Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5962-9561202MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4					28.702 mm
XC3042-50CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		144	CMOS	MIL-STD-883 Class B		2000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		144 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		3.429 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		50 MHz				19.05 mm
XQ4VSX55-10FFG1148M	Xilinx	FPGA	Military	Ball	1148	BGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS						Grid Array	BGA1148,34X34,40		1.14 V	1 mm	125 °C (257 °F)	0.78 ns		-55 °C (-67 °F)		Bottom	S-PBGA-B1148		3.4 mm	35 mm								35 mm
5962-8971302MYX	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC7V285T-2FFG784E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1761	4			No		e1		30 s		245 °C (473 °F)
XQ6VLX130T-1LRF784M	Xilinx	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes		10000	CMOS		400				Grid Array	BGA784,28X28,40			1 mm	125 °C (257 °F)	0.85 ns	10000 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B784		3.17 mm	29 mm			e0			400		29 mm
XC2064-33PG68M	Xilinx	FPGA	Military	Pin/Peg	68	PGA	Square	Ceramic	64	No			CMOS		58		5	5 V	Grid Array	PGA68,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P68				No			33 MHz		58
XC3042-50CQ100B	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes	5.5 V	144	CMOS	38535Q/M;38534H;883B	82	4200	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	14 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops	e0	50 MHz		82		17.272 mm
5962-9851001NTX	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class N		22000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Maximum usable gates 65000		166 MHz				32 mm
XC3090-50PG175M	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No		320	CMOS		144	5000	5	5 V	Grid Array	PGA176,16X16MOD	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)		320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA		50 MHz		144		42.164 mm
5962-01-414-9654	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic	144	Yes			CMOS	38535Q/M;38534H;883B	82		5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F100				No			50 MHz		82
XQR4VFX140-10CF1509V	Xilinx	FPGA	Military		1509	CGA	Square	Ceramic, Metal-Sealed Cofired	142128	Yes	1.26 V	16128	CMOS	38535V;38534K;883S	768		1.2	1.2,2.5,3.3 V	Grid Array	PGA1509,39X39,39	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		16128 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1509		8.47 mm	40 mm	No			1028 MHz		768		40 mm
5962-8982301MYX	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	14 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0					27.432 mm
XC3195A-4PG175B	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No		484	CMOS	MIL-STD-883 Class B		6500	5		Grid Array				2.54 mm	125 °C (257 °F)	3.3 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No							42.164 mm
XQ6VSX475T-1RF1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V	37200	CMOS		600		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	125 °C (257 °F)	0.79 ns	37200 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XC4003E-1PG120M	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS		80	2000	5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		100 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No			166 MHz		80		34.544 mm
XC4010E-3PG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	400	CMOS			7000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		400 CLBS, 7000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No			125 MHz				47.244 mm
XC7VX485T-1LFFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes		75900							Grid Array				1 mm	125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4		35 mm	No		e1					35 mm
XC3042-100PG84M	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No		144	CMOS		74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		100 MHz		74		27.94 mm
5962-9473001MXC	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e4					47.244 mm
5962-9957501NX	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS	MIL-PRF-38535		55000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Typical gates = 55000 to 180000		200 MHz				32 mm
XC7V1500T-2FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes		229050							Grid Array				1 mm	125 °C (257 °F)		229050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XQ6VLX130T-2RF1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS		600				Grid Array	BGA1156,34X34,40		.95 V	1 mm	125 °C (257 °F)	0.67 ns	10000 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm			e0	1286 MHz		600		35 mm
5962-9752301QXX	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	400		MIL-PRF-38535 Class Q		7000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	3.9 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	Typical gates = 7000-20000						47.244 mm
5962-8982303MYX	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No							27.432 mm
5962R9957201NUX	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V		CMOS			322970	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	322970 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B432		1.7 mm	40 mm	Yes							40 mm
5962-9473001MZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4					39.37 mm
XC3090-100PG175BSPC0107	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No		320	CMOS			5000	5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000		100 MHz				42.164 mm
XC4025E-4PGG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	1024	CMOS			15000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	3.9 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Typical gates = 15000-45000	e3	111 MHz				52.324 mm
XQ4085XL-3BG432N	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136				55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	2.9 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	166 MHz				40 mm
XQV600-4HQ240N	Xilinx	FPGA	Military	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS	MIL-PRF-38535	166	661111	2.5	1.2/3.6,2.5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		30 s	166	225 °C (437 °F)	32 mm
5962-9851101QYB	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2304	CMOS	MIL-PRF-38535 Class Q		40000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 130000	e0	166 MHz				39.37 mm
XQ6VLX550T-1LRF1759M	Xilinx	FPGA	Military	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes		42960	CMOS		840				Grid Array	BGA1759,42X42,40			1 mm	125 °C (257 °F)	0.85 ns	42960 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	4.37 mm	42.5 mm			e0			840		42.5 mm
5962-9851001QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	3078	Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class Q	192	22000	3.3	3.3 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	3 V	.635 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 65000	e4	166 MHz		192		39.37 mm
XC4003A-6PG120B	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square	Ceramic, Metal-Sealed Cofired	238	No	5.5 V	100	CMOS	MIL-STD-883 Class B	80	2500	5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	6 ns	100 CLBS, 2500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No	360 flip-flops; typical gates = 2500-3000		90.9 MHz		80		34.544 mm
5962-9851001QZB	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class Q		22000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 65000	e0	166 MHz				39.37 mm
XQ7VX485T-1RF1930M	Xilinx	FPGA	Military	Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG		700		1		Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	37950 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1930		4.27 mm	45 mm						700		45 mm
XC3090-100CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS		142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164	1	2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e0	100 MHz		142		28.702 mm
XC4008E-1PGG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	324	CMOS			6000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		324 CLBS, 6000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No		e3	166 MHz				47.244 mm
5962-9230503MZX	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	28.702 mm	No							28.702 mm
5962-9851301QYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	1368	Yes	3.6 V	576	CMOS	MIL-PRF-38535 Class Q	192	10000	3.3	3.3 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	3 V	.635 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 30000	e4	166 MHz		192		39.37 mm
XC7VX485T-3FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	75900					1		Grid Array			.97 V		125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC4025E-2PGG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e3	125 MHz				47.244 mm
XC4005E-1PGG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	196	CMOS			3000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		196 CLBS, 3000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No		e3	166 MHz				42.164 mm
XC3030-100PG84M	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No		100	CMOS		74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	7 ns	100 CLBS, 1500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA		100 MHz		74		27.94 mm
XC3020-50PG84BSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		64	CMOS			1000	5		Grid Array				2.54 mm	125 °C (257 °F)	14 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	256 flip-flops; typical gates = 1000-1500		50 MHz				27.94 mm
XC3042-100CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS		82	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	100 MHz		82		19.05 mm
XC7V585T-1FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes		91050							Grid Array				1 mm	125 °C (257 °F)		91050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.