Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3042-70CB100BSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		144	CMOS			2000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000		70 MHz				19.05 mm
5962-8982303MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns		-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No							28.702 mm
5962-9957501NUC	Xilinx	FPGA	Military	Ball	432	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	3136	CMOS	MIL-PRF-38535 Class N		55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Gold	Bottom	S-PBGA-B432		1.7 mm	40 mm	No		e4	200 MHz				40 mm
5962-9471201MXX	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square		Ceramic, Metal-Sealed Cofired	238	No			CMOS	MIL-STD-883	80		5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No		e4	50 MHz		80		34.544 mm
XQ4062XL-3BG432N	Xilinx	FPGA	Military	Ball	432	LBGA	Square		Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS	MIL-PRF-38535	352	40000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Typical gates = 40000 to 130000	e0	166 MHz	30 s	352	225 °C (437 °F)	40 mm
XQKU5P-1FFRB676M	Xilinx	FPGA	Military	Ball	676	BGA	Square		Plastic/Epoxy	474600	Yes	.876 V	27120		MIL-PRF-38535	304		0.85		Grid Array	BGA676,26X26,40		.825 V	1 mm	125 °C (257 °F)		27120 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.67 mm	27 mm			e0		20 s	304	225 °C (437 °F)	27 mm
5962-01-414-9645	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic	144	No			CMOS	38535Q/M;38534H;883B	74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P84				No			70 MHz		74
5962-9957401QXX	Xilinx	FPGA	Military	Ball	560	BGA	Square		Ceramic, Metal-Sealed Cofired		Yes	2.625 V		CMOS			1124022	2.5		Grid Array			2.375 V	1.27 mm	125 °C (257 °F)		1124022 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-B560		5.35 mm	42.5 mm	No							42.5 mm
5962-9851301NTC	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535 Class N		10000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Gold	Quad	S-PQFP-G240		4.1 mm	32 mm	No	Maximum usable gates 30000	e4	166 MHz				32 mm
5962-9851101NTC	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	2304	CMOS	MIL-PRF-38535 Class N		40000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Gold	Quad	S-PQFP-G240		4.1 mm	32 mm	No	Maximum usable gates 130000	e4	166 MHz				32 mm
XC3190A-5CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS	38535Q/M;38534H;883B	142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	Typical gates = 5000-6000	e0	188 MHz		142		28.702 mm
5962-9561001MYX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		144	CMOS	MIL-STD-883		2000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No	Typical gates = 2000-3000	e4	188 MHz				19.05 mm
XC7V285T-3FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XC7V1500T-1FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes		229050							Grid Array				1 mm	125 °C (257 °F)		229050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XQ4VFX60-10EF672M	Xilinx	FPGA	Military	Ball	672	BGA	Square		Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS		352		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		6320 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B672		3 mm	27 mm	No		e0	1028 MHz		352		27 mm
XC7V585T-1FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes		91050							Grid Array				1 mm	125 °C (257 °F)		91050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XC4036XL-3CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	1296	CMOS			22000	3.3		Flatpack, Guard Ring			3 V	.65 mm	125 °C (257 °F)		1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No							39.37 mm
5962R9957301NTX	Xilinx	FPGA	Military	Gull Wing	240	QFP	Square		Plastic/Epoxy		Yes	2.625 V		CMOS			661111	2.5		Flatpack			2.375 V		125 °C (257 °F)	0.8 ns	661111 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240				Yes
XC7V585T-3FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy	582720	Yes	1.03 V	45525	CMOS		750		1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	125 °C (257 °F)	0.58 ns	45525 CLBS	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm	No		e1	1818 MHz	30 s	750	245 °C (473 °F)	42.5 mm
5962-9957201NTX	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class N		322970	2.5		Flatpack, Fine Pitch			2.375 V	.5 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	Yes							32 mm
XC3090-70PG175MSPC0107	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired		No		320	CMOS			5000	5		Grid Array				2.54 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000		70 MHz				42.164 mm
XQV600-4CBG228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.625 V	3456	CMOS	MIL-PRF-38535		661111	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3					39.37 mm
XC3030-70PG84M	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	100	No		100	CMOS		74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	9 ns	100 CLBS, 1500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA		70 MHz		74		27.94 mm
XC4013-6PG223B	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired	576	No	5.5 V	576	CMOS	MIL-STD-883 Class B	192	10000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	90.9 MHz		192		47.244 mm
XC7V2000T-1LFFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes		305400							Grid Array				1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
5962-9957501NTB	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	3136	CMOS	MIL-PRF-38535 Class N		55000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0	200 MHz				32 mm
XC4005E-3PGG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	196	CMOS			3000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		196 CLBS, 3000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No		e3	125 MHz				42.164 mm
5962-8994802MTX	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes			CMOS	MIL-STD-883	64		5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0	70 MHz		64		17.272 mm
XC3120A-5PQ100B	Xilinx	FPGA	Military	Gull Wing	100	QFP	Rectangular		Plastic/Epoxy	64	Yes		64	CMOS	38535Q/M;38534H;883B	64	1300	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	64 CLBS, 1300 Gates	-55 °C (-67 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800	e0	190 MHz	30 s	64	225 °C (437 °F)	20 mm
5962-8971304QTA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS	MIL-PRF-38535 Class Q		4200	5		Flatpack			4.5 V		125 °C (257 °F)	5.5 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							125 MHz
XQR4036XL-3CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	60k Rad(Si)	Ceramic, Metal-Sealed Cofired	3078	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	3 V	.635 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228	1	3.302 mm	39.37 mm	No	Typical gates = 22000 to 65000	e0	166 MHz		288		39.37 mm
XQ4085XL-3CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	3136				55000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	2.9 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 180000	e0	166 MHz				39.37 mm
XC4005E-4CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	466	Yes	5.5 V	196	CMOS	MIL-STD-883 Class B	112	3000	5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	2.7 ns	196 CLBS, 3000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164	1	3.302 mm	28.702 mm	No	Typical gates = 3000-9000	e0	111 MHz		112		28.702 mm
XC7V1500T-2FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes		229050							Grid Array					125 °C (257 °F)		229050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC7V1500T-1LFFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square		Plastic/Epoxy		Yes		229050							Grid Array				1 mm	125 °C (257 °F)		229050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
5962-9752201QYX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	196		MIL-PRF-38535 Class Q		3000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	196 CLBS, 3000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	Typical gates = 3000-9000						28.702 mm
XC7V1500T-2FFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square		Plastic/Epoxy		Yes		229050							Grid Array					125 °C (257 °F)		229050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
5962-9225202MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	466	Yes			CMOS	MIL-STD-883	112		5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	6 ns		-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4			112		28.702 mm
XQV1000-4BG560N	Xilinx	FPGA	Military	Ball	560	LBGA	Square		Plastic/Epoxy	27648	Yes	2.625 V	6144	CMOS	38535Q/M;38534H;883B	404	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0		30 s	404	225 °C (437 °F)	42.5 mm
XQV2000E-6BG560N	Xilinx	FPGA	Military	Ball	560	LBGA	Square		Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	38535Q/M;38534H;883B	404	2541952	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	125 °C (257 °F)		9600 CLBS, 2541952 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B560		1.7 mm	42.5 mm	No			357.2 MHz		404		42.5 mm
5962-01-382-7899	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic	100	No			CMOS		74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P84				No			50 MHz		74
5962-9851101NT	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	2304	CMOS	MIL-PRF-38535		40000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Typical gates = 40000 to 130000		166 MHz				32 mm
XQ6VSX315T-1LRF1759M	Xilinx	FPGA	Military	Ball	1759	BGA	Square		Plastic/Epoxy	314880	Yes		24600	CMOS		720				Grid Array	BGA1759,42X42,40			1 mm	125 °C (257 °F)	0.85 ns	24600 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	4.37 mm	42.5 mm			e0			720		42.5 mm
5962-9957201NNA	Xilinx	FPGA	Military	Ball	352	LBGA	Square		Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class N	260	322970	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B352		1.7 mm	35 mm	Yes		e0			260		35 mm
XQVR1000-4CGG560V	Xilinx	FPGA	Military		560	HCGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	6144	CMOS			1124022	2.5		Grid Array, Heat Sink/Slug			2.375 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X560		4.9 mm	42.5 mm	No		e3					42.5 mm
5962-8982301MUA	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0					27.432 mm
5962-8994801MNX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS				5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F100		3.429 mm	19.05 mm	No							19.05 mm
XQVR1000-4CG560Q	Xilinx	FPGA	Military		560	HCGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	27648	Yes	2.625 V	6144	CMOS	MIL-PRF-38535 Class Q	404	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Heat Sink/Slug	CGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X560		4.9 mm	42.5 mm	No		e0			404		42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.