Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7V2000T-1LFFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes		305400							Grid Array					125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
5962-8971301M9C	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes			CMOS	MIL-STD-883	82		5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4	50 MHz		82		19.05 mm
5962-8971302MZX	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array				2.54 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No							37.084 mm
XQ4VLX60-10EF668M	Xilinx	FPGA	Military	Ball	668	BGA	Square		Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS		448		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		6656 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B668				No		e0	1028 MHz		448
XQV1000-4BGG560N	Xilinx	FPGA	Military	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.625 V	6144	CMOS			1124022	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1		30 s		260 °C (500 °F)	42.5 mm
XC3042-50PG132M	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS		96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)		144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		50 MHz		96		37.084 mm
5962-9851101NUB	Xilinx	FPGA	Military	Ball	432	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	2304	CMOS	MIL-PRF-38535 Class N		40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432		1.7 mm	40 mm	No	Maximum usable gates 130000	e0	166 MHz				40 mm
XQ6VLX550T-1RF1759M	Xilinx	FPGA	Military	Ball	1759	BGA	Square		Plastic/Epoxy	549888	Yes		42960	CMOS		840				Grid Array	BGA1759,42X42,40			1 mm	125 °C (257 °F)	0.79 ns	42960 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	4.37 mm	42.5 mm			e0			840		42.5 mm
XQV300-4CBG228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.625 V	1536	CMOS	MIL-PRF-38535		322970	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3					39.37 mm
XQ2V1000-4FG456N	Xilinx	FPGA	Military	Ball	456	BGA	Square		Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		324	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	650 MHz	30 s	324	225 °C (437 °F)	23 mm
XC3195A-5PG175M	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired	484	No		484	CMOS		144	6500	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	Typical gates = 6500-7500		188 MHz		144		42.164 mm
XC4003A-6CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	238	Yes	5.5 V	100	CMOS		77	2500	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	6 ns	100 CLBS, 2500 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	360 flip-flops; typical gates = 2500-3000		90.9 MHz		77		19.05 mm
XC7V585T-3FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square		Plastic/Epoxy	582720	Yes	1.03 V	45525	CMOS		600		1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	125 °C (257 °F)	0.58 ns	45525 CLBS	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No		e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XC3042-70CQ100M	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes	5.5 V	144	CMOS		82	4200	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	9 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops	e0	70 MHz		82		17.272 mm
XQ6VSX475T-1LRF1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square		Plastic/Epoxy	476160	Yes		37200	CMOS		600				Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	37200 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
5962-9230503MYX	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	28.702 mm	No							28.702 mm
5962-8863804XC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4					27.94 mm
5962-9561001MYC	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS	MIL-STD-883	82	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No	Typical gates = 2000-3000	e4	188 MHz		82		19.05 mm
5962-9561101MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4					28.702 mm
5962-9957301NTB	Xilinx	FPGA	Military	Gull Wing	240	QFP	Square		Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS	MIL-PRF-38535	166	661111	2.5	1.2/3.6,2.5 V	Flatpack	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)	0.8 ns	661111 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			166		32 mm
5962-9561002MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4					27.94 mm
XC3195A-5CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	484	Yes		484	CMOS		176	6500	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164	1	3.302 mm	28.702 mm	No	Typical gates = 6500-7500		188 MHz		176		28.702 mm
5962-8971301QTX	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS	MIL-PRF-38535 Class Q		4200	5		Flatpack			4.5 V		125 °C (257 °F)	14 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							50 MHz
XQR2V3000-4BGG728N	Xilinx	FPGA	Military	Ball	728	BGA	Square		Plastic/Epoxy		Yes	1.575 V	3584	CMOS			3000000	1.5		Grid Array			1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B728	3	2.6 mm	35 mm	No		e1	650 MHz				35 mm
XC4010-10CB196M	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	400	CMOS			8000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		2.921 mm	34.29 mm	No	1120 flip-flops; typical gates = 8000-10000						34.29 mm
5962-9851301QYB	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	576	CMOS	MIL-PRF-38535 Class Q		10000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 30000	e0	166 MHz				39.37 mm
5962-9851301QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	1368	Yes	3.6 V	576	CMOS	MIL-PRF-38535 Class Q	192	10000	3.3	3.3 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	3 V	.635 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 30000	e4	166 MHz		192		39.37 mm
5962-8994801MTA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
5962-8982301MYA	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	14 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0					27.432 mm
5962-9957201QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	6912	Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q	162	322970	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	322970 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.0226 mm	39.37 mm	Yes		e4			162		39.37 mm
5962-9473001MYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4					39.37 mm
5962-8863802XC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No		100	CMOS			1800	5		Grid Array				2.54 mm	125 °C (257 °F)	15 ns	100 CLBS, 1800 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4	33 MHz				27.94 mm
XC7V285T-2FFG484E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4			No		e1		30 s		250 °C (482 °F)
5962-8994802XC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Rectangular		Ceramic, Metal-Sealed Cofired		No	5.5 V	64	CMOS	MIL-STD-883		2000	5		Grid Array			4.5 V		125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	R-CPGA-P84				No		e4	25 MHz
5962R9957401QXC	Xilinx	FPGA	Military		560	HCGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	6144	CMOS	MIL-PRF-38535 Class Q		1124022	2.5		Grid Array, Heat Sink/Slug			2.375 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X560		4.9 mm	42.5 mm	No		e0					42.5 mm
5962-9561201MXX	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired		No		484	CMOS	MIL-STD-883		6500	5		Grid Array				2.54 mm	125 °C (257 °F)	4.1 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	Typical gates = 6500-7500	e4	188 MHz				42.164 mm
XC3190A-5CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS		142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164	1	3.302 mm	28.702 mm	No	Typical gates = 5000-6000	e0	188 MHz		142		28.702 mm
XC3090-70PG175M	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired	320	No		320	CMOS		144	5000	5	5 V	Grid Array	PGA176,16X16MOD	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e3	70 MHz		144		42.164 mm
XQVR600-4CBG228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	3456	CMOS			661111	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)		3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3					39.37 mm
XC3142-5PQ100B	Xilinx	FPGA	Military	Gull Wing	100	QFP	Rectangular		Plastic/Epoxy	144	Yes		144	CMOS	38535Q/M;38534H;883B	82	3000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 3000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz	30 s	82	225 °C (437 °F)	20 mm
XC4025E-3PG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No		e0	125 MHz				52.324 mm
5962-8982302MYA	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0					27.432 mm
XC3042-100PG132B	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	MIL-STD-883 Class B	96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		100 MHz		96		37.084 mm
XC7VX485T-1LFFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes		75900							Grid Array				1 mm	125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1					42.5 mm
XC4010-6CB196B	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS	MIL-STD-883 Class B	160	8000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	6 ns	400 CLBS, 8000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F196	1	3.302 mm	28.702 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	69 MHz		160		28.702 mm
5962-9473001MXX	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e4					47.244 mm
XC3090-50PG175MSPC0109	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	320	CMOS			9000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		320 CLBS, 9000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.5052 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz				42.164 mm
XQV100-4CBG228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	2700	Yes	2.625 V	600	CMOS	MIL-PRF-38535	162	108904	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	600 CLBS, 108904 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3			162		39.37 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.