Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4003E-3PG120M	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS		80	2000	5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		100 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No			125 MHz		80		34.544 mm
XQ2V3000-4BG728N	Xilinx	FPGA	Military	Ball	728	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA728,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B728	3	2.6 mm	35 mm	No		e0	650 MHz		516		35 mm
5962-8863802MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No				MIL-STD-883					Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm
XC3090-100CB164BSPC0107	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000	e0	100 MHz				28.702 mm
5962-9851301NUB	Xilinx	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535 Class N		10000	3.3		Grid Array			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B256		2.55 mm	27 mm	No	Maximum usable gates 30000	e0	166 MHz				27 mm
XC3020-70PG84MSPC0110	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	64	CMOS			2000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		70 MHz				27.94 mm
XQ7V585T-1RF1157M	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy	582720	Yes	1.03 V	45525	HKMG		600		1		Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	45525 CLBS	-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B1157		3.48 mm	35 mm			e0			600		35 mm
XC3090-50CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		320	CMOS	MIL-STD-883 Class B		5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		320 CLBS, 5000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA		50 MHz				28.702 mm
5962-8863804MXC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No				MIL-STD-883					Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4					27.94 mm
5962-8994803MTA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC3020-50CQ100BSPC0110	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	14 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				17.272 mm
5962-9957401QXA	Xilinx	FPGA	Military	Ball	560	BGA	Square	Ceramic, Metal-Sealed Cofired	27648	Yes	2.625 V		CMOS	MIL-PRF-38535 Class Q	404	1124022	2.5	1.2/3.6,2.5 V	Grid Array	CGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)		1124022 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-B560		5.35 mm	42.5 mm	No		e0			404		42.5 mm
5962-8994801MMC	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
5962R9957201NTX	Xilinx	FPGA	Military	Gull Wing	240	QFP	Square	Plastic/Epoxy		Yes	2.625 V		CMOS			322970	2.5		Flatpack			2.375 V		125 °C (257 °F)	0.8 ns	322970 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240				Yes
XQ7VX330T-1RF1761M	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG		700		1		Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	25500 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1761		4.57 mm	42.5 mm			e0			700		42.5 mm
XC3090-100PG175M	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No		320	CMOS		144	5000	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e0	100 MHz		144		42.164 mm
XC3020-70CQ100MSPC0107	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				17.272 mm
XC3090-50CQ164MSPC0109	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	320	CMOS			9000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)		320 CLBS, 9000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz				27.432 mm
XQR2V3000-4CG717V	Xilinx	FPGA	Military		717	CGA	Square	Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	CGA717,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X717		3.3 mm	35 mm	No		e0	650 MHz		516		35 mm
XC3042-70CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS	MIL-STD-883 Class B	82	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.429 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	70 MHz		82		19.05 mm
XQ2V6000-4CF1144M	Xilinx	FPGA	Military		1144	CGA	Square	Ceramic, Metal-Sealed Cofired	76032	Yes	1.575 V	8448	CMOS		824	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	CGA1144,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.44 ns	8448 CLBS, 6000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X1144	1	7 mm	35 mm	No		e0	650 MHz		824		35 mm
XC3020-70PG84BSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		64	CMOS			1000	5		Grid Array				2.54 mm	125 °C (257 °F)	9 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	256 flip-flops; typical gates = 1000-1500		70 MHz				27.94 mm
5962-9230501MZX	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4					28.702 mm
XC4005-5CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	196		MIL-STD-883 Class B		3000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		196 CLBS, 3000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No							28.702 mm
XQ6VLX240T-1FFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes		18840	CMOS		600				Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.79 ns	18840 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XC3030-70PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic	100	No			CMOS	38535Q/M;38534H;883B	74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P84				No			70 MHz		74
XQ7A100T-1CS324M	Xilinx	FPGA	Military	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS		210		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	7925 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm	No			1098 MHz		210		15 mm
XC3090-50CB164BSPC0107	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		320 CLBS, 5000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000		50 MHz				28.702 mm
XC7V585T-2FFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy		Yes		91050							Grid Array					125 °C (257 °F)		91050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
5962-9561101MXX	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No		320	CMOS			5000	5		Grid Array				2.54 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	Typical gates = 5000-6000		188 MHz				42.164 mm
5962-9561102MXX	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No		e4					42.164 mm
XQ4036XL-3PG411M	Xilinx	FPGA	Military	Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired	3078	No	3.6 V	1296	CMOS	MIL-PRF-38535	288	22000	3.3	3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	SPGA411,39X39	Field Programmable Gate Arrays	3 V	2.54 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P411		5.969 mm	52.324 mm	No	Typical gates = 22000 to 65000	e3	166 MHz		288		52.324 mm
5962-8982302MXX	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No		320	CMOS	MIL-STD-883		5000	5		Grid Array				2.54 mm	125 °C (257 °F)	2 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No		e4	70 MHz				42.164 mm
5962-9851001NUB	Xilinx	FPGA	Military	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class N		22000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B352		1.7 mm	35 mm	No	Maximum usable gates 65000	e0	166 MHz				35 mm
5962-8994803MTX	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC7V450T-2FFG1157E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XQ7V585T-1RF1761M	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy	582720	Yes	1.03 V	45525	HKMG		850		1		Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	45525 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1761		4.57 mm	42.5 mm			e0			850		42.5 mm
XQ6VLX130T-1LRF1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes		10000	CMOS		600				Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	10000 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XQR2V6000-4CF1144H	Xilinx	FPGA	Military		1144	CGA	Square	Ceramic, Metal-Sealed Cofired	76032	Yes	1.575 V	8448	CMOS		824	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	CGA1144,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.44 ns	8448 CLBS, 6000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X1144	1	7 mm	35 mm	No		e0	650 MHz		824		35 mm
5962-01-356-8165	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic	100	No			CMOS	38535Q/M;38534H;883B	74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P84				No			50 MHz		74
XQR2V3000-4CG717M	Xilinx	FPGA	Military		717	CGA	Square	Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	CGA717,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-X717		3.3 mm	35 mm	No			650 MHz		516		35 mm
5962-9230502MZX	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		400	CMOS			8000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	28.702 mm	No							28.702 mm
5962-9561201MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4					28.702 mm
5962-9851301NUC	Xilinx	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535 Class N		10000	3.3		Grid Array			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Gold	Bottom	S-PBGA-B256		2.55 mm	27 mm	No	Maximum usable gates 30000	e4	166 MHz				27 mm
XQ4085XL-3BGG432N	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136				55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	2.9 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	166 MHz				40 mm
XC2018-100PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No				MIL-STD-883 Class B					Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm
5962-9957301NTX	Xilinx	FPGA	Military	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class N		661111	2.5		Flatpack, Heat Sink/Slug, Fine Pitch			2.375 V	.5 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No							32 mm
5962-9957201NTB	Xilinx	FPGA	Military	Gull Wing	240	QFP	Square	Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS	MIL-PRF-38535	166	322970	2.5	1.2/3.6,2.5 V	Flatpack	QFP240,1.3SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)	0.8 ns	322970 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	Yes		e0			166		32 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.