Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5962-9851001NUA	Xilinx	FPGA	Military	Ball	352	LBGA	Square		Plastic/Epoxy	3078	Yes	3.6 V	1296	CMOS	MIL-PRF-38535	288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B352		1.7 mm	35 mm	No	Typical gates = 22000 to 65000	e0	166 MHz		288		35 mm
XQ2VP70-5FF1704N	Xilinx	FPGA	Military	Ball	1704	BGA	Square		Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS		996		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.36 ns	8272 CLBS	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No		e0	1050 MHz	30 s	996	225 °C (437 °F)	42.5 mm
5962-9850901QXC	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square		Ceramic, Metal-Sealed Cofired	2432	No	5.5 V		CMOS	MIL-PRF-38535 Class Q	256	28000	5	5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.2 ns	28000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P299		5.207 mm	52.324 mm	No		e4	143 MHz		256		52.324 mm
XC3142-5PG132B	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	38535Q/M;38534H;883B	96	3000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 3000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		190 MHz		96		37.084 mm
XC4005-6CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	466	Yes	5.5 V	196	CMOS	MIL-STD-883 Class B	112	4000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	6 ns	196 CLBS, 4000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	616 flip-flops; typical gates = 4000-5000	e0	90.9 MHz		112		28.702 mm
5962-9752201QZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	196		MIL-PRF-38535 Class Q		3000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	196 CLBS, 3000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	Typical gates = 3000-9000						28.702 mm
5962-9752301QYX	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	400		MIL-PRF-38535 Class Q		7000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	34.29 mm	No	Typical gates = 7000-20000						34.29 mm
5962-8971303MXC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No	5.5 V		CMOS	MIL-STD-883	74	4200	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	7 ns	4200 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4	100 MHz		74		27.94 mm
XC4010-6PG191B	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square		Ceramic, Metal-Sealed Cofired	400	No	5.5 V	400	CMOS	MIL-STD-883 Class B	160	8000	5	5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	6 ns	400 CLBS, 8000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	1120 flip-flops; typical gates = 8000-10000	e1	69 MHz		160		47.244 mm
5962-9850901NUX	Xilinx	FPGA	Military	Ball	352	LBGA	Square				Yes	5.5 V		CMOS			28000	5		Grid Array, Low Profile			4.5 V	1.27 mm	125 °C (257 °F)	2.2 ns	28000 Gates	-55 °C (-67 °F)		Bottom	S-XBGA-B352		1.7 mm	35 mm	No							35 mm
XC3090-70CQ164BSPC0107	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	320	CMOS			9000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		70 MHz				27.432 mm
5962R9957201QYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	6912	Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q	162	322970	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	322970 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.0226 mm	39.37 mm	Yes		e4			162		39.37 mm
XC3064-100PG132MSPC0107	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired		No		224	CMOS			3500	5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns	224 CLBS, 3500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500		100 MHz				37.084 mm
XC4003A-10CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	100	CMOS			2500	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		100 CLBS, 2500 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	360 flip-flops; typical gates = 2500-3000						19.05 mm
XC3195A-5CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	484	Yes		484	CMOS	38535Q/M;38534H;883B	176	6500	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164	1	3.302 mm	28.702 mm	No	Typical gates = 6500-7500		188 MHz		176		28.702 mm
XQV600-4PQ240N	Xilinx	FPGA	Military	Gull Wing	240	HFQFP	Square		Plastic/Epoxy		Yes	2.625 V	3456	CMOS	MIL-PRF-38535		661111	2.5		Flatpack, Heat Sink/Slug, Fine Pitch			2.375 V	.5 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm								32 mm
5962-9471201MZX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	238	Yes			CMOS	MIL-STD-883	77		5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4	50 MHz		77		19.05 mm
XC7V1500T-1FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes		229050							Grid Array					125 °C (257 °F)		229050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC3090-70CQ164M	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes	5.5 V	320	CMOS		142	9000	5	5 V	Flatpack	QFL164,1.2SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	9 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops	e0	70 MHz		142		27.432 mm
XQ4VLX60-10FF1148M	Xilinx	FPGA	Military	Ball	1148	BGA	Square		Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS		640		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		6656 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	640	225 °C (437 °F)	35 mm
XC4010E-3PGG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	400	CMOS			7000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		400 CLBS, 7000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No		e3	125 MHz				47.244 mm
XC4008E-3PGG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	324	CMOS			6000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		324 CLBS, 6000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No		e3	125 MHz				47.244 mm
XC3142A-5PG132M	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS		96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	Typical gates = 2000-3000		188 MHz		96		37.084 mm
XC4008E-4PG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square		Ceramic, Metal-Sealed Cofired	324	No	5.5 V	324	CMOS		144	6000	5	5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		324 CLBS, 6000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No			111 MHz		144		47.244 mm
XC3020-50CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		64	CMOS	MIL-STD-883 Class B		1000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		64 CLBS, 1000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		3.429 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA		50 MHz				19.05 mm
5962-9957301QZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class Q		661111	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	Yes							39.37 mm
XC4025E-4PGG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e3	111 MHz				47.244 mm
XC7VX485T-2FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes	1.03 V	75900					1		Grid Array			.97 V	1 mm	125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1					42.5 mm
5962-9851301QX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	576	CMOS	MIL-PRF-38535		10000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 10000 to 30000		166 MHz				39.37 mm
5962-9851001NUX	Xilinx	FPGA	Military	Ball	352	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	1296	CMOS	MIL-PRF-38535		22000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B352		1.7 mm	35 mm	No	Typical gates = 22000 to 65000		166 MHz				35 mm
XQ4085XL-1PG475M	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square		Ceramic, Metal-Sealed Cofired		No	3.6 V	3136	CMOS	MIL-PRF-38535		55000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P475		5.969 mm	54.864 mm	No	Typical gates = 55000 to 180000	e3	200 MHz				54.864 mm
XQVR1000-4CGG560M	Xilinx	FPGA	Military		560	HCGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	6144	CMOS			1124022	2.5		Grid Array, Heat Sink/Slug			2.375 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X560		4.9 mm	42.5 mm	No		e3					42.5 mm
5962-9851301QXA	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired		No	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	2.54 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e0	166 MHz				47.244 mm
5962-8982302MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS	MIL-STD-883	142	5000	5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	70 MHz		142		28.702 mm
5962-9473001MZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4					39.37 mm
XQ6VLX130T-1LFFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square		Plastic/Epoxy	128000	Yes		10000	CMOS		600				Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	10000 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XC7V2000T-1LFFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square		Plastic/Epoxy		Yes		305400							Grid Array				1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
5962-9225203MXX	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No							42.164 mm
XC7V855T-1LFFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XC7V285T-1LFFG1157E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
5962-01-394-1568	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic	100	No			CMOS		74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P84				No			70 MHz		74
XC4010-5PG191B	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	400		MIL-STD-883 Class B		7000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		400 CLBS, 7000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No							47.244 mm
XQ4036XL-3BG352N	Xilinx	FPGA	Military	Ball	352	LBGA	Square		Plastic/Epoxy	3078	Yes	3.6 V	1296	CMOS	MIL-PRF-38535	288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Typical gates = 22000 to 65000	e0	166 MHz	30 s	288	225 °C (437 °F)	35 mm
XC4025E-1PG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square		Ceramic, Metal-Sealed Cofired	1024	No	5.5 V	784	CMOS		256	13000	5	5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No		e0	166 MHz		256		52.324 mm
XC3042-100CB100MSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		144	CMOS			2000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000	e0	100 MHz				19.05 mm
5962R9957301NTB	Xilinx	FPGA	Military	Gull Wing	240	QFP	Square		Plastic/Epoxy	15552	Yes	2.625 V		CMOS	MIL-PRF-38535	166	661111	2.5	1.2/3.6,2.5 V	Flatpack	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)	0.8 ns	661111 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQFP-G240				Yes		e0			166
XC3195-5PG175M	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired	484	No		484	CMOS		144	6500	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000		190 MHz		144		42.164 mm
5962-8994801MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No		64	CMOS			1000	5		Grid Array				2.54 mm	125 °C (257 °F)		64 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.