)	14 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	R-CPGA-P84				No		e4	16 MHz
5962-01-336-5569	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic	64	Yes			CMOS	38535Q/M;38534H;883B	64		5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F100				No			50 MHz		64
XC2064-33CD48M	Xilinx	FPGA	Military	Through-Hole	48	DIP	Rectangular	Ceramic	64	No			CMOS		40		5	5 V	In-Line	DIP48,.6	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T48				No			33 MHz		40
5962-9957201QYX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q		322970	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	Yes							39.37 mm
XC3142A-4PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		144	CMOS	MIL-STD-883 Class B		2000	5		Grid Array				2.54 mm	125 °C (257 °F)	3.3 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	3000 Logic gates can also be used						27.94 mm
5962-9752301QXC	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired	950	No	5.5 V	400	CMOS	MIL-PRF-38535 Class Q	160	7000	5	5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	3.9 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	Typical gates = 7000-20000	e4	111 MHz		160		47.244 mm
XQ2VP40-5FG676N	Xilinx	FPGA	Military	Ball	676	HBGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array, Heat Sink/Slug	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.36 ns	4848 CLBS	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	1050 MHz	30 s	416	225 °C (437 °F)	27 mm
XC3020-50CQ100MSPC0107	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)		64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				17.272 mm
XC4003E-2PGG120M	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	100	CMOS			2000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		100 CLBS, 2000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No		e3	125 MHz				34.544 mm
5962-8971303M9X	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		144	CMOS	MIL-STD-883		2000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		3.429 mm	19.05 mm	No			100 MHz				19.05 mm
XC3042-50PG84MSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		144	CMOS			2000	5		Grid Array				2.54 mm	125 °C (257 °F)		144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000		50 MHz				27.94 mm
5962-9851301NT	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535		10000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Typical gates = 10000 to 30000		166 MHz				32 mm
5962-9851101QXC	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired	5472	No	3.6 V	2304	CMOS	MIL-PRF-38535 Class Q	384	40000	3.3	3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	SPGA475,41X41	Field Programmable Gate Arrays	3 V	2.54 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P475		5.969 mm	54.864 mm	No		e4	166 MHz		384		54.864 mm
XC4013E-4CB228B	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	1368	Yes	5.5 V	576	CMOS	MIL-STD-883 Class B	192	10000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	2.7 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228	1	3.302 mm	39.37 mm	No	Typical gates = 10000-30000	e0	111 MHz		192		39.37 mm
XC7V855T-2FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XQ4013XL-3PQ240N	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS	MIL-PRF-38535	192	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Typical gates = 10000 to 30000	e0	166 MHz	30 s	192	225 °C (437 °F)	32 mm
XC4013-10PG223B	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	576		MIL-STD-883 Class B		13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		576 CLBS, 13000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No							47.244 mm
5962-8971301MNA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC3030-50PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic	100	No			CMOS	38535Q/M;38534H;883B	74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P84				No			50 MHz		74
5962-9752201QYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	466	Yes	5.5 V	196	CMOS	MIL-PRF-38535 Class Q	112	3000	5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	196 CLBS, 3000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	Typical gates = 3000-9000	e4	111 MHz		112		28.702 mm
XQR2V3000-4BG728N	Xilinx	FPGA	Military	Ball	728	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA728,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B728	3	2.6 mm	35 mm	No		e0	650 MHz		516		35 mm
5962-9851001NX	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS	MIL-PRF-38535		22000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Typical gates = 22000 to 65000		166 MHz				32 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.