Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5962-9851101QXB	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	2304	CMOS	MIL-PRF-38535 Class Q		40000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P475		5.969 mm	54.864 mm	No		e0	166 MHz				54.864 mm
5962-8971303MMC	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes	5.5 V		CMOS	MIL-STD-883	82	4200	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		4200 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.2258 mm	19.05 mm	No		e4	100 MHz		82		19.05 mm
XQ5VFX70T-1EF1136M	Xilinx	FPGA	Military	Ball	1136	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	6080	CMOS		640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)	0.9 ns		-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1136		3.4 mm	35 mm	No		e0	1098 MHz		640		35 mm
XQ4028EX-4PG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired	2432	No	5.5 V	1024	CMOS	MIL-PRF-38535	256	18000	5	5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.2 ns	1024 CLBS, 18000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Maximum usable gates = 50000	e3	143 MHz		256		52.324 mm
XQ4062XL-3PG475M	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired	5472	No	3.6 V	2304	CMOS	MIL-PRF-38535	352	40000	3.3	3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	SPGA475,41X41	Field Programmable Gate Arrays	3 V	2.54 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P475		5.969 mm	54.864 mm	No	Typical gates = 40000 to 130000	e3	166 MHz		352		54.864 mm
XC3090-100CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS	MIL-STD-883 Class B	142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164	1	3.302 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e0	100 MHz		142		28.702 mm
XC4013E-2PGG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	576	CMOS			10000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		576 CLBS, 10000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e3	125 MHz				47.244 mm
XC3042-70PG84MSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		144	CMOS			2000	5		Grid Array				2.54 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000		70 MHz				27.94 mm
XC4020E-2PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			125 MHz				47.244 mm
XC4010E-1PGG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	400	CMOS			7000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		400 CLBS, 7000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No		e3	166 MHz				47.244 mm
5962-8982301MTC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes			CMOS	MIL-STD-883	142		5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	50 MHz		142		28.702 mm
5962-8982303MXC	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No	5.5 V	320	CMOS	MIL-STD-883	144	9000	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	7 ns	9000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No		e4	100 MHz		144		42.164 mm
XC4008E-1PG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	324	CMOS			6000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		324 CLBS, 6000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No			166 MHz				47.244 mm
XQ4013XL-3CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	1368	Yes	3.6 V	576	CMOS	MIL-PRF-38535	192	10000	3.3	3.3 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	3 V	.635 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228	1	3.302 mm	39.37 mm	No	Typical gates = 10000 to 30000	e0	166 MHz		192		39.37 mm
5962-9561102MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes			CMOS	MIL-STD-883	142		5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	230 MHz		142		28.702 mm
XC3020-70CQ100BSPC0110	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				17.272 mm
XC3090-50CQ164MSPC0107	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	320	CMOS			9000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)		320 CLBS, 9000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz				27.432 mm
XC4013E-1PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	576	CMOS			10000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		576 CLBS, 10000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			166 MHz				47.244 mm
5962-9471202MZC	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XQR2V1000-4BG575R	Xilinx	FPGA	Military	Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No		e0	650 MHz		328	225 °C (437 °F)	31 mm
XC4005-6CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	466	Yes	5.5 V	196	CMOS		112	4000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	6 ns	196 CLBS, 4000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	616 flip-flops; typical gates = 4000-5000	e0	90.9 MHz		112		28.702 mm
XC3042-50CB100BSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		144	CMOS			2000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		144 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000		50 MHz				19.05 mm
XQV2000E-6FG1156N	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	38535Q/M;38534H;883B	804	2541952	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	125 °C (257 °F)		9600 CLBS, 2541952 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e0	357.2 MHz	30 s	804	225 °C (437 °F)	35 mm
XC7V2000T-1LFFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy		Yes		305400							Grid Array					125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
XC7V450T-3FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
5962-8971302QTA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS	MIL-PRF-38535 Class Q		4200	5		Flatpack			4.5 V		125 °C (257 °F)	9 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							70 MHz
XC7V450T-3FFG784E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1761	4			No		e1		30 s		245 °C (473 °F)
XQ4VLX40-10FFG668M	Xilinx	FPGA	Military	Ball	668	BGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS						Grid Array	BGA668,26X26,40		1.14 V	1 mm	125 °C (257 °F)	0.78 ns		-55 °C (-67 °F)		Bottom	S-PBGA-B668		2.85 mm	27 mm								27 mm
XQV2000E-6FGG1156N	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.89 V	9600	CMOS			2541952	1.8		Grid Array			1.71 V	1 mm	125 °C (257 °F)		9600 CLBS, 2541952 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	357.2 MHz				35 mm
XC3142-5CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS		82	3000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 3000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz		82		19.05 mm
XC4025E-1PGG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No		e3	166 MHz				52.324 mm
5962-9957201QZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q		322970	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	Yes							39.37 mm
XC7V2000T-3FFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V		125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
5962-9850901QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	2432	Yes	5.5 V		CMOS	MIL-PRF-38535 Class Q	192	28000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.2 ns	28000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.0226 mm	39.68 mm	No		e4	143 MHz		192		39.68 mm
XQ4VLX60-10FFG1148M	Xilinx	FPGA	Military	Ball	1148	BGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS						Grid Array	BGA1148,34X34,40		1.14 V	1 mm	125 °C (257 °F)	0.78 ns		-55 °C (-67 °F)		Bottom	S-PBGA-B1148		3.4 mm	35 mm								35 mm
XC7V855T-3FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XQV2000E-6BGG560N	Xilinx	FPGA	Military	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	1.89 V	9600	CMOS			2541952	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	125 °C (257 °F)		9600 CLBS, 2541952 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	357.2 MHz	30 s		260 °C (500 °F)	42.5 mm
XC3020-50CQ100BSPC0107	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	14 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				17.272 mm
5962-9851101QX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2304	CMOS	MIL-PRF-38535		40000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 40000 to 130000		166 MHz				39.37 mm
XC7V855T-3FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
5962-9561001MZX	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XQ7A100T-1MFG484M	Xilinx	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V						1		Grid Array			.95 V	1 mm	125 °C (257 °F)	1.27 ns		-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0					23 mm
XC4010-10PG191B	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	400	CMOS	MIL-STD-883 Class B		8000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	1120 flip-flops; typical gates = 8000-10000						47.244 mm
5962-9957501QX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	3136	CMOS	MIL-PRF-38535		55000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 55000 to 180000		200 MHz				39.37 mm
XC3142A-5PQ100B	Xilinx	FPGA	Military	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes		144	CMOS	38535Q/M;38534H;883B	82	3000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 3000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz	30 s	82	225 °C (437 °F)	20 mm
5962-8982301XX	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Rectangular	Ceramic, Metal-Sealed Cofired		No	5.5 V	320	CMOS	MIL-STD-883		9000	5		Grid Array			4.5 V		125 °C (257 °F)	14 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	R-CPGA-P175				No		e4	16 MHz
XC3090-50PG175B	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No		320	CMOS	MIL-STD-883 Class B	144	5000	5	5 V	Grid Array	PGA176,16X16MOD	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	14 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA		50 MHz		144		42.164 mm
5962-9851301NUX	Xilinx	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535		10000	3.3		Grid Array			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B256		2.55 mm	27 mm	No	Typical gates = 10000 to 30000		166 MHz				27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.