Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3090-70CQ164MSPC0109	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	320	CMOS			9000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		70 MHz				27.432 mm
5962-01-374-8583	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic	64	Yes			CMOS	38535Q/M;38534H;883B	64		5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F100				No			50 MHz		64
XC4003E-3PGG120M	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	100	CMOS			2000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		100 CLBS, 2000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No		e3	125 MHz				34.544 mm
XQ2VP70-6EF1704N	Xilinx	FPGA	Military	Ball	1704	BGA	Square		Plastic/Epoxy		Yes	1.575 V	8272	CMOS				1.5		Grid Array			1.425 V	1 mm	125 °C (257 °F)	0.32 ns	8272 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1704		3.45 mm	42.5 mm			e0					42.5 mm
XC4006E-3PGG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	256	CMOS			4000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		256 CLBS, 4000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No		e3	125 MHz				42.164 mm
5962-9752401QXC	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired	1368	No	5.5 V	576	CMOS	MIL-PRF-38535 Class Q	192	10000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	3.9 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No	Typical gates = 10000-30000	e4	111 MHz		192		47.244 mm
XC3195-5PG175B	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired	484	No		484	CMOS	38535Q/M;38534H;883B	144	6500	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000		190 MHz		144		42.164 mm
XC4003A-6CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	238	Yes	5.5 V	100	CMOS	MIL-STD-883 Class B	77	2500	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	6 ns	100 CLBS, 2500 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100	1	3.429 mm	19.05 mm	No	360 flip-flops; typical gates = 2500-3000		90.9 MHz		77		19.05 mm
5962-9850901NUA	Xilinx	FPGA	Military	Ball	352	LBGA	Square			2432	Yes	5.5 V		CMOS	MIL-PRF-38535	256	28000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	4.5 V	1.27 mm	125 °C (257 °F)	2.2 ns	28000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-XBGA-B352		1.7 mm	35 mm	No		e0	143 MHz		256		35 mm
5962-9561202MXC	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired	484	No			CMOS	MIL-STD-883	144		5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No		e4	230 MHz		144		42.164 mm
5962R9957301QYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	15552	Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class Q	162	661111	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	661111 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.0226 mm	39.37 mm	Yes		e4			162		39.37 mm
XC7V585T-2FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square		Plastic/Epoxy		Yes		91050							Grid Array				1 mm	125 °C (257 °F)		91050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC7V450T-2FFG484E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4			No		e1		30 s		250 °C (482 °F)
5962-9230501MXC	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No		e4					47.244 mm
XC3090-50PG175BSPC0109	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	320	CMOS			9000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	14 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.5052 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz				42.164 mm
5962-8971302M9X	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
5962-9473002MZA	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4					39.37 mm
XC3042-50CQ100BSPC0107	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS			4200	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)		144 CLBS, 4200 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				17.272 mm
XC4036XL-3PG411M	Xilinx	FPGA	Military	Pin/Peg	411	HIPGA	Square		Ceramic, Metal-Sealed Cofired		No	3.6 V	1296	CMOS			22000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)		1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P411		5.334 mm	52.324 mm	No	Can also use 65000 gates						52.324 mm
5962-9957501NTC	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	3136	CMOS	MIL-PRF-38535 Class N		55000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Gold	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e4	200 MHz				32 mm
XC7VX485T-1LFFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes		75900							Grid Array					125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC3042-100CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS	MIL-STD-883 Class B	82	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.429 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	100 MHz		82		19.05 mm
XC4005E-4PG156B	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired	196	No	5.5 V	196	CMOS	MIL-STD-883 Class B	112	3000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.7 ns	196 CLBS, 3000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Typical gates = 3000-9000	e3	111 MHz		112		42.164 mm
5962-8971302MNA	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XQKU5P-1SFRB784M	Xilinx	FPGA	Military	Ball	784	FBGA	Square		Plastic/Epoxy	474600	Yes	.876 V	27120		MIL-PRF-38535	304		0.85		Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	125 °C (257 °F)		27120 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B784	4	3.52 mm	23 mm			e0		20 s	304	225 °C (437 °F)	23 mm
5962R9957201NUA	Xilinx	FPGA	Military	Ball	432	LBGA	Square		Plastic/Epoxy	6912	Yes	2.625 V		CMOS	MIL-PRF-38535	316	322970	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	322970 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432		1.7 mm	40 mm	Yes		e0			316		40 mm
XQR2V3000-4BG728R	Xilinx	FPGA	Military	Ball	728	BGA	Square		Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA728,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B728	3	2.6 mm	35 mm	No		e0	650 MHz		516		35 mm
XQ6VSX475T-1LRF1759M	Xilinx	FPGA	Military	Ball	1759	BGA	Square		Plastic/Epoxy	476160	Yes		37200	CMOS		840				Grid Array	BGA1759,42X42,40			1 mm	125 °C (257 °F)	0.85 ns	37200 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	4.37 mm	42.5 mm			e0			840		42.5 mm
XQ4085XL-1BG432N	Xilinx	FPGA	Military	Ball	432	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	3136	CMOS	MIL-PRF-38535		55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Typical gates = 55000 to 180000	e0	200 MHz	30 s		225 °C (437 °F)	40 mm
5962-8863801MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No				MIL-STD-883					Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm
5962-8982303MUX	Xilinx	FPGA	Military	Flat	164	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No							27.432 mm
XC4003A-6PG120M	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square		Ceramic, Metal-Sealed Cofired	238	No	5.5 V	100	CMOS		80	2500	5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	6 ns	100 CLBS, 2500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P120		3.81 mm	34.544 mm	No	360 flip-flops; typical gates = 2500-3000		90.9 MHz		80		34.544 mm
5962-8982301MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS	MIL-STD-883	142	5000	5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)		320 CLBS, 5000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	50 MHz		142		28.702 mm
XC4020E-1PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			166 MHz				47.244 mm
5962-9957301NUA	Xilinx	FPGA	Military	Ball	432	LBGA	Square		Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS	MIL-PRF-38535	316	661111	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	661111 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432		1.7 mm	40 mm	No		e0			316		40 mm
XQ4025E-4PG228M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square		Ceramic	2432	No		1024	CMOS	38535Q/M;38534H;883B	192		5	5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Perpendicular	S-XPGA-P299				No		e0	111 MHz		192
5962-9561202MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	484	Yes			CMOS	MIL-STD-883	142		5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	230 MHz		142		28.702 mm
XC3090-70PG175BSPC0109	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	320	CMOS			9000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	9 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.5052 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		70 MHz				42.164 mm
XC3090-50CB164MSPC0107	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000	e0	50 MHz				28.702 mm
5962-9230502NYA	Xilinx	FPGA	Military	Flat	164	QFF	Square				Yes	5.5 V		CMOS	MIL-PRF-38535 Class N		5000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	6 ns	5000 Gates	-55 °C (-67 °F)		Quad	S-XQFP-F164		2.92 mm	28.702 mm	No			50 MHz				28.702 mm
XC4013E-4PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired	576	No	5.5 V	576	CMOS		192	10000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.7 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P223	1	4.318 mm	47.244 mm	No	Typical gates = 10000-30000	e0	111 MHz		192		47.244 mm
5962-9957201NUX	Xilinx	FPGA	Military	Ball	432	LBGA	Square		Plastic/Epoxy		Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class N		322970	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B432		1.7 mm	40 mm	No							40 mm
5962-9225203MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No							28.702 mm
XC4006E-3PG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired	608	No	5.5 V	256	CMOS		125	4000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		256 CLBS, 4000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No			125 MHz		125		42.164 mm
XQ6VSX315T-1LRF1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square		Plastic/Epoxy	314880	Yes		24600	CMOS		600				Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	24600 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XC3064-70PG132M	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	224	No		224	CMOS		110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	9 ns	224 CLBS, 3500 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA	e3	70 MHz		110		37.084 mm
5962-9851001NTB	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy	3078	Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class N	193	22000	3.3	3.3 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No	Maximum usable gates 65000	e0	166 MHz		193		32 mm
XC7V2000T-3FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V		125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.