Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5962-9471201MYC	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XC3142A-5CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS	38535Q/M;38534H;883B	82	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.429 mm	19.05 mm	No	Typical gates = 2000-3000	e0	188 MHz		82		19.05 mm
XQ4013XL-3BGG256N	Xilinx	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535		10000	3.3		Grid Array			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Typical gates = 10000 to 30000	e1	166 MHz	30 s		250 °C (482 °F)	27 mm
XQKU15P-1FFRA1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		MIL-PRF-38535	564		0.85		Grid Array	BGA1156,34X34,40		.825 V	1 mm	125 °C (257 °F)		65340 CLBs	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.71 mm	35 mm			e0		20 s	564	225 °C (437 °F)	35 mm
XQ4036XL-3HQ240N	Xilinx	FPGA	Military	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	3078	Yes	3.6 V	1296	CMOS	MIL-PRF-38535	193	22000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Typical gates = 22000 to 65000	e0	166 MHz	30 s	193	225 °C (437 °F)	32 mm
5962-9561201MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	484	Yes			CMOS	MIL-STD-883	142		5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	190 MHz		142		28.702 mm
5962-8982302MXC	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No		320	CMOS	MIL-STD-883	144	5000	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	2 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No		e4	70 MHz		144		42.164 mm
XC3020-50PG84BSPC0110	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	64	CMOS			2000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	14 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz				27.94 mm
XC4013E-2PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	576	CMOS			10000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		576 CLBS, 10000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			125 MHz				47.244 mm
XQV1000E-6BGG560N	Xilinx	FPGA	Military	Ball	560	LBGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS			1569178	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	125 °C (257 °F)	0.47 ns	6144 CLBS, 1569178 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	357.2 MHz	30 s		260 °C (500 °F)	42.5 mm
XC7V2000T-1FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V	1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
5962-9957501QYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	3136	CMOS	MIL-PRF-38535 Class Q		55000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4	200 MHz				39.37 mm
XQVR300-4CB228B	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic	6912	Yes			CMOS	38535Q/M;38534H;883B	162			1.5/3.3,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQFP-F228				No		e0			162
XC4006E-1PGG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	256	CMOS			4000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		256 CLBS, 4000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No		e3	166 MHz				42.164 mm
XC7V2000T-1FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V	1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
5962-9851301QXC	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	1368	No	3.6 V	576	CMOS	MIL-PRF-38535 Class Q	192	10000	3.3	3.3 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	3 V	2.54 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e4	166 MHz		192		47.244 mm
XC4008E-2PG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired	324	No	5.5 V	324	CMOS		144	6000	5	5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		324 CLBS, 6000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No			125 MHz		144		47.244 mm
XC3090-50PG175BSPC0107	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No		320	CMOS			5000	5		Grid Array				2.54 mm	125 °C (257 °F)	14 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000		50 MHz				42.164 mm
XC4010E-4CB196B	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS	MIL-STD-883 Class B	160	7000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	2.7 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F196	1	3.302 mm	28.702 mm	No	Typical gates = 7000-20000	e0	111 MHz		160		28.702 mm
XQ4025E-4CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	2432	Yes	5.5 V	1024	CMOS	MIL-PRF-38535	192	15000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.7 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates = 45000	e0	111 MHz		192		39.37 mm
XC4020E-4PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			111 MHz				47.244 mm
XQ4VLX25-10SF363M	Xilinx	FPGA	Military	Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		240		1.2	1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	125 °C (257 °F)		2688 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1028 MHz	30 s	240	225 °C (437 °F)	17 mm
XQ4VLX25-10SFG363M	Xilinx	FPGA	Military	Ball	363	FBGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS						Grid Array, Fine Pitch	BGA363,20X20,32		1.14 V	.8 mm	125 °C (257 °F)	0.78 ns		-55 °C (-67 °F)		Bottom	S-PBGA-B363		1.99 mm	17 mm								17 mm
XC3020-100CB100BSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		64	CMOS			1000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500	e0	100 MHz				19.05 mm
XQV300-4CBG228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q		322970	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3					39.37 mm
XQ6VSX475T-1FFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V	37200	CMOS		600		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	125 °C (257 °F)	0.79 ns	37200 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
5962-8971301MZC	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No			CMOS	MIL-STD-883	96		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	14 ns		-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No		e4	50 MHz		96		37.084 mm
XQV1000E-6BG560N	Xilinx	FPGA	Military	Ball	560	LBGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	38535Q/M;38534H;883B	404	1569178	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1569178 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B560		1.7 mm	42.5 mm	No			357.2 MHz		404		42.5 mm
XQV600-4CBG228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class Q		661111	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3					39.37 mm
5962-9473002MZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	1368	Yes			CMOS	MIL-STD-883	192		5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4	90.9 MHz		192		39.37 mm
5962-9957501NUA	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS	MIL-PRF-38535		55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432		1.7 mm	40 mm	No	Typical gates = 55000 to 180000	e0	200 MHz				40 mm
XQR2V1000-4FGG456R	Xilinx	FPGA	Military	Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS			1000000	1.5		Grid Array			1.425 V	1 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	650 MHz	30 s		250 °C (482 °F)	23 mm
XQR2V1000-4FG456R	Xilinx	FPGA	Military	Ball	456	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		324	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	650 MHz	30 s	324	225 °C (437 °F)	23 mm
5962-8994801MYC	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
5962R9957201NTB	Xilinx	FPGA	Military	Gull Wing	240	QFP	Square	Plastic/Epoxy	6912	Yes	2.625 V		CMOS	MIL-PRF-38535	166	322970	2.5	1.2/3.6,2.5 V	Flatpack	QFP240,1.3SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)	0.8 ns	322970 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQFP-G240				Yes		e0			166
5962-9850901NTB	Xilinx	FPGA	Military	Gull Wing	240	HQFP	Square		2432	Yes	5.5 V		CMOS	MIL-PRF-38535	193	28000	5	5 V	Flatpack, Heat Sink/Slug	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	125 °C (257 °F)	2.2 ns	28000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-XQFP-G240		4.1 mm	32 mm	No		e0	143 MHz		193		32 mm
XC4020E-3PGG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e3	125 MHz				47.244 mm
XC3020-50PG84MSPC0110	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	64	CMOS			2000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		64 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz				27.94 mm
5962-8994802MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array				2.54 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm
XC4013-6PGG223B	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	576	CMOS	MIL-STD-883 Class B		10000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No	1536 flip-flops; typical gates = 10000-13000	e3					47.244 mm
5962-9473002MXC	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	1368	No		576	CMOS	MIL-STD-883	192	10000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e4	90.9 MHz		192		47.244 mm
XC4025E-3PGG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No		e3	125 MHz				52.324 mm
XC3195A-4CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		484	CMOS	MIL-STD-883 Class B		6500	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	3.3 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No							28.702 mm
5962-9225202MYX	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		196	CMOS	MIL-STD-883		4000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		196 CLBS, 4000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4					28.702 mm
5962-9851301NX	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535		10000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Typical gates = 10000 to 30000		166 MHz				32 mm
XC4020E-3PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			125 MHz				47.244 mm
XC4025E-4PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			111 MHz				47.244 mm
5962-9851101NX	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS	MIL-PRF-38535		40000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Typical gates = 40000 to 130000		166 MHz				32 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.