Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5962-0151802QYC	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.75 V		CMOS	MIL-PRF-38535 Class Q		32000	2.5			Flatpack, Guard Ring			2.25 V	.5 mm	125 °C (257 °F)		32000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F208		3.22 mm	29.21 mm	No	2.5 V, 3.3 V, and 5.0 V mixed voltage operation	e4					29.21 mm
A3P250-VQ100M	Microchip Technology	FPGA	Military	Gull Wing	100	TFQFP	Square		Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	125 °C (257 °F)		6144 CLBS, 250000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm			e0					14 mm
A42MX36-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	2414	Yes	3.6 V	2438	CMOS			54000	3.3			Flatpack, Guard Ring			3 V	.5 mm	125 °C (257 °F)	2.3 ns	2438 CLBS, 54000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	Also Operates at 5 V supply	e0	83 MHz				29.21 mm
A54SX32-1CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3		3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	0.9 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	240 MHz		246		29.21 mm
A54SX32A-CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32A-CQ208M	Microchip Technology	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz	20 s	174	225 °C (437 °F)	29.21 mm
A54SX32ACQ208B	Microsemi	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32ACQ208M	Microsemi	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz	20 s	174	225 °C (437 °F)	29.21 mm
A54SX72A-CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS	MIL-STD-883 Class B	171	108000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	72000 typical gates available	e0	217 MHz		171		29.21 mm
A54SX72ACQ208B	Microsemi	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS	MIL-STD-883 Class B	171	108000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	72000 typical gates available	e0	217 MHz		171		29.21 mm
AX250-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	4224	Yes	1.575 V	2816	CMOS	MIL-STD-883 Class B	248	250000	1.5		1.5,1.5/3.3,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.84 ns	2816 CLBS, 250000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	250000 system gates avaiable	e0	763 MHz		248		29.21 mm
AX500-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	8064	Yes	1.575 V	5376	CMOS	MIL-STD-883 Class B	336	500000	1.5		1.5,1.5/3.3,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.84 ns	5376 CLBS, 500000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	500000 system gates avaiable	e0	763 MHz		336		29.21 mm
M1A3PE3000L-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	250 MHz		341		23 mm
M2GL050T-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	56340	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
RTAX2000SL-1CQ352E	Microchip Technology	FPGA	Military	Flat	352	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	21504	CMOS		684	2000000	1.5		1.5/3.3 V	Flatpack	TPAK352,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.95 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F352		2.89 mm	48 mm	No	250000 ASIC gates also available	e0			684		48 mm
RTSX32SUCQ84B	Microchip Technology	FPGA	Military	Flat	84	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	227	48000	2.5		2.5,3.3/5 V	Flatpack, Guard Ring	TPAK84,1.63SQ,25	Field Programmable Gate Arrays	2.25 V	.635 mm	125 °C (257 °F)	1.4 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F84		2.4 mm	16.51 mm	No	32000 typical gates available	e0	310 MHz	20 s	227	225 °C (437 °F)	16.51 mm
RTSX32SU-CQ84B	Microsemi	FPGA	Military	Flat	84	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	227	48000	2.5		2.5,3.3/5 V	Flatpack, Guard Ring	TPAK84,1.63SQ,25	Field Programmable Gate Arrays	2.25 V	.635 mm	125 °C (257 °F)	1.4 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F84		2.4 mm	16.51 mm	No	32000 typical gates available	e0	310 MHz	20 s	227	225 °C (437 °F)	16.51 mm
XQ7K325T-1RF900M	Xilinx	FPGA	Military	Ball	900	BGA	Square		Plastic/Epoxy	326080	Yes	1.03 V	25475	HKMG		500		1			Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	25475 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B900		3.44 mm	31 mm			e0			500		31 mm
A42MX09-VQG100M	Microchip Technology	FPGA	Military	Gull Wing	100	TFQFP	Square		Plastic/Epoxy		Yes	3.6 V	684	CMOS			14000	3.3	Tray		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	2.5 ns	684 CLBS, 14000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Also Operates at 5 V supply	e3	117 MHz				14 mm
A54SX32A-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.1 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	278 MHz		174		29.21 mm
AX2000-1CGS624M	Microchip Technology	FPGA	Military		624	CGA	Square		Ceramic, Metal-Sealed Cofired	32526	Yes	1.575 V	21504	CMOS		418	2000000	1.5	Box		Grid Array			1.425 V		125 °C (257 °F)		21504 CLBS, 2000000 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-X624					1060000 typical gates avaialable				418
AX500-FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	8064	Yes	1.575 V	5376	CMOS	MIL-STD-883 Class B	336	500000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.99 ns	5376 CLBS, 500000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	27 mm	No	500000 system gates avaiable	e0	649 MHz		336		27 mm
M1A3P1000-1FGG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
M1A3PE3000L-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	250 MHz	30 s	341	250 °C (482 °F)	23 mm
M2GL010T-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	12084	Yes	1.26 V				233		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	233	240 °C (464 °F)	23 mm
M2GL025T-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	27696	Yes	1.26 V				267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0			267		23 mm
M2GL025TS-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	27696	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No					267		23 mm
M2GL025TS-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	27696	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
M2GL060T-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm
RTAX2000S-1LG624E	Microchip Technology	FPGA	Military	No Lead	624	LGA	Square		Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	21504	CMOS	MIL-STD-883 Class S (Modified)	684	2000000	1.5		1.5,1.5/3.3,2.5/3.3 V	Grid Array	LGA624,25X25,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.95 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-N624		2.96 mm	32.5 mm	No	250000 ASIC gates also available				684		32.5 mm
RTAX2000S-CG1152E	Microsemi	FPGA	Military		1152	CGA	Square		Ceramic, Metal-Sealed Cofired	32256	No	1.575 V	21504	CMOS	MIL-STD-883 Class S (Modified)	684	2000000	1.5		1.5,1.5/3.3,2.5/3.3 V	Grid Array	CGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-X1152		3.575 mm	35 mm	No	250000 ASIC gates also available				684		35 mm
RTAX2000S-LG624E	Microsemi	FPGA	Military	No Lead	624	LGA	Square		Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	21504	CMOS	MIL-STD-883 Class S (Modified)	684	2000000	1.5		1.5,1.5/3.3,2.5/3.3 V	Grid Array	LGA624,25X25,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-N624		2.96 mm	32.5 mm	No	250000 ASIC gates also available				684		32.5 mm
RTAX2000SCG1152E	Microchip Technology	FPGA	Military		1152	CGA	Square		Ceramic, Metal-Sealed Cofired	32256	No	1.575 V	21504	CMOS	MIL-STD-883 Class S (Modified)	684	2000000	1.5		1.5,1.5/3.3,2.5/3.3 V	Grid Array	CGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-X1152		3.575 mm	35 mm	No	250000 ASIC gates also available				684		35 mm
RTAX2000SLCQ352B	Microchip Technology	FPGA	Military	Flat	352	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	21504	CMOS	MIL-STD-883 Class B	684	2000000	1.5		1.5/3.3 V	Flatpack	TPAK352,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F352		2.89 mm	48 mm	No	250000 ASIC gates also available	e0			684		48 mm
RTAX2000SL-CQ352B	Microsemi	FPGA	Military	Flat	352	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	21504	CMOS	MIL-STD-883 Class B	684	2000000	1.5		1.5/3.3 V	Flatpack	TPAK352,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F352		2.89 mm	48 mm	No	250000 ASIC gates also available	e0			684		48 mm
RTAX2000SLG624E	Microchip Technology	FPGA	Military	No Lead	624	LGA	Square		Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	21504	CMOS	MIL-STD-883 Class S (Modified)	684	2000000	1.5		1.5,1.5/3.3,2.5/3.3 V	Grid Array	LGA624,25X25,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-N624		2.96 mm	32.5 mm	No	250000 ASIC gates also available				684		32.5 mm
A40MX04-PLG44M	Microchip Technology	FPGA	Military	J Bend	44	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	547	CMOS			6000	3.3	Tube		Chip Carrier			3 V	1.27 mm	125 °C (257 °F)	2.7 ns	547 CLBS, 6000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Also Operates at 5 V supply	e3	80 MHz	30 s		245 °C (473 °F)	16.5862 mm
A54SX16-1CQ208B	Microsemi	FPGA	Military	Flat	208	QFF	Square		Ceramic, Metal-Sealed Cofired	1452	Yes	3.63 V	1452	CMOS	MIL-STD-883 Class B	172	16000	3.3		3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	0.9 ns	1452 CLBS, 16000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	24000 system gates avaiable	e0	240 MHz		172		29.21 mm
A54SX32-1CQ256M	Microsemi	FPGA	Military	Flat	256	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3		3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	0.9 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	240 MHz		246		36 mm
A54SX32-CQ256B	Microsemi	FPGA	Military	Flat	256	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3		3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	205 MHz		246		36 mm
A54SX32-CQ256M	Microsemi	FPGA	Military	Flat	256	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3		3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	205 MHz	20 s	246	225 °C (437 °F)	36 mm
A54SX32CQ256B	Actel	FPGA	Military	Flat	256	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3		3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	205 MHz		246	225 °C (437 °F)	36 mm
A54SX32CQ256M	Actel	FPGA	Military	Flat	256	QFF	Square		Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3		3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	205 MHz		246	225 °C (437 °F)	36 mm
A54SX72ACQ256M	Microsemi	FPGA	Military	Flat	256	QFF	Square		Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS		213	108000	2.5		2.5,3.3/5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.3 mm	36 mm	No	72000 typical gates available	e0	217 MHz		213		36 mm
A54SX72A-CQ256M	Microchip Technology	FPGA	Military	Flat	256	QFF	Square		Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS		213	108000	2.5		2.5,3.3/5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.3 mm	36 mm	No	72000 typical gates available	e0	217 MHz		213		36 mm
APA600-CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	21504	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	600000	2.5		2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		600000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm
APA600-FGG256M	Microchip Technology	FPGA	Military	Ball	256	BGA	Square		Plastic/Epoxy	21504	Yes	2.7 V		CMOS		186	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.3 V	1 mm	125 °C (257 °F)		600000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	180 MHz	30 s	186	250 °C (482 °F)	17 mm
M1A3P1000-PQ208M	Microsemi	FPGA	Military	Gull Wing	208	FQFP	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		154	1000000	1.5		1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	350 MHz	20 s	154	225 °C (437 °F)	28 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.