Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XQV1000-4CGG560Q	Xilinx	FPGA	Military		560	HCGA	Square		Ceramic, Metal-Sealed Cofired	27648	Yes	2.625 V	6144	CMOS	MIL-PRF-38535 Class Q		1124022	2.5		Grid Array, Heat Sink/Slug			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X560		4.9 mm	42.5 mm	No		e3					42.5 mm
XC3030-100PG84MSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No		100	CMOS			1500	5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns	100 CLBS, 1500 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	360 flip-flops; typical gates = 1500-2000	e3	100 MHz				27.94 mm
XC7V2000T-2FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square		Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V	1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
5962-8971302XX	Xilinx	FPGA	Military		100				Ceramic, Metal-Sealed Cofired					CMOS				5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad			3.429 mm	19.05 mm	No							19.05 mm
5962-9957501QXC	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square		Ceramic, Metal-Sealed Cofired		No	3.6 V	3136	CMOS	MIL-PRF-38535 Class Q		55000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P475		5.969 mm	54.864 mm	No		e4	200 MHz				54.864 mm
XQKU040-1RSA784M	Xilinx	FPGA	Military	Ball	784	BGA	Square		Plastic/Epoxy		Yes		30300					.95		Grid Array					125 °C (257 °F)		30300 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B784						e0
XC4010-10CB196B	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	400	CMOS	MIL-STD-883 Class B		8000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	28.702 mm	No	1120 flip-flops; typical gates = 8000-10000						28.702 mm
XC3120-5CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS	38535Q/M;38534H;883B	64	1300	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	64 CLBS, 1300 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800		190 MHz		64		19.05 mm
XC3042-70CQ100BSPC0107	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS			4200	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				17.272 mm
5962-8994804QUA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS	MIL-PRF-38535 Class Q		2000	5		Flatpack			4.5 V		125 °C (257 °F)	5.5 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							125 MHz
5962-9561202MXX	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No		e4					42.164 mm
5962-9957501QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	3136	CMOS	MIL-PRF-38535 Class Q		55000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4	200 MHz				39.37 mm
XC7V450T-2FFG784E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1761	4			No		e1		30 s		245 °C (473 °F)
XQ6VSX315T-2RF1759M	Xilinx	FPGA	Military	Ball	1759	BGA	Square		Plastic/Epoxy	314880	Yes	1.05 V	24600	CMOS		720		1		Grid Array	BGA1759,42X42,40		.95 V	1 mm	125 °C (257 °F)	0.67 ns	24600 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	4.37 mm	42.5 mm			e0			720		42.5 mm
XC3090-50CQ164M	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes	5.5 V	320	CMOS		142	9000	5	5 V	Flatpack	QFL164,1.2SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		320 CLBS, 9000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164	1	3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops	e0	50 MHz		142		27.432 mm
5962-9561201MXC	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired	484	No		484	CMOS	MIL-STD-883	144	6500	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	Typical gates = 6500-7500	e4	188 MHz		144		42.164 mm
5962-9851001NUA	Xilinx	FPGA	Military	Ball	352	LBGA	Square		Plastic/Epoxy	3078	Yes	3.6 V	1296	CMOS	MIL-PRF-38535	288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B352		1.7 mm	35 mm	No	Typical gates = 22000 to 65000	e0	166 MHz		288		35 mm
XQ2VP70-5FF1704N	Xilinx	FPGA	Military	Ball	1704	BGA	Square		Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS		996		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.36 ns	8272 CLBS	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No		e0	1050 MHz	30 s	996	225 °C (437 °F)	42.5 mm
5962-9850901QXC	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square		Ceramic, Metal-Sealed Cofired	2432	No	5.5 V		CMOS	MIL-PRF-38535 Class Q	256	28000	5	5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.2 ns	28000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P299		5.207 mm	52.324 mm	No		e4	143 MHz		256		52.324 mm
XC3142-5PG132B	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	38535Q/M;38534H;883B	96	3000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 3000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		190 MHz		96		37.084 mm
XC4005-6CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	466	Yes	5.5 V	196	CMOS	MIL-STD-883 Class B	112	4000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	6 ns	196 CLBS, 4000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	616 flip-flops; typical gates = 4000-5000	e0	90.9 MHz		112		28.702 mm
XQ4062XL-3BGG432N	Xilinx	FPGA	Military	Ball	432	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	2304	CMOS	MIL-PRF-38535		40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Typical gates = 40000 to 130000	e1	166 MHz	30 s		260 °C (500 °F)	40 mm
XQR5VFX130-1CF1752V	Xilinx	FPGA	Military		1752	CGA	Square	1M Rad(Si)	Ceramic, Metal-Sealed Cofired	131072	Yes	1.05 V	10240	CMOS		836		1	1,1.2/3.3,2.5 V	Grid Array	HPGA1752,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)		10240 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X1752		9.6 mm	45 mm	No		e0	1098 MHz		836		45 mm
5962-9473002MZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No							39.37 mm
XQ4VLX40-10FF668M	Xilinx	FPGA	Military	Ball	668	BGA	Square		Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS		448		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		4608 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
5962-8982302ZC	Xilinx	FPGA	Military	Flat	164	QFF	Square				Yes	5.5 V	320	CMOS	MIL-STD-883		9000	5		Flatpack			4.5 V	1.27 mm	125 °C (257 °F)	9 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)	Gold	Quad	S-XQFP-F164		2.92 mm		No		e4	25 MHz
XC3020-70PG84MSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No		64	CMOS			1000	5		Grid Array				2.54 mm	125 °C (257 °F)	9 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	256 flip-flops; typical gates = 1000-1500		70 MHz				27.94 mm
5962-9230501MZC	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4					28.702 mm
5962-0253001QZC	Xilinx	FPGA	Military		717	CGA	Square		Ceramic	32256	Yes			CMOS	38535Q/M;38534H;883B	516			1.5,1.5/3.3,3.3 V	Grid Array	CGA717,27X27,50	Field Programmable Gate Arrays		1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-XBGA-X717				No			400 MHz		516
XQVU095-1RFC1517M	Xilinx	FPGA	Military	Ball	1517	BGA	Square		Plastic/Epoxy	1176000	Yes		67200			520		.95		Grid Array					125 °C (257 °F)		67200 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1517			40 mm			e0			520		40 mm
XQV100-4PQ240N	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS	MIL-PRF-38535	166	108904	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)	0.8 ns	600 CLBS, 108904 Gates	-55 °C (-67 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		30 s	166	225 °C (437 °F)	32 mm
5962-9230502MYX	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	6 ns		-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4					28.702 mm
5962-8994801MYX	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes			CMOS	MIL-STD-883	64		5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0	50 MHz		64		17.272 mm
5962-8994801YA	Xilinx	FPGA	Military	Flat	100	QFF	Square				Yes	5.5 V	64	CMOS	MIL-STD-883		2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	14 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-XQFP-F100		3.68 mm	17.27 mm	No		e4	16 MHz				17.27 mm
XQ6VSX315T-2FFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square		Plastic/Epoxy	314880	Yes	1.05 V	24600	CMOS		600		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	125 °C (257 °F)	0.67 ns	24600 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XC3195A-5PG175B	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired	484	No		484	CMOS	38535Q/M;38534H;883B	144	6500	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	Typical gates = 6500-7500		188 MHz		144		42.164 mm
XC3042-70PG132B	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	MIL-STD-883 Class B	96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		70 MHz		96		37.084 mm
XC4013E-4CBG228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	576	CMOS			10000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	2.7 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 10000-30000	e3	111 MHz				39.37 mm
5962R9957301QZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class Q		661111	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)		3456 CLBS, 661111 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	Yes							39.37 mm
5962-8863802XX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS	MIL-STD-883		1800	5		Grid Array			4.5 V		125 °C (257 °F)		1800 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84				No
XC7VX485T-1FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes	1.03 V	75900					1		Grid Array			.97 V	1 mm	125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1					42.5 mm
5962-8994802MNX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
5962-9851001NT	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	1296	CMOS	MIL-PRF-38535		22000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Typical gates = 22000 to 65000		166 MHz				32 mm
5962-9752501QYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	2432	Yes	5.5 V	1024	CMOS	MIL-PRF-38535 Class Q	192	15000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 15000-45000	e4			192		39.37 mm
XQV1000-4CG560M	Xilinx	FPGA	Military		560	HCGA	Square		Ceramic, Metal-Sealed Cofired	27648	Yes	2.625 V	6144	CMOS	MIL-PRF-38535	404	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Heat Sink/Slug	CGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X560		4.9 mm	42.5 mm	No		e0			404		42.5 mm
XQ6VSX475T-1LFFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square		Plastic/Epoxy	476160	Yes		37200	CMOS		600				Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	37200 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XC7V285T-1FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XC3142A-5PG132B	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	38535Q/M;38534H;883B	96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	Typical gates = 2000-3000		188 MHz		96		37.084 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.