Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5962-8994803QUA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS	MIL-PRF-38535 Class Q		2000	5		Flatpack			4.5 V		125 °C (257 °F)	7 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							100 MHz
5962-9851101QZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2304	CMOS	MIL-PRF-38535 Class Q		40000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 130000		166 MHz				39.37 mm
XC4005-5PG156B	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	196		MIL-STD-883 Class B		3000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		196 CLBS, 3000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No							42.164 mm
5962-9561202MYX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4					28.702 mm
5962-8994802MYA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC7V585T-1LFFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes		91050							Grid Array					125 °C (257 °F)		91050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
5962-8971301MYC	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	14 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
5962-8971301MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No		144	CMOS	MIL-STD-883		4200	5		Grid Array				2.54 mm	125 °C (257 °F)	14 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4	50 MHz				27.94 mm
5962-9473002MYX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No							39.37 mm
XC3042-70PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	MIL-STD-883 Class B	74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e1	70 MHz		74		27.94 mm
XC3090-50CQ164BSPC0107	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	320	CMOS			9000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	14 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz				27.432 mm
XQ4085XL-3HQ240N	Xilinx	FPGA	Military	Gull Wing	240	HFQFP	Square		Plastic/Epoxy		Yes	3.6 V	3136				55000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	2.9 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Maximum usable gates 180000	e0	166 MHz	30 s		225 °C (437 °F)	32 mm
5962-8994801MYA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
5962R9957201QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	6912	Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q	162	322970	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	322970 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.0226 mm	39.37 mm	Yes		e4			162		39.37 mm
XC3020-70CB100MSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		64	CMOS			1000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500		70 MHz				19.05 mm
5962-8982302XX	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Rectangular		Ceramic, Metal-Sealed Cofired		No	5.5 V	320	CMOS	MIL-STD-883		9000	5		Grid Array			4.5 V		125 °C (257 °F)	9 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	R-CPGA-P175				No		e4	25 MHz
5962-9225203MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	466	Yes			CMOS	MIL-STD-883	112		5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	133.3 MHz		112		28.702 mm
XC3090-70PG175B	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired	320	No		320	CMOS	MIL-STD-883 Class B	144	5000	5	5 V	Grid Array	PGA176,16X16MOD	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e3	70 MHz		144		42.164 mm
XQ4005E-4CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	466	Yes	5.5 V	196	CMOS	MIL-PRF-38535	112	3000	5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.7 ns	196 CLBS, 3000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164	1	3.302 mm	28.702 mm	No	Maximum usable gates = 9000	e0	111 MHz		112		28.702 mm
5962-9225201MXC	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired	466	No		196	CMOS	MIL-STD-883	112	4000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)		196 CLBS, 4000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No		e4			112		42.164 mm
XC4013E-4PG223B	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired	576	No	5.5 V	576	CMOS	MIL-STD-883 Class B	192	10000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.7 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P223	1	4.318 mm	47.244 mm	No	Typical gates = 10000-30000	e0	111 MHz		192		47.244 mm
XC7V285T-3FFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square		Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
XQVR600-4CBG228V	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	3456	CMOS			661111	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)		3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3					39.37 mm
XC3120-5PQ100M	Xilinx	FPGA	Military	Gull Wing	100	QFP	Rectangular		Plastic/Epoxy	64	Yes		64	CMOS		64	1300	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	64 CLBS, 1300 Gates	-55 °C (-67 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800	e0	190 MHz	30 s	64	225 °C (437 °F)	20 mm
XQ4025E-4PG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square		Ceramic, Metal-Sealed Cofired	2432	No	5.5 V	1024	CMOS	MIL-PRF-38535	256	15000	5	5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.7 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Maximum usable gates = 45000	e3	111 MHz		256		52.324 mm
5962-8971301MYX	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	14 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC3020-50CB100MSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		64	CMOS			1000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		64 CLBS, 1000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500		50 MHz				19.05 mm
5962-8971302MYA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
5962-8994802MNC	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XQVR1000-4CG560M	Xilinx	FPGA	Military		560	HCGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	27648	Yes	2.625 V	6144	CMOS		404	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Heat Sink/Slug	CGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1124022 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-X560		4.9 mm	42.5 mm	No					404		42.5 mm
5962-9752201QZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	466	Yes	5.5 V	196	CMOS	MIL-PRF-38535 Class Q	112	3000	5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	196 CLBS, 3000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	Typical gates = 3000-9000	e4	111 MHz		112		28.702 mm
XC3020-100PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	64	No		64	CMOS	MIL-STD-883 Class B	64	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	7 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA		100 MHz		64		27.94 mm
XC4006E-4PGG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	256	CMOS			4000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		256 CLBS, 4000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No		e3	111 MHz				42.164 mm
XC3090-50PG175MSPC0107	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired		No		320	CMOS			5000	5		Grid Array				2.54 mm	125 °C (257 °F)		320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000		50 MHz				42.164 mm
XC4003-6PG120M	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square		Ceramic	238	No			CMOS		80		5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P120				No			90.9 MHz		80
5962-9851101QYX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2304	CMOS	MIL-PRF-38535 Class Q		40000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 130000		166 MHz				39.37 mm
XC3042-100PG132MSPC0107	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired		No		144	CMOS			2000	5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000	e3	100 MHz				37.084 mm
5962-8863804MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No				MIL-STD-883					Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm
XQ7VX485T-1RF1761M	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG		700		1		Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	37950 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1761		4.57 mm	42.5 mm			e0			700		42.5 mm
5962-9851001QXC	Xilinx	FPGA	Military	Pin/Peg	411	HIPGA	Square		Ceramic, Metal-Sealed Cofired	3078	No	3.6 V	1296	CMOS	MIL-PRF-38535 Class Q	288	22000	3.3	3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	SPGA411,39X39	Field Programmable Gate Arrays	3 V	2.54 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P411		5.334 mm	52.324 mm	No		e4	166 MHz		288		52.324 mm
XQR2V3000-4BGG728R	Xilinx	FPGA	Military	Ball	728	BGA	Square		Plastic/Epoxy		Yes	1.575 V	3584	CMOS			3000000	1.5		Grid Array			1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B728	3	2.6 mm	35 mm	No		e1	650 MHz				35 mm
XC7V2000T-3FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V	1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
5962-8982302XC	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Rectangular		Ceramic, Metal-Sealed Cofired		No	5.5 V	320	CMOS	MIL-STD-883		9000	5		Grid Array			4.5 V		125 °C (257 °F)	9 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	R-CPGA-P175				No		e4	25 MHz
5962-8863803MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No				MIL-STD-883					Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm
5962-9851101QXB	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square		Ceramic, Metal-Sealed Cofired		No	3.6 V	2304	CMOS	MIL-PRF-38535 Class Q		40000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P475		5.969 mm	54.864 mm	No		e0	166 MHz				54.864 mm
5962-8971303MMC	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes	5.5 V		CMOS	MIL-STD-883	82	4200	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		4200 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.2258 mm	19.05 mm	No		e4	100 MHz		82		19.05 mm
XQ5VFX70T-1EF1136M	Xilinx	FPGA	Military	Ball	1136	BGA	Square		Plastic/Epoxy	71680	Yes	1.05 V	6080	CMOS		640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)	0.9 ns		-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1136		3.4 mm	35 mm	No		e0	1098 MHz		640		35 mm
XQ4028EX-4PG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square		Ceramic, Metal-Sealed Cofired	2432	No	5.5 V	1024	CMOS	MIL-PRF-38535	256	18000	5	5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.2 ns	1024 CLBS, 18000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Maximum usable gates = 50000	e3	143 MHz		256		52.324 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.