Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5962-9215602MYX	Texas Instruments	FPGA	Military	Flat	172	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	1232	CMOS			8000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	5.2 ns	1232 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F172		2.9464 mm	29.972 mm	No			60 MHz				29.972 mm
M38510/60711BTX	Texas Instruments	FPGA	Military	Pin/Peg	208	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS			11000	5		Grid Array			4.5 V		125 °C (257 °F)		11000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P208				No
TPC1010AMGB84-1	Texas Instruments	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic	295	No			CMOS		57		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P84				No					57
M38510/60608BZX	Texas Instruments	FPGA	Military	Pin/Peg	120	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS			8000	5		Grid Array			4.5 V		125 °C (257 °F)		8000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P120				No
TPC1240MGB133-1	Texas Instruments	FPGA	Military	Pin/Peg	133	PGA	Square		Ceramic, Metal-Sealed Cofired	684	No	5.5 V	684	CMOS	MIL-STD-883	104	4000	5	5 V	Grid Array	PGA133M,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		684 CLBS, 4000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P133		4.27 mm	34.544 mm	No			55 MHz		104		34.544 mm
M38510/60611BNX	Texas Instruments	FPGA	Military	Pin/Peg	144	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS			11000	5		Grid Array			4.5 V		125 °C (257 °F)		11000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P144				No
TPC1280MGB177-1	Texas Instruments	FPGA	Military	Pin/Peg	177	HPGA	Square		Ceramic, Metal-Sealed Cofired	1232	No	5.5 V	1232	CMOS	MIL-STD-883	140	8000	5	5 V	Grid Array, Heat Sink/Slug	HPGA177,15X15	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		1232 CLBS, 8000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P177		5.46 mm	39.88 mm	No			50 MHz		140		39.88 mm
5962-9215601MYA	Texas Instruments	FPGA	Military	Flat	172	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	1232	CMOS			8000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	6.1 ns	8000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F172		3.175 mm	29.972 mm	No		e0	41 MHz	30 s		225 °C (437 °F)	29.972 mm
5962-9322102MXX	Texas Instruments	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	684	No	5.5 V	684	CMOS	38535Q/M;38534H;883B	104	8000	5	5 V	Grid Array	PGA133M,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	5.2 ns	684 CLBS, 8000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		4.318 mm	34.544 mm	No			63 MHz		104		34.544 mm
TPC1020AMGB84-1	Texas Instruments	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic	547	No			CMOS		69		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P84				No					69
M38510/60604BXX	Texas Instruments	FPGA	Military	Pin/Peg	68	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS			4000	5		Grid Array			4.5 V		125 °C (257 °F)		4000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P68				No
M38510/60811BZX	Texas Instruments	FPGA	Military	Flat	196	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V		CMOS			11000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)		11000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	34.29 mm	No							34.29 mm
5962-01-393-7814	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular		Ceramic	547	Yes			CMOS	38535Q/M;38534H;883B	69		5	5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					69
TPC1010AMGB68B	Texas Instruments	FPGA	Military	Pin/Peg	68	PGA			Ceramic	295	No			CMOS	38535Q/M;38534H;883B	57		5	5 V	Grid Array	PGA68(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular					No					57
5962-9215602MYA	Texas Instruments	FPGA	Military	Flat	172	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	1232	CMOS			8000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	5.2 ns	8000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F172		3.175 mm	29.972 mm	No		e0	60 MHz	30 s		225 °C (437 °F)	29.972 mm
XQ6VLX240T-1LRF784M	Xilinx	FPGA	Military	Ball	784	BGA	Square		Plastic/Epoxy	241152	Yes		18840	CMOS		400				Grid Array	BGA784,28X28,40			1 mm	125 °C (257 °F)	0.85 ns	18840 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B784		3.17 mm	29 mm			e0			400		29 mm
XC4010-5CB196B	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	400		MIL-STD-883 Class B		7000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		400 CLBS, 7000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	28.702 mm	No							28.702 mm
5962-9473002MYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	1368	Yes			CMOS	MIL-STD-883	192		5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4	90.9 MHz		192		39.37 mm
5962-8971303MYA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC2018-33PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS	MIL-STD-883 Class B	74	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	20 ns	100 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	174 flip-flops; typical gates = 1000-1500		33 MHz		74		27.94 mm
5962-9230502NYX	Xilinx	FPGA	Military	Flat	164	QFF	Square				Yes	5.5 V		CMOS	MIL-PRF-38535 Class N		5000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	6 ns	5000 Gates	-55 °C (-67 °F)		Quad	S-XQFP-F164		2.92 mm	28.702 mm	No			50 MHz				28.702 mm
XC3090-70CQ164MSPC0107	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	320	CMOS			9000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		70 MHz				27.432 mm
XC4062XL-3CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2304	CMOS			40000	3.3		Flatpack, Guard Ring			3 V	.65 mm	125 °C (257 °F)		2304 CLBS, 40000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No							39.37 mm
XC3090-100CB164MSPC0107	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000	e0	100 MHz				28.702 mm
5962R9957301NUA	Xilinx	FPGA	Military	Ball	432	LBGA	Square		Plastic/Epoxy	15552	Yes	2.625 V		CMOS	MIL-PRF-38535	316	661111	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	661111 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432		1.7 mm	40 mm	Yes		e0			316		40 mm
XQR5VFX130-1CF1752B	Xilinx	FPGA	Military		1752	CGA	Square	1M Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	1.05 V	10240	CMOS				1		Grid Array			.95 V	1 mm	125 °C (257 °F)		10240 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X1752		9.6 mm	45 mm			e0					45 mm
XC2064-50PG68M	Xilinx	FPGA	Military	Pin/Peg	68	PGA	Square		Ceramic, Metal-Sealed Cofired	64	No	5.5 V	64	CMOS		58	600	5	5 V	Grid Array	PGA68,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	15 ns	64 CLBS, 600 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P68		4.064 mm	27.94 mm	No	122 flip-flops; typical gates = 600-1000		50 MHz		58		27.94 mm
XC3042-50PG132BSPC0107	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired		No		144	CMOS			2000	5		Grid Array				2.54 mm	125 °C (257 °F)	14 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000		50 MHz				37.084 mm
5962-8971303MZX	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns		-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No							37.084 mm
5962-9471202MYC	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	6 ns		-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
5962-9851001NXX	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Typical gates = 22000 to 65000		166 MHz				32 mm
XC7V585T-1LFFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square		Plastic/Epoxy		Yes		91050							Grid Array				1 mm	125 °C (257 °F)		91050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
5962-8982303MXX	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired		No		320	CMOS	MIL-STD-883		5000	5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No			100 MHz				42.164 mm
XC7V585T-1FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes		91050							Grid Array					125 °C (257 °F)		91050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
5962-9561001MUC	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	MIL-STD-883	96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	Typical gates = 2000-3000	e4	188 MHz		96		37.084 mm
XQVR300-4CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	6912	Yes	2.625 V	1536	CMOS		316	322970	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	QFP228(UNSPEC)	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)		1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0			316		39.37 mm
XC7V585T-3FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes		91050							Grid Array					125 °C (257 °F)		91050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC3020-100CB100MSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		64	CMOS			1000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500	e0	100 MHz				19.05 mm
5962-9957501QYB	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	3136	CMOS	MIL-PRF-38535 Class Q		55000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0	200 MHz				39.37 mm
5962-8982303MTC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes	5.5 V		CMOS	MIL-STD-883	142	9000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		9000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No		e4	100 MHz		142		28.702 mm
XC3042-100PG132M	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS		96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e3	100 MHz		96		37.084 mm
XQVR600-4CB228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	15552	Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class Q	316	661111	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)		3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0			316		39.37 mm
5962-9851101NTB	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS	MIL-PRF-38535 Class N	193	40000	3.3	3.3 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No	Maximum usable gates 130000	e0	166 MHz		193		32 mm
XC7V585T-2FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes		91050							Grid Array					125 °C (257 °F)		91050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
5962-8994803MYC	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes	5.5 V		CMOS	MIL-STD-883	64	2000	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.683 mm	17.27 mm	No		e4	100 MHz		64		17.27 mm
5962-8863801XX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm
5962-8971303M9C	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes	5.5 V	144	CMOS	MIL-STD-883	82	4200	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	7 ns	4200 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.2258 mm	19.05 mm	No		e4	100 MHz		82		19.05 mm
XC4003E-1PGG120M	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	100	CMOS			2000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		100 CLBS, 2000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No		e3	166 MHz				34.544 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.