Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5962-9561202MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	484	Yes			CMOS	MIL-STD-883	142		5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	230 MHz		142		28.702 mm
XC4028EX-4PG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square		Ceramic, Metal-Sealed Cofired		No	3.6 V	1024	CMOS			18000	3.3		Grid Array			3 V	2.54 mm	125 °C (257 °F)		1024 CLBS, 18000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Can also use 50000 gates						52.324 mm
XQV2000E-6FG1156N	Xilinx	FPGA	Military	Ball	1156	BGA	Square		Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	38535Q/M;38534H;883B	804	2541952	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	125 °C (257 °F)		9600 CLBS, 2541952 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e0	357.2 MHz	30 s	804	225 °C (437 °F)	35 mm
XC7V2000T-1LFFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square		Plastic/Epoxy		Yes		305400							Grid Array					125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
XC7V450T-3FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
5962-8971302QTA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS	MIL-PRF-38535 Class Q		4200	5		Flatpack			4.5 V		125 °C (257 °F)	9 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							70 MHz
XC7V450T-3FFG784E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1761	4			No		e1		30 s		245 °C (473 °F)
XQ4VLX40-10FFG668M	Xilinx	FPGA	Military	Ball	668	BGA	Square		Plastic/Epoxy		Yes	1.26 V		CMOS						Grid Array	BGA668,26X26,40		1.14 V	1 mm	125 °C (257 °F)	0.78 ns		-55 °C (-67 °F)		Bottom	S-PBGA-B668		2.85 mm	27 mm								27 mm
XQV2000E-6FGG1156N	Xilinx	FPGA	Military	Ball	1156	BGA	Square		Plastic/Epoxy		Yes	1.89 V	9600	CMOS			2541952	1.8		Grid Array			1.71 V	1 mm	125 °C (257 °F)		9600 CLBS, 2541952 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	357.2 MHz				35 mm
XC3142-5CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS		82	3000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 3000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz		82		19.05 mm
XC4025E-1PGG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No		e3	166 MHz				52.324 mm
5962-9957201QZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q		322970	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	Yes							39.37 mm
XC7V2000T-3FFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square		Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V		125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
5962-9850901QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	2432	Yes	5.5 V		CMOS	MIL-PRF-38535 Class Q	192	28000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.2 ns	28000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.0226 mm	39.68 mm	No		e4	143 MHz		192		39.68 mm
XQ4VLX60-10FFG1148M	Xilinx	FPGA	Military	Ball	1148	BGA	Square		Plastic/Epoxy		Yes	1.26 V		CMOS						Grid Array	BGA1148,34X34,40		1.14 V	1 mm	125 °C (257 °F)	0.78 ns		-55 °C (-67 °F)		Bottom	S-PBGA-B1148		3.4 mm	35 mm								35 mm
XC7V855T-3FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XQV2000E-6BGG560N	Xilinx	FPGA	Military	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	1.89 V	9600	CMOS			2541952	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	125 °C (257 °F)		9600 CLBS, 2541952 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	357.2 MHz	30 s		260 °C (500 °F)	42.5 mm
XC3020-50CQ100BSPC0107	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	14 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				17.272 mm
5962-9851101QX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2304	CMOS	MIL-PRF-38535		40000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 40000 to 130000		166 MHz				39.37 mm
XC7V855T-3FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
5962-9561001MZX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XQ7A100T-1MFG484M	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.05 V						1		Grid Array			.95 V	1 mm	125 °C (257 °F)	1.27 ns		-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0					23 mm
XC4010-10PG191B	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	400	CMOS	MIL-STD-883 Class B		8000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	1120 flip-flops; typical gates = 8000-10000						47.244 mm
5962-9957501QX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	3136	CMOS	MIL-PRF-38535		55000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 55000 to 180000		200 MHz				39.37 mm
XC3142A-5PQ100B	Xilinx	FPGA	Military	Gull Wing	100	QFP	Rectangular		Plastic/Epoxy	144	Yes		144	CMOS	38535Q/M;38534H;883B	82	3000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 3000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz	30 s	82	225 °C (437 °F)	20 mm
5962-8982301XX	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Rectangular		Ceramic, Metal-Sealed Cofired		No	5.5 V	320	CMOS	MIL-STD-883		9000	5		Grid Array			4.5 V		125 °C (257 °F)	14 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	R-CPGA-P175				No		e4	16 MHz
XC3090-50PG175B	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired	320	No		320	CMOS	MIL-STD-883 Class B	144	5000	5	5 V	Grid Array	PGA176,16X16MOD	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	14 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA		50 MHz		144		42.164 mm
5962-9851301NUX	Xilinx	FPGA	Military	Ball	256	BGA	Square		Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535		10000	3.3		Grid Array			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B256		2.55 mm	27 mm	No	Typical gates = 10000 to 30000		166 MHz				27 mm
5962-9561101MYX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		320	CMOS	MIL-STD-883		5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	Typical gates = 5000-6000	e4	188 MHz				28.702 mm
XC7V855T-1FFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square		Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
XC7V285T-1FFG484E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4			No		e1		30 s		250 °C (482 °F)
5962-8971302MXC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	MIL-STD-883	74	4200	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	9 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4	70 MHz		74		27.94 mm
XC7VX485T-2FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square		Plastic/Epoxy		Yes	1.03 V	75900					1		Grid Array			.97 V	1 mm	125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4		35 mm	No		e1					35 mm
XC3090-50CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		320 CLBS, 5000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA		50 MHz				28.702 mm
XC3120A-5CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS		64	1300	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	64 CLBS, 1300 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800		190 MHz		64		19.05 mm
5962-01-416-6251	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic	144	No			CMOS	38535Q/M;38534H;883B	74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P84				No			50 MHz		74
5962-9752401QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	1368	Yes	5.5 V	576	CMOS	MIL-PRF-38535 Class Q	192	10000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 10000-30000	e4	111 MHz		192		39.37 mm
XQR4062XL-3CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	60k Rad(Si)	Ceramic, Metal-Sealed Cofired	5472	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	3 V	.635 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228	1	3.302 mm	39.37 mm	No	Typical gates = 40000 to 130000	e0	166 MHz		384		39.37 mm
XC4025E-4CB228B	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	2432	Yes	5.5 V	1024	CMOS	MIL-STD-883 Class B	192	15000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	2.7 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228	1	3.302 mm	39.37 mm	No	Typical gates = 15000-45000	e0	111 MHz		192		39.37 mm
XC4005E-3PG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	196	CMOS			3000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		196 CLBS, 3000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No			125 MHz				42.164 mm
XQKU095-1RFA1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square		Plastic/Epoxy		Yes		67200					.95		Grid Array				1 mm	125 °C (257 °F)		67200 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.72 mm	35 mm			e0					35 mm
XC4003A-10CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	100	CMOS	MIL-STD-883 Class B		2500	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		100 CLBS, 2500 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		3.429 mm	19.05 mm	No	360 flip-flops; typical gates = 2500-3000						19.05 mm
5962-9561002MXC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No			CMOS	MIL-STD-883	74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4	230 MHz		74		27.94 mm
5962-9471202MXX	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square		Ceramic, Metal-Sealed Cofired	238	No			CMOS	MIL-STD-883	80		5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	6 ns		-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No		e4	90.9 MHz		80		34.544 mm
5962-9230501MYC	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4					28.702 mm
XC4010-6PG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square		Ceramic, Metal-Sealed Cofired	400	No	5.5 V	400	CMOS		160	8000	5	5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	6 ns	400 CLBS, 8000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Perpendicular	S-CPGA-P191		4.064 mm	47.244 mm	No	1120 flip-flops; typical gates = 8000-10000	e1	90.9 MHz		160		47.244 mm
XQ2V3000-4CG717M	Xilinx	FPGA	Military		717	CGA	Square		Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	CGA717,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X717	1	3.3 mm	35 mm	No		e0	650 MHz		516		35 mm
XC4006E-1PG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired	608	No	5.5 V	256	CMOS		125	4000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		256 CLBS, 4000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No			166 MHz		125		42.164 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.