Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
A3P1000-PQG208M	Microchip Technology	FPGA	Military	Gull Wing	208	FQFP	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		154	1000000	1.5	Tray	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	154	245 °C (473 °F)	28 mm
M1A3P1000-PQG208M	Microchip Technology	FPGA	Military	Gull Wing	208	FQFP	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		154	1000000	1.5	Tray	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	154	245 °C (473 °F)	28 mm
XQR5VFX130-1CN1752V	Xilinx	FPGA	Military		1752	CGA	Square	1M Rad(Si)	Ceramic, Metal-Sealed Cofired	131072	Yes	1.05 V	10240	CMOS				1			Grid Array			.95 V	1 mm	125 °C (257 °F)	0.11 ns	10240 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1752		8.8 mm	45 mm	No							45 mm
XQR5VFX130-1CN1752B	Xilinx	FPGA	Military		1752	CGA	Square	1M Rad(Si)	Ceramic, Metal-Sealed Cofired	131072	Yes	1.05 V	10240	CMOS				1			Grid Array			.95 V	1 mm	125 °C (257 °F)	0.11 ns	10240 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1752		8.8 mm	45 mm	No							45 mm
M2GL090T-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	86316	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	267	225 °C (437 °F)	23 mm
A3P1000-FG144M	Microchip Technology	FPGA	Military	Ball	144	BGA	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz	20 s	97	235 °C (455 °F)	13 mm
M1A3P1000-FG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz		97		13 mm
A40MX04-PL68M	Microsemi	FPGA	Military	J Bend	68	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	547	CMOS			6000	3.3			Chip Carrier			3 V	1.27 mm	125 °C (257 °F)	2.7 ns	547 CLBS, 6000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQCC-J68	3	4.572 mm	24.2316 mm	No	Also Operates at 5 V supply	e0	80 MHz				24.2316 mm
MPF500TS-FC1152M	Microchip Technology	FPGA	Military	Ball	1152	BGA	Square		Plastic/Epoxy	481000	Yes	1.03 V		CMOS		584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.39 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
A40MX04-PLG68M	Microchip Technology	FPGA	Military	J Bend	68	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	547	CMOS			6000	3.3	Tube		Chip Carrier			3 V	1.27 mm	125 °C (257 °F)	2.7 ns	547 CLBS, 6000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQCC-J68	3	4.572 mm	24.2316 mm	No	Also Operates at 5 V supply	e3	80 MHz				24.2316 mm
A42MX09-PLG84M	Microchip Technology	FPGA	Military	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	684	CMOS			14000	3.3	Tube		Chip Carrier			3 V	1.27 mm	125 °C (257 °F)	2.5 ns	684 CLBS, 14000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3	117 MHz				29.3116 mm
APA300-FG256M	Microchip Technology	FPGA	Military	Ball	256	BGA	Square		Plastic/Epoxy	8192	Yes	2.7 V		CMOS		186	300000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.3 V	1 mm	125 °C (257 °F)		300000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e0	180 MHz	20 s	186	225 °C (437 °F)	17 mm
APA1000-PQG208M	Microchip Technology	FPGA	Military	Gull Wing	208	FQFP	Square		Plastic/Epoxy	56320	Yes	2.7 V		CMOS		158	1000000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		1000000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
XQ4013E-3HQ240N	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS	MIL-PRF-38535	192	10000	5		5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	125 °C (257 °F)	2.01 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Maximum usable gates = 30000	e0	125 MHz	30 s	192	225 °C (437 °F)	32 mm
A3P250-VQG100M	Microchip Technology	FPGA	Military	Gull Wing	100	TFQFP	Square		Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	125 °C (257 °F)		6144 CLBS, 250000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G100	3	1.2 mm	14 mm								14 mm
A42MX09-PL84M	Microsemi	FPGA	Military	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	684	CMOS			14000	3.3			Chip Carrier			3 V	1.27 mm	125 °C (257 °F)	2.5 ns	684 CLBS, 14000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e0	117 MHz				29.3116 mm
A3PE3000L-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	250 MHz		341		23 mm
XQRKU060-1CNA1509Y	Xilinx	FPGA	Military		1509	CGA	Square	120k Rad(Si)	Ceramic, Metal-Sealed Cofired	725550	Yes		41460		MIL-PRF-38535 CLASS Y	620			Box; Tray		Grid Array	CGA1509,39X39,40			1 mm	125 °C (257 °F)		41460 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1509		8.97 mm	40 mm		Tray contains 1 device				620		40 mm
M2GL090T-1FG484MX399	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484		2.44 mm	23 mm			e0					23 mm
M2GL090T-1FG484MX418	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484		2.44 mm	23 mm								23 mm
A3P1000-FGG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
M1A3PE3000L-FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	250 MHz	30 s	341	250 °C (482 °F)	23 mm
MPF500TS-FC784M	Microchip Technology	FPGA	Military	Ball	784	BGA	Square		Plastic/Epoxy	481000	Yes	1.03 V		CMOS		388		1			Grid Array	BGA784,28X28,40		.97 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm		It also Operates at 1.05 V nominal supply				388		29 mm
XQKU040-1RFA1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square		Plastic/Epoxy		Yes		30300					.95			Grid Array				1 mm	125 °C (257 °F)		30300 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.62 mm	35 mm			e0					35 mm
MPF300TS-FCV484M	Microchip Technology	FPGA	Military	Ball	484	FBGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS		284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
M1A3P1000-FGG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
MPF300TS-FC484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS		284		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484		3.39 mm	23 mm		It also Operates at 1.05 V nominal supply				284		23 mm
APA600-PQG208M	Microchip Technology	FPGA	Military	Gull Wing	208	FQFP	Square		Plastic/Epoxy	21504	Yes	2.7 V		CMOS		158	600000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		600000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
M2GL010T-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	12084	Yes	1.26 V		CMOS		233		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	233	250 °C (482 °F)	23 mm
M2GL010T-1FG484MX417	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.26 V				233		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e0		20 s	233	240 °C (464 °F)	23 mm
RT3PE3000L-1CQ256B	Microchip Technology	FPGA	Military	Flat	256	GQFF	Square		Ceramic, Metal-Sealed Cofired	75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B		3000000	1.2		1.2/1.5,1.2/3.3 V	Flatpack, Guard Ring	TPAK256,3SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F256		3.3 mm	36 mm	No			250 MHz				36 mm
RT3PE3000L-1LG484E	Microchip Technology	FPGA	Military	No Lead	484	LGA	Square			75264	Yes	1.575 V	75264	CMOS	38535V;38534K;883S	341	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	LGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Bottom	S-XBGA-N484		3.83 mm	23 mm	No			250 MHz		341		23 mm
RT3PE3000L-CQ256B	Microchip Technology	FPGA	Military	Flat	256	GQFF	Square		Ceramic, Metal-Sealed Cofired	75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B		3000000	1.2		1.2/1.5,1.2/3.3 V	Flatpack, Guard Ring	TPAK256,3SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.3 mm	36 mm	No		e0	250 MHz	20 s		225 °C (437 °F)	36 mm
RT3PE3000L-LG484B	Microchip Technology	FPGA	Military	No Lead	484	LGA	Square			75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B	341	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	LGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Bottom	S-XBGA-N484		3.83 mm	23 mm	No			250 MHz		341		23 mm
RT4G150-CQ352EV	Microchip Technology	FPGA	Military
MPF300TS-FCS536M	Microchip Technology	FPGA	Military	Ball	536	LFBGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS		300		1			Grid Array, Low Profile, Fine Pitch	BGA536,30X30,20		.97 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B536		1.45 mm	16 mm		It also Operates at 1.05 V nominal supply				300		16 mm
XQ7A50T-1CS325M	Xilinx	FPGA	Military	Ball	324	FBGA	Square		Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG		150		1		1 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B324	3		15 mm	No		e0	1098 MHz		150		15 mm
RT4G150-CB1657PROTO	Microchip Technology	FPGA	Military	Ball	1657	BGA	Square	100k Rad(Si)	Plastic/Epoxy	151824	Yes	1.26 V				720		1.2			Grid Array	BGA1657,41X41,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B1657		4.17 mm	42.5 mm						720		42.5 mm
5962-0151801QYC	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.75 V		CMOS	MIL-PRF-38535 Class Q		32000	2.5			Flatpack, Guard Ring			2.25 V	.5 mm	125 °C (257 °F)		32000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F208		3.22 mm	29.21 mm	No	2.5 V, 3.3 V, and 5.0 V mixed voltage operation	e4					29.21 mm
A54SX32-CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3		3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246		29.21 mm
A54SX32CQ208B	Actel	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3		3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246	225 °C (437 °F)	29.21 mm
A54SX72A-CQ208M	Microchip Technology	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS		171	108000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	72000 typical gates available	e0	217 MHz		171		29.21 mm
A54SX72ACQ208M	Microsemi	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS		171	108000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	72000 typical gates available	e0	217 MHz		171		29.21 mm
APA1000-CQ208B	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	56320	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	1000000	2.5		2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		1000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm
APA1000-CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	56320	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	1000000	2.5		2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		1000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm
APA600-CQ208B	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	21504	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	600000	2.5		2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		600000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm
XQV600-4BG432N	Xilinx	FPGA	Military	Ball	432	LBGA	Square		Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS	MIL-PRF-38535	316	661111	2.5		1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0		30 s	316	225 °C (437 °F)	40 mm
AX250-FGG256M	Microchip Technology	FPGA	Military	Ball	256	LBGA	Square		Plastic/Epoxy	4224	Yes	1.575 V	2816	CMOS	MIL-STD-883 Class B	248	250000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.99 ns	2816 CLBS, 250000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No	250000 system gates avaiable	e1	649 MHz	30 s	248	250 °C (482 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.