Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
M38510/60604BXX	Texas Instruments	FPGA	Military	Pin/Peg	68	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS			4000	5		Grid Array			4.5 V		125 °C (257 °F)		4000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P68				No
M38510/60811BZX	Texas Instruments	FPGA	Military	Flat	196	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V		CMOS			11000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)		11000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	34.29 mm	No							34.29 mm
5962-01-393-7814	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular	Ceramic	547	Yes			CMOS	38535Q/M;38534H;883B	69		5	5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					69
TPC1010AMGB68B	Texas Instruments	FPGA	Military	Pin/Peg	68	PGA		Ceramic	295	No			CMOS	38535Q/M;38534H;883B	57		5	5 V	Grid Array	PGA68(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular					No					57
5962-9215602MYA	Texas Instruments	FPGA	Military	Flat	172	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	1232	CMOS			8000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	5.2 ns	8000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F172		3.175 mm	29.972 mm	No		e0	60 MHz	30 s		225 °C (437 °F)	29.972 mm
TPC1280MGB176-1	Texas Instruments	FPGA	Military	Pin/Peg	176	HPGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	1232	CMOS	MIL-STD-883		8000	5		Grid Array, Heat Sink/Slug			4.5 V	2.54 mm	125 °C (257 °F)		1232 CLBS, 8000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P176		5.46 mm	39.88 mm	No		e4	50 MHz				39.88 mm
TPC1280GB-177M	Texas Instruments	FPGA	Military	Pin/Peg	177	PGA	Square	Ceramic	1232	No			CMOS		140		5	5 V	Grid Array	HPGA177,15X15	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P177				No			39 MHz		140
M38510/60708BZX	Texas Instruments	FPGA	Military	No Lead	180	QCCN	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V		CMOS			8000	5		Chip Carrier			4.5 V		125 °C (257 °F)		8000 Gates	-55 °C (-67 °F)		Quad	S-CQCC-N180				No
TPC1280MGB176	Texas Instruments	FPGA	Military	Pin/Peg	176	HPGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	1232	CMOS	MIL-STD-883		8000	5		Grid Array, Heat Sink/Slug			4.5 V	2.54 mm	125 °C (257 °F)		1232 CLBS, 8000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P176		5.46 mm	39.88 mm	No		e4	39 MHz				39.88 mm
TPC1010AMHT84B-1	Texas Instruments	FPGA	Military	Flat	84	QFF	Square	Ceramic	295	Yes			CMOS	38535Q/M;38534H;883B	57		5	5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F84				No					57
5962-9096504MUA	Texas Instruments	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	547	CMOS			1200	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	4.7 ns	547 CLBS, 1200 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No		e0	44 MHz	30 s		225 °C (437 °F)	27.94 mm
TPC1020AMGB84	Texas Instruments	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	547	No	5.5 V	547	CMOS		69	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	19.332 ns	547 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.21 mm	27.94 mm	No	MAX 69 I/OS; 273 flip-flops				69		27.94 mm
TPC1020AMGB84B	Texas Instruments	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	547	No	5.5 V	547	CMOS	38535Q/M;38534H;883B	69	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	19.332 ns	547 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.21 mm	27.94 mm	No	MAX 69 I/OS; 273 flip-flops				69		27.94 mm
5962-9322101MXA	Texas Instruments	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	684	No	5.5 V	684	CMOS			8000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	6.1 ns	684 CLBS, 8000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P132		4.318 mm	34.544 mm	No		e0	54 MHz	30 s		225 °C (437 °F)	34.544 mm
TPC1020AMHFG84B-1	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular	Ceramic	547	Yes			CMOS	38535Q/M;38534H;883B	69		5	5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					69
5962-9225202MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	466	Yes		196	CMOS	MIL-STD-883	112	4000	5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)		196 CLBS, 4000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4			112		28.702 mm
5962-9851001NTC	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class N		22000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Gold	Quad	S-PQFP-G240		4.1 mm	32 mm	No	Maximum usable gates 65000	e4	166 MHz				32 mm
XC3030-50PG84MSPC0104	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	100	CMOS			3000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		100 CLBS, 3000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		50 MHz				27.94 mm
XQVU065-1RFC1517M	Xilinx	FPGA	Military	Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes		44760			520		.95		Grid Array					125 °C (257 °F)		44760 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1517			40 mm			e0			520		40 mm
5962-8971303MMX	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F100		3.429 mm	19.05 mm	No							19.05 mm
XC7V1500T-2FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes		229050							Grid Array				1 mm	125 °C (257 °F)		229050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XQV600-4BGG432N	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	3456	CMOS	MIL-PRF-38535		661111	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1		30 s		260 °C (500 °F)	40 mm
5962-9230503MZC	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired	950	Yes			CMOS	MIL-STD-883	160		5	5 V	Flatpack, Guard Ring	QFL196,1.4SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4	77 MHz		160		28.702 mm
XC4010-10PG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	400	CMOS			8000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.064 mm	47.244 mm	No	1120 flip-flops; typical gates = 8000-10000						47.244 mm
5962-9471202MZX	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	238	Yes			CMOS	MIL-STD-883	77		5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4	90.9 MHz		77		19.05 mm
5962-8863803MXC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No				MIL-STD-883					Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4					27.94 mm
XQ4013XL-3BG256N	Xilinx	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS	MIL-PRF-38535	192	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Typical gates = 10000 to 30000	e0	166 MHz	30 s	192	225 °C (437 °F)	27 mm
5962-8971303QTA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS	MIL-PRF-38535 Class Q		4200	5		Flatpack			4.5 V		125 °C (257 °F)	7 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							100 MHz
XC4010E-4PG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired	400	No	5.5 V	400	CMOS		160	7000	5	5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.7 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	Typical gates = 7000-20000		111 MHz		160		47.244 mm
XC3120-5PQ100B	Xilinx	FPGA	Military	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes		64	CMOS	38535Q/M;38534H;883B	64	1300	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	64 CLBS, 1300 Gates	-55 °C (-67 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800	e0	190 MHz	30 s	64	225 °C (437 °F)	20 mm
5962-9851301QZB	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	576	CMOS	MIL-PRF-38535 Class Q		10000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 30000	e0	166 MHz				39.37 mm
XC3142A-5PG84M	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No		144	CMOS		74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 2000-3000		188 MHz		74		27.94 mm
5962-8971302MNX	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC3120-5CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS		64	1300	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	64 CLBS, 1300 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800		190 MHz		64		19.05 mm
5962-9561002MUC	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No			CMOS	MIL-STD-883	96		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No		e4	230 MHz		96		37.084 mm
XC4020E-4PGG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e3	111 MHz				47.244 mm
5962-8971302MZC	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No			CMOS	MIL-STD-883	96		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No		e4	70 MHz		96		37.084 mm
XC3090-70CB164MSPC0107	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000	e0	70 MHz				28.702 mm
XC4013E-3PGG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	576	CMOS			10000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		576 CLBS, 10000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e3	125 MHz				47.244 mm
XC7V2000T-2FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V	1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
5962-9225203MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	466	Yes			CMOS	MIL-STD-883	112		5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	133.3 MHz		112		28.702 mm
XC4010E-4PGG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	400				7000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	2.7 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		5.207 mm	47.244 mm		Max usable 20000 Logic gates		111 MHz				47.244 mm
5962-9957401NUX	Xilinx	FPGA	Military	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	6144	CMOS	MIL-PRF-38535 Class N		1124022	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	6144 CLBS, 1124022 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B560		1.7 mm	42.5 mm	Yes							42.5 mm
XC3042-70CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS		82	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	70 MHz		82		19.05 mm
5962-8863805XC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS	MIL-STD-883		1800	5		Grid Array			4.5 V		125 °C (257 °F)		1800 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84				No
5962-8971301MNC	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
5962-8971301MXC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	MIL-STD-883	74	4200	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	14 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4	50 MHz		74		27.94 mm
5962-9471201MXC	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No		e4					34.544 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.