Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XQV300-4PQ240N	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS	MIL-PRF-38535	166	322970	2.5	1.2/3.6,2.5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		30 s	166	225 °C (437 °F)	32 mm
XC3020-70PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No		64	CMOS	MIL-STD-883 Class B	64	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	9 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA		70 MHz		64		27.94 mm
XC7V2000T-2FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V		125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC7V1500T-1FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes		229050							Grid Array				1 mm	125 °C (257 °F)		229050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC4062XL-3PG475M	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	2304	CMOS			40000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)		2304 CLBS, 40000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P475		5.334 mm	54.864 mm	No	Can also use 130000 gates						54.864 mm
XC4005-10PG156B	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	196	CMOS	MIL-STD-883 Class B		4000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		196 CLBS, 4000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	616 flip-flops; typical gates = 4000-5000						42.164 mm
XC4005-10CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	196	CMOS	MIL-STD-883 Class B		4000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		196 CLBS, 4000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	616 flip-flops; typical gates = 4000-5000						28.702 mm
5962-8863803XX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS	MIL-STD-883		1800	5		Grid Array			4.5 V		125 °C (257 °F)		1800 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84				No
5962R9957401NUX	Xilinx	FPGA	Military	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.625 V		CMOS			1124022	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)		1124022 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B560		1.7 mm	42.5 mm	Yes							42.5 mm
5962-8863802MXC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No				MIL-STD-883					Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4					27.94 mm
5962-8994802MMC	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
5962-9957501NUX	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS	MIL-PRF-38535		55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B432		1.7 mm	40 mm	No	Typical gates = 55000 to 180000		200 MHz				40 mm
XC7V585T-3FFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy		Yes		91050							Grid Array					125 °C (257 °F)		91050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
5962-9957501QZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	3136	CMOS	MIL-PRF-38535 Class Q		55000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No			200 MHz				39.37 mm
5962-9561101MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS	MIL-STD-883	142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	Typical gates = 5000-6000	e4	188 MHz		142		28.702 mm
5962-8994803MYA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XQKU060-1RFA1517M	Xilinx	FPGA	Military	Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes		41460			624		.95		Grid Array					125 °C (257 °F)		41460 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1517			40 mm			e0			624		40 mm
5962-8994802YA	Xilinx	FPGA	Military	Flat	100	QFF	Square			Yes	5.5 V	64	CMOS	MIL-STD-883		2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-XQFP-F100		3.68 mm	17.27 mm	No		e4	25 MHz				17.27 mm
5962-8994802MTC	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC4013E-1PGG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	576	CMOS			10000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		576 CLBS, 10000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e3	166 MHz				47.244 mm
5962-8994802MYC	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
5962-9851101QYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	5472	Yes	3.6 V	2304	CMOS	MIL-PRF-38535 Class Q	192	40000	3.3	3.3 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	3 V	.635 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 130000	e4	166 MHz		192		39.37 mm
XC4003E-2PG120M	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS		80	2000	5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		100 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No			125 MHz		80		34.544 mm
XC3020-50PG84MSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		64	CMOS			1000	5		Grid Array				2.54 mm	125 °C (257 °F)		64 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	256 flip-flops; typical gates = 1000-1500		50 MHz				27.94 mm
5962-9957501QXX	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	3136	CMOS	MIL-PRF-38535 Class Q		55000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P475		5.969 mm	54.864 mm	No			200 MHz				54.864 mm
5962-9230502MXX	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No		400	CMOS	MIL-STD-883		8000	5		Grid Array				2.54 mm	125 °C (257 °F)	6 ns	400 CLBS, 8000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No		e4					47.244 mm
XQ6VLX240T-2RF784M	Xilinx	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS		400		1		Grid Array	BGA784,28X28,40		.95 V	1 mm	125 °C (257 °F)	0.67 ns	18840 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B784		3.17 mm	29 mm			e0			400		29 mm
XC3042-50PG132B	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	MIL-STD-883 Class B	96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	14 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		50 MHz		96		37.084 mm
XC4005E-4PG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.5 V	196	CMOS		112	3000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.7 ns	196 CLBS, 3000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Typical gates = 3000-9000		111 MHz		112		42.164 mm
5962-8863804XX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS	MIL-STD-883		1800	5		Grid Array			4.5 V		125 °C (257 °F)		1800 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84				No
5962-9752501QYX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	1024		MIL-PRF-38535 Class Q		15000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 15000-45000						39.37 mm
5962-8971302MNC	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC3042-70PG84BSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		144	CMOS			2000	5		Grid Array				2.54 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000		70 MHz				27.94 mm
XC7V2000T-3FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V	1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC7VX485T-2FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	75900					1		Grid Array			.97 V		125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
5962-9957201NUA	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS	MIL-PRF-38535	316	322970	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	322970 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432		1.7 mm	40 mm	No		e0			316		40 mm
XC4013-6CB228B	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	576		MIL-STD-883 Class B		13000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		576 CLBS, 13000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No							39.37 mm
XQV100-4BGG256N	Xilinx	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS	MIL-PRF-38535		108904	2.5		Grid Array			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	600 CLBS, 108904 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1		30 s		250 °C (482 °F)	27 mm
XC4008E-2PGG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	324	CMOS			6000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		324 CLBS, 6000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No		e3	125 MHz				47.244 mm
XQ2VP70-6FF1704N	Xilinx	FPGA	Military	Ball	1704	BGA	Square	Plastic/Epoxy		Yes	1.575 V	8272	CMOS				1.5		Grid Array			1.425 V	1 mm	125 °C (257 °F)	0.32 ns	8272 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm			e0					42.5 mm
5962-8982302MYX	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0					27.432 mm
XC3090-70CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS	MIL-STD-883 Class B	142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164	1	3.302 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e0	70 MHz		142		28.702 mm
XC3195-5PG223B	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No		484	CMOS	38535Q/M;38534H;883B	176	6500	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223	1	4.064 mm	47.244 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000		190 MHz		176		47.244 mm
XQV1000-4CG560Q	Xilinx	FPGA	Military		560	HCGA	Square	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	6144	CMOS	MIL-PRF-38535 Class Q		1124022	2.5		Grid Array, Heat Sink/Slug			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X560		4.9 mm	42.5 mm	No		e0					42.5 mm
XC2064-70PG68M	Xilinx	FPGA	Military	Pin/Peg	68	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.5 V	64	CMOS		58	600	5	5 V	Grid Array	PGA68,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	10 ns	64 CLBS, 600 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P68		4.064 mm	27.94 mm	No	122 flip-flops; typical gates = 600-1000		70 MHz		58		27.94 mm
XC3042-70PG84M	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No		144	CMOS		74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e1	70 MHz		74		27.94 mm
XC3042-50PG132MSPC0107	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No		144	CMOS			2000	5		Grid Array				2.54 mm	125 °C (257 °F)		144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000		50 MHz				37.084 mm
XC4005E-1PG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	196	CMOS			3000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		196 CLBS, 3000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No			166 MHz				42.164 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.