Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XQ6VSX315T-1LFFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square		Plastic/Epoxy	314880	Yes		24600	CMOS		600					Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	24600 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
5962-8982303MUA	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5			Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0					27.432 mm
XC3090-70CQ164BSPC0109	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	320	CMOS			9000	5			Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		70 MHz				27.432 mm
5962-9851001QY	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	1296	CMOS	MIL-PRF-38535		22000	3.3			Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 22000 to 65000		166 MHz				39.37 mm
XC4010E-4PG191B	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square		Ceramic, Metal-Sealed Cofired	400	No	5.5 V	400	CMOS	MIL-STD-883 Class B	160	7000	5		5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.7 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	Typical gates = 7000-20000	e3	111 MHz		160		47.244 mm
XC3190A-4PG175B	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired		No		320	CMOS	MIL-STD-883 Class B		5000	5			Grid Array				2.54 mm	125 °C (257 °F)	3.3 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No		e0					42.164 mm
XC3020-100CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS		64	1000	5		5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	7 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	100 MHz		64		19.05 mm
5962-9561102MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes			CMOS	MIL-STD-883	142		5		5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	230 MHz		142		28.702 mm
5962-9561101MXC	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired	320	No		320	CMOS	MIL-STD-883	144	5000	5		5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	Typical gates = 5000-6000	e4	188 MHz		144		42.164 mm
XC7V450T-1LFFG484E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes										Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4			No		e1		30 s		250 °C (482 °F)
XC4025E-2PGG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5			Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No		e3	125 MHz				52.324 mm
5962-8994801MTC	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5			Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
5962-8971301MYA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5			Flatpack				.635 mm	125 °C (257 °F)	14 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC4013E-3PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	576	CMOS			10000	5			Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		576 CLBS, 10000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			125 MHz				47.244 mm
XC3020-50PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	64	No		64	CMOS	MIL-STD-883 Class B	64	1000	5		5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	14 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA		50 MHz		64		27.94 mm
5962-9851001NUC	Xilinx	FPGA	Military	Ball	352	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class N		22000	3.3			Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Gold	Bottom	S-PBGA-B352		1.7 mm	35 mm	No	Maximum usable gates 65000	e4	166 MHz				35 mm
XQV300-4BGG432N	Xilinx	FPGA	Military	Ball	432	LBGA	Square		Plastic/Epoxy		Yes	2.625 V	1536	CMOS	MIL-PRF-38535		322970	2.5			Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1		30 s		260 °C (500 °F)	40 mm
XQVR600-4CBG228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class Q		661111	2.5			Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)		3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3					39.37 mm
XQV600-4CB228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class Q		661111	2.5			Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0					39.37 mm
XQR2V1000-4BGG575N	Xilinx	FPGA	Military	Ball	575	BGA	Square		Plastic/Epoxy		Yes	1.575 V	1280	CMOS			1000000	1.5			Grid Array			1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No		e1	650 MHz				31 mm
5962-9225201MYX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5			Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4					28.702 mm
XC3030-70PG84MSPC0104	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	100	CMOS			3000	5			Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	9 ns	100 CLBS, 3000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		70 MHz				27.94 mm
XC3020-70CQ100MSPC0110	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5			Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				17.272 mm
XQR2V3000-4CGG717V	Xilinx	FPGA	Military		717	CGA	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	3584	CMOS			3000000	1.5			Grid Array			1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X717		3.3 mm	35 mm	No		e3	650 MHz				35 mm
XQR4VSX55-10CF1140V	Xilinx	FPGA	Military		1140	CGA	Square		Ceramic, Metal-Sealed Cofired	55296	Yes	1.26 V	6144	CMOS	38535V;38534K;883S	640		1.2		1.2,2.5,3.3 V	Grid Array	PGA1140,34X34,39	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		6144 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1140		8.47 mm	35 mm	No			1028 MHz		640		35 mm
XQRKU060-1CNA1509B	Xilinx	FPGA	Military		1509	CGA	Square	120k Rad(Si)	Ceramic, Metal-Sealed Cofired	725550	Yes		41460		MIL-PRF-38535 Class B	620			Box; Tray		Grid Array	CGA1509,39X39,40			1 mm	125 °C (257 °F)		41460 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1509		8.97 mm	40 mm		Tray contains 1 device				620		40 mm
5962-9461701MPX	Xilinx	FPGA	Military	Through-Hole	8	DIP	Rectangular		Ceramic, Glass-Sealed		No				MIL-STD-883						In-Line				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-GDIP-T8		4.318 mm	7.62 mm	No							9.906 mm
XQVR1000-4CG560B	Xilinx	FPGA	Military		560	CGA	Square		Ceramic	27648	Yes			CMOS		404				1.2/3.6,2.5 V	Grid Array	CGA560,33X33,50	Field Programmable Gate Arrays		1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-XBGA-X560				No					404
XC3142A-5PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	38535Q/M;38534H;883B	74	2000	5		5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 2000-3000		188 MHz		74		27.94 mm
XC3090-70PG175BSPC0107	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired		No		320	CMOS			5000	5			Grid Array				2.54 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000		70 MHz				42.164 mm
XC3042-70PG132MSPC0107	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired		No		144	CMOS			2000	5			Grid Array				2.54 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000		70 MHz				37.084 mm
5962-9957401NUA	Xilinx	FPGA	Military	Ball	560	LBGA	Square		Plastic/Epoxy	27648	Yes	2.625 V	6144	CMOS	MIL-PRF-38535	404	1124022	2.5		1.2/3.6,2.5 V	Grid Array, Low Profile	BGA560,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	1124022 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B560		1.7 mm	42.5 mm	Yes		e0			404		42.5 mm
XQKU040-1RSA676M	Xilinx	FPGA	Military	Ball	676	BGA	Square		Plastic/Epoxy		Yes		30300					.95			Grid Array				1 mm	125 °C (257 °F)		30300 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B676		3.44 mm	27 mm			e0					27 mm
5962-8994802MMX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5			Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XC3142A-5PQ100M	Xilinx	FPGA	Military	Gull Wing	100	QFP	Rectangular		Plastic/Epoxy	144	Yes		144	CMOS		82	3000	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 3000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz	30 s	82	225 °C (437 °F)	20 mm
XC4025E-1PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired	1024	No	5.5 V	784	CMOS		256	13000	5		5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			166 MHz		256		47.244 mm
XC7VX485T-1FFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square		Plastic/Epoxy		Yes	1.03 V	75900					1			Grid Array			.97 V		125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
XQR2V3000-4CGG717M	Xilinx	FPGA	Military		717	CGA	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	3584	CMOS			3000000	1.5			Grid Array			1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X717		3.3 mm	35 mm	No		e3	650 MHz				35 mm
XC4010E-4CBG196M	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	400	CMOS			7000	5			Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	2.7 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F196		3.302 mm	34.29 mm	No	Typical gates = 7000-20000	e3	111 MHz				34.29 mm
XC7V450T-1FFG1157E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes										Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XQR2V6000-4CF1144M	Xilinx	FPGA	Military		1144	CGA	Square		Ceramic, Metal-Sealed Cofired	76032	Yes	1.575 V	8448	CMOS		824	6000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	CGA1144,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.44 ns	8448 CLBS, 6000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X1144		7 mm	35 mm	No		e0	650 MHz		824		35 mm
5962-8982302MUX	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5			Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0					27.432 mm
5962-9225202MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5			Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	6 ns		-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4					28.702 mm
5962-9752401QYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	1368	Yes	5.5 V	576	CMOS	MIL-PRF-38535 Class Q	192	10000	5		5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 10000-30000	e4	111 MHz		192		39.37 mm
5962-9225202MXX	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired		No		196	CMOS	MIL-STD-883		4000	5			Grid Array				2.54 mm	125 °C (257 °F)	6 ns	196 CLBS, 4000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No		e4					42.164 mm
5962-9230501MYX	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5			Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4					28.702 mm
XC3042-70PG132M	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS		96	2000	5		5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e3	70 MHz		96		37.084 mm
XC3090-70CB164BSPC0107	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5			Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000		70 MHz				28.702 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.