Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5962-9851101NUA	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS	MIL-PRF-38535	352	40000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432		1.7 mm	40 mm	No	Typical gates = 40000 to 130000	e0	166 MHz		352		40 mm
XC4025E-2PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	1024	No	5.5 V	784	CMOS		256	13000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			125 MHz		256		47.244 mm
XC7V855T-1FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
5962-8863801MXC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No				MIL-STD-883					Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4					27.94 mm
5962-9851001QZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class Q		22000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 65000		166 MHz				39.37 mm
XQ4036XL-3BGG352N	Xilinx	FPGA	Military	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS	MIL-PRF-38535		22000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Typical gates = 22000 to 65000	e1	166 MHz	30 s		260 °C (500 °F)	35 mm
XC7V855T-2FFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
XQV100-4CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	2700	Yes	2.625 V	600	CMOS	MIL-PRF-38535	162	108904	2.5	1.5/3.3,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	600 CLBS, 108904 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0			162		39.37 mm
XC3064-50PG132MSPC0107	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No		224	CMOS			3500	5		Grid Array				2.54 mm	125 °C (257 °F)		224 CLBS, 3500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500		50 MHz				37.084 mm
5962-9225203MXC	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired	466	No			CMOS	MIL-STD-883	112		5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No		e4	133.3 MHz		112		42.164 mm
5962-9230503MXX	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)	5 ns		-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No							47.244 mm
XC7V2000T-1FFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V		125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
5962-9851301QZA	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	576	CMOS			10000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 30000	e0	166 MHz				39.37 mm
XC3020-50CQ100B	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired	64	Yes	5.5 V	64	CMOS	38535Q/M;38534H;883B	64	2000	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	14 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops	e0	50 MHz		64		17.272 mm
XC4003E-4PGG120M	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	100	CMOS			2000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		100 CLBS, 2000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No		e3	111 MHz				34.544 mm
XQV600-4HQG240N	Xilinx	FPGA	Military	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	2.625 V	3456	CMOS	MIL-PRF-38535		661111	2.5		Flatpack, Heat Sink/Slug, Fine Pitch			2.375 V	.5 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3					32 mm
XC7V855T-1LFFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
XC7V855T-1FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XC7V450T-1FFG484E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4			No		e1		30 s		250 °C (482 °F)
XQ4010E-4CB196M	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS	MIL-PRF-38535	160	7000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.7 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F196		3.302 mm	34.29 mm	No	Maximum usable gates = 20000	e0	111 MHz		160		34.29 mm
XC3042-50CQ100B	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes	5.5 V	144	CMOS	38535Q/M;38534H;883B	82	4200	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	14 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops	e0	50 MHz		82		17.272 mm
5962-9851001NTX	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class N		22000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Maximum usable gates 65000		166 MHz				32 mm
XC3090-50PG175M	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No		320	CMOS		144	5000	5	5 V	Grid Array	PGA176,16X16MOD	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)		320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA		50 MHz		144		42.164 mm
5962-01-414-9654	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic	144	Yes			CMOS	38535Q/M;38534H;883B	82		5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F100				No			50 MHz		82
XQR4VFX140-10CF1509V	Xilinx	FPGA	Military		1509	CGA	Square	Ceramic, Metal-Sealed Cofired	142128	Yes	1.26 V	16128	CMOS	38535V;38534K;883S	768		1.2	1.2,2.5,3.3 V	Grid Array	PGA1509,39X39,39	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		16128 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1509		8.47 mm	40 mm	No			1028 MHz		768		40 mm
5962-8982301MYX	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	14 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0					27.432 mm
XC3195A-4PG175B	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No		484	CMOS	MIL-STD-883 Class B		6500	5		Grid Array				2.54 mm	125 °C (257 °F)	3.3 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No							42.164 mm
XQ6VSX475T-1RF1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V	37200	CMOS		600		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	125 °C (257 °F)	0.79 ns	37200 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XC4003E-1PG120M	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS		80	2000	5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		100 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No			166 MHz		80		34.544 mm
XC4010E-3PG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	400	CMOS			7000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		400 CLBS, 7000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No			125 MHz				47.244 mm
XC7VX485T-1LFFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes		75900							Grid Array				1 mm	125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4		35 mm	No		e1					35 mm
XC3042-100PG84M	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No		144	CMOS		74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		100 MHz		74		27.94 mm
5962-9473001MXC	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e4					47.244 mm
5962-9957501NX	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS	MIL-PRF-38535		55000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Typical gates = 55000 to 180000		200 MHz				32 mm
XC7V1500T-2FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes		229050							Grid Array				1 mm	125 °C (257 °F)		229050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XQ6VLX130T-2RF1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS		600				Grid Array	BGA1156,34X34,40		.95 V	1 mm	125 °C (257 °F)	0.67 ns	10000 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm			e0	1286 MHz		600		35 mm
5962-9752301QXX	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	400		MIL-PRF-38535 Class Q		7000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	3.9 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	Typical gates = 7000-20000						47.244 mm
5962-8982303MYX	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No							27.432 mm
5962R9957201NUX	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V		CMOS			322970	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	322970 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B432		1.7 mm	40 mm	Yes							40 mm
5962-9473001MZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4					39.37 mm
XC3090-100PG175BSPC0107	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No		320	CMOS			5000	5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000		100 MHz				42.164 mm
XC4025E-4PGG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	1024	CMOS			15000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	3.9 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Typical gates = 15000-45000	e3	111 MHz				52.324 mm
XQ4085XL-3BG432N	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136				55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	2.9 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	166 MHz				40 mm
XQV600-4HQ240N	Xilinx	FPGA	Military	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS	MIL-PRF-38535	166	661111	2.5	1.2/3.6,2.5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		30 s	166	225 °C (437 °F)	32 mm
5962-9851101QYB	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2304	CMOS	MIL-PRF-38535 Class Q		40000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 130000	e0	166 MHz				39.37 mm
XQ6VLX550T-1LRF1759M	Xilinx	FPGA	Military	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes		42960	CMOS		840				Grid Array	BGA1759,42X42,40			1 mm	125 °C (257 °F)	0.85 ns	42960 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	4.37 mm	42.5 mm			e0			840		42.5 mm
5962-9851001QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	3078	Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class Q	192	22000	3.3	3.3 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	3 V	.635 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 65000	e4	166 MHz		192		39.37 mm
XC4003A-6PG120B	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square	Ceramic, Metal-Sealed Cofired	238	No	5.5 V	100	CMOS	MIL-STD-883 Class B	80	2500	5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	6 ns	100 CLBS, 2500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No	360 flip-flops; typical gates = 2500-3000		90.9 MHz		80		34.544 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.