Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
M2GL010T-1FG484MX399	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e0		20 s		240 °C (464 °F)	23 mm
MPF200TS-FCS325M	Microchip Technology	FPGA	Military	Ball	325	LFBGA	Rectangular		Plastic/Epoxy	192000	Yes	1.03 V		CMOS		170		1			Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	R-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		14.5 mm
RT3PE3000L-CG484B	Microchip Technology	FPGA	Military		484	CGA	Square		Ceramic, Metal-Sealed Cofired	75264	No	1.575 V	75264	CMOS	MIL-STD-883 Class B	341	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	CGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-X484		6.19 mm	23 mm	No			250 MHz		341		23 mm
APA300-FG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square		Plastic/Epoxy	8192	Yes	2.7 V		CMOS		100	300000	2.5	Tray	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	2.3 V	1 mm	125 °C (257 °F)		300000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	180 MHz	20 s	100	235 °C (455 °F)	13 mm
XQ5VFX100T-1EF1136M	Xilinx	FPGA	Military	Ball	1136	BGA	Square		Plastic/Epoxy	102400	Yes	1.05 V	8960	CMOS		640		1		1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)	0.9 ns		-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1136		3.4 mm	35 mm	No		e0	1098 MHz		640		35 mm
A3P1000-1FGG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
XQ7A100T-1FG484M	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	101440	Yes	1.05 V		CMOS		285		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)	1.27 ns		-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3			No		e0	1098 MHz	30 s	285	225 °C (437 °F)
XQ4VLX60-10FF668M	Xilinx	FPGA	Military	Ball	668	BGA	Square		Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS		448		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		6656 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XQ7A200T-1RB676M	Xilinx	FPGA	Military	Ball	676	BGA	Square		Plastic/Epoxy	215360	Yes	1.05 V	16825	HKMG		400		1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)	1.27 ns	16825 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.35 mm	27 mm	No		e0	1098 MHz	30 s	400	225 °C (437 °F)	27 mm
XQ7A200T-1RS484M	Xilinx	FPGA	Military	Ball	484	FBGA	Square		Plastic/Epoxy	215360	Yes	1.05 V	16825	HKMG		285		1		1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	16825 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484		3.19 mm	19 mm	No		e0	1098 MHz		285		19 mm
XC3064-100PG132M	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	224	No		224	CMOS		110	3500	5		5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	7 ns	224 CLBS, 3500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA		100 MHz		110		37.084 mm
XQ7K325T-1RF676M	Xilinx	FPGA	Military	Ball	676	BGA	Square		Plastic/Epoxy	326080	Yes	1.03 V	25475	HKMG		400		1			Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	25475 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e0		30 s	400	225 °C (437 °F)	27 mm
XQ7K410T-1RF900M	Xilinx	FPGA	Military	Ball	900	BGA	Square		Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG		500		1			Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	31775 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B900		3.44 mm	31 mm			e0			500		31 mm
XC3042-100PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	MIL-STD-883 Class B	74	2000	5		5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		100 MHz		74		27.94 mm
XQ4005E-4PG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired	466	No	5.5 V	196	CMOS	MIL-PRF-38535	112	3000	5		5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.01 ns	196 CLBS, 3000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Maximum usable gates = 9000	e3	125 MHz		112		42.164 mm
XQ4VLX25-10FF668M	Xilinx	FPGA	Military	Ball	668	BGA	Square		Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		448		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		2688 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XQ4VSX55-10FF1148M	Xilinx	FPGA	Military	Ball	1148	BGA	Square		Plastic/Epoxy	55296	Yes	1.26 V	6144	CMOS		640		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		6144 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	640	225 °C (437 °F)	35 mm
XQ7A200T-1RB484M	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	215360	Yes	1.05 V	16825	HKMG		285		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)	1.27 ns	16825 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B484		3.35 mm	23 mm	No			1098 MHz		285		23 mm
XQKU040-1RBA676M	Xilinx	FPGA	Military	Ball	676	BGA	Square		Plastic/Epoxy		Yes	.979 V	30300					.95			Grid Array			.922 V	1 mm	125 °C (257 °F)		30300 CLBS	-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B676	4	3.44 mm	27 mm			e0		5 s		250 °C (482 °F)	27 mm
XQVR300-4CB228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	6912	Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q	316	322970	2.5		1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)		1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0			316		39.37 mm
A3P1000-1FG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz		97		13 mm
A3P1000-1PQG208M	Microchip Technology	FPGA	Military	Gull Wing	208	FQFP	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		154	1000000	1.5	Tray	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	154	245 °C (473 °F)	28 mm
A3PE3000L-FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	341	225 °C (437 °F)	23 mm
A3PE3000L-FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	250 MHz	30 s	341	250 °C (482 °F)	23 mm
A3PE600L-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	13824	Yes	1.575 V	13824	CMOS		270	600000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		13824 CLBS, 600000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	250 MHz		270		23 mm
APA300-PQG208M	Microchip Technology	FPGA	Military	Gull Wing	208	FQFP	Square		Plastic/Epoxy	8192	Yes	2.7 V		CMOS		158	300000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		300000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G208	3	4.1 mm	28 mm	No			180 MHz	30 s	158	245 °C (473 °F)	28 mm
AX2000-1CQ352M	Microchip Technology	FPGA	Military	Flat	352	GQFF	Square		Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	21504	CMOS	MIL-STD-883 Class B	684	2000000	1.5		1.5,1.5/3.3,2.5/3.3 V	Flatpack, Guard Ring	TPAK352,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.84 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F352		2.89 mm	48 mm	No	2000000 system gates avaiable	e0	763 MHz		684		48 mm
M2GL010TS-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	12084	Yes	1.26 V		CMOS		233		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	233	250 °C (482 °F)	23 mm
TPC1010AMHFG84B-1	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular		Ceramic	295	Yes			CMOS	38535Q/M;38534H;883B	57		5		5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					57
5962-9096401MYX	Texas Instruments	FPGA	Military	Flat	84	QFF	Square		Ceramic	295	Yes			CMOS	38535Q/M;38534H;883B	57		5		5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F84				No					57
TPC1010APB-068M	Texas Instruments	FPGA	Military	Pin/Peg	68	PGA			Ceramic	295	No			CMOS		57		5		5 V	Grid Array	PGA68(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular					No					57
TPC1240MGB133B-1	Texas Instruments	FPGA	Military	Pin/Peg	133	PGA	Square		Ceramic, Metal-Sealed Cofired	684	No	5.5 V	684	CMOS	MIL-STD-883 Class B	104	4000	5		5 V	Grid Array	PGA133M,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		684 CLBS, 4000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P133		4.27 mm	34.544 mm	No			55 MHz		104		34.544 mm
TPC1010AMHFG84	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular		Ceramic	295	Yes			CMOS		57		5		5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					57
TPC1020AMHFG84B	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular		Ceramic	547	Yes			CMOS	38535Q/M;38534H;883B	69		5		5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					69
TPC1280MHFG172	Texas Instruments	FPGA	Military	Flat	172	QFF	Square		Ceramic, Metal-Sealed Cofired	1232	Yes	5.5 V	1232	CMOS	MIL-STD-883	140	8000	5		5 V	Flatpack	TPAK172(UNSPEC)	Field Programmable Gate Arrays	4.5 V		125 °C (257 °F)		1232 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F172				No			39 MHz		140
5962-9096504MUX	Texas Instruments	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	547	CMOS			1200	5			Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	4.7 ns	547 CLBS, 1200 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No			44 MHz				27.94 mm
M38510/60604BYX	Texas Instruments	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS			4000	5			Grid Array			4.5 V		125 °C (257 °F)		4000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84				No
5962-9096401MZX	Texas Instruments	FPGA	Military	Flat	84	GQFF	Square		Ceramic, Metal-Sealed Cofired	295	Yes	5.5 V		CMOS	MIL-STD-883 Class B	57	1200	5		5 V	Flatpack, Guard Ring	TPAK84,1.63SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		1200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F84		3.302 mm	16.51 mm	No					57		16.51 mm
5962-9215601MXA	Texas Instruments	FPGA	Military	Pin/Peg	176	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	1232	CMOS			8000	5			Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	6.1 ns	8000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P176		4.7498 mm	39.878 mm	No		e0	41 MHz	30 s		225 °C (437 °F)	39.878 mm
TPC1280MHFG172B-1	Texas Instruments	FPGA	Military	Flat	172	QFF	Square		Ceramic, Metal-Sealed Cofired	1232	Yes	5.5 V	1232	CMOS	MIL-STD-883 Class B	140	8000	5		5 V	Flatpack	TPAK172(UNSPEC)	Field Programmable Gate Arrays	4.5 V		125 °C (257 °F)		1232 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F172				No			50 MHz		140
M38510/60608BNX	Texas Instruments	FPGA	Military	Pin/Peg	144	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS			8000	5			Grid Array			4.5 V		125 °C (257 °F)		8000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P144				No
TPC1010AMHT84	Texas Instruments	FPGA	Military	Flat	84	QFF	Square		Ceramic	295	Yes			CMOS		57		5		5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F84				No					57
TPC1280MHFG172B	Texas Instruments	FPGA	Military	Flat	172	QFF	Square		Ceramic, Metal-Sealed Cofired	1232	Yes	5.5 V	1232	CMOS	MIL-STD-883 Class B	140	8000	5		5 V	Flatpack	TPAK172(UNSPEC)	Field Programmable Gate Arrays	4.5 V	.64 mm	125 °C (257 °F)	18.72 ns	1232 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F172		3.3 mm	26.665 mm	No	MAX 140 I/OS; 998 flip-flops		39 MHz		140		26.665 mm
M38510/60711BZX	Texas Instruments	FPGA	Military	No Lead	180	QCCN	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V		CMOS			11000	5			Chip Carrier			4.5 V		125 °C (257 °F)		11000 Gates	-55 °C (-67 °F)		Quad	S-CQCC-N180				No
TPC1020AMHT84B	Texas Instruments	FPGA	Military	Flat	84	QFF	Square		Ceramic, Metal-Sealed Cofired	547	Yes	5.5 V	547	CMOS	38535Q/M;38534H;883B	69	2000	5		5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	19.332 ns	547 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F84		3.3 mm	16.51 mm	No	MAX 69 I/OS; 273 flip-flops		100 MHz		69		16.51 mm
TPC1020AMGB84B-1	Texas Instruments	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	547	No	5.5 V	547	CMOS	38535Q/M;38534H;883B	69	2000	5		5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	16.092 ns	547 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.21 mm	27.94 mm	No	MAX 69 I/OS; 273 flip-flops				69		27.94 mm
M38510/60504BQX	Texas Instruments	FPGA	Military	Through-Hole	40	DIP	Rectangular		Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS			4000	5			In-Line			4.5 V		125 °C (257 °F)		4000 Gates	-55 °C (-67 °F)		Dual	R-CDIP-T40				No
TPC1280MGB177B-1	Texas Instruments	FPGA	Military	Pin/Peg	177	HPGA	Square		Ceramic, Metal-Sealed Cofired	1232	No	5.5 V	1232	CMOS	MIL-STD-883 Class B	140	8000	5		5 V	Grid Array, Heat Sink/Slug	HPGA177,15X15	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		1232 CLBS, 8000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P177		5.46 mm	39.88 mm	No			50 MHz		140		39.88 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.