Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5962-9230502NYA	Xilinx	FPGA	Military	Flat	164	QFF	Square			Yes	5.5 V		CMOS	MIL-PRF-38535 Class N		5000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	6 ns	5000 Gates	-55 °C (-67 °F)		Quad	S-XQFP-F164		2.92 mm	28.702 mm	No			50 MHz				28.702 mm
XC4013E-4PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	576	No	5.5 V	576	CMOS		192	10000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.7 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P223	1	4.318 mm	47.244 mm	No	Typical gates = 10000-30000	e0	111 MHz		192		47.244 mm
5962-9957201NUX	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class N		322970	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B432		1.7 mm	40 mm	No							40 mm
5962-9225203MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No							28.702 mm
XC4006E-3PG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired	608	No	5.5 V	256	CMOS		125	4000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		256 CLBS, 4000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No			125 MHz		125		42.164 mm
XQ6VSX315T-1LRF1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes		24600	CMOS		600				Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	24600 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XC3064-70PG132M	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	224	No		224	CMOS		110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	9 ns	224 CLBS, 3500 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA	e3	70 MHz		110		37.084 mm
5962-9851001NTB	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy	3078	Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class N	193	22000	3.3	3.3 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No	Maximum usable gates 65000	e0	166 MHz		193		32 mm
XC7V2000T-3FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V		125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
5962-9471201MYC	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XC3142A-5CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS	38535Q/M;38534H;883B	82	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.429 mm	19.05 mm	No	Typical gates = 2000-3000	e0	188 MHz		82		19.05 mm
XQ4013XL-3BGG256N	Xilinx	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535		10000	3.3		Grid Array			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Typical gates = 10000 to 30000	e1	166 MHz	30 s		250 °C (482 °F)	27 mm
XQKU15P-1FFRA1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		MIL-PRF-38535	564		0.85		Grid Array	BGA1156,34X34,40		.825 V	1 mm	125 °C (257 °F)		65340 CLBs	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.71 mm	35 mm			e0		20 s	564	225 °C (437 °F)	35 mm
XQ4036XL-3HQ240N	Xilinx	FPGA	Military	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	3078	Yes	3.6 V	1296	CMOS	MIL-PRF-38535	193	22000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Typical gates = 22000 to 65000	e0	166 MHz	30 s	193	225 °C (437 °F)	32 mm
5962-9561201MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	484	Yes			CMOS	MIL-STD-883	142		5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	190 MHz		142		28.702 mm
5962-8982302MXC	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No		320	CMOS	MIL-STD-883	144	5000	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	2 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No		e4	70 MHz		144		42.164 mm
XC3020-50PG84BSPC0110	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	64	CMOS			2000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	14 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz				27.94 mm
XC4013E-2PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	576	CMOS			10000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		576 CLBS, 10000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			125 MHz				47.244 mm
XQV1000E-6BGG560N	Xilinx	FPGA	Military	Ball	560	LBGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS			1569178	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	125 °C (257 °F)	0.47 ns	6144 CLBS, 1569178 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	357.2 MHz	30 s		260 °C (500 °F)	42.5 mm
XC7V2000T-1FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V	1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
5962-9957501QYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	3136	CMOS	MIL-PRF-38535 Class Q		55000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4	200 MHz				39.37 mm
XQVR300-4CB228B	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic	6912	Yes			CMOS	38535Q/M;38534H;883B	162			1.5/3.3,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQFP-F228				No		e0			162
XC4006E-1PGG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	256	CMOS			4000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		256 CLBS, 4000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No		e3	166 MHz				42.164 mm
XC7V2000T-1FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V	1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
5962-9851301QXC	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	1368	No	3.6 V	576	CMOS	MIL-PRF-38535 Class Q	192	10000	3.3	3.3 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	3 V	2.54 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e4	166 MHz		192		47.244 mm
XC4008E-2PG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired	324	No	5.5 V	324	CMOS		144	6000	5	5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		324 CLBS, 6000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No			125 MHz		144		47.244 mm
XC3090-50PG175BSPC0107	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No		320	CMOS			5000	5		Grid Array				2.54 mm	125 °C (257 °F)	14 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000		50 MHz				42.164 mm
XC4010E-4CB196B	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS	MIL-STD-883 Class B	160	7000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	2.7 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F196	1	3.302 mm	28.702 mm	No	Typical gates = 7000-20000	e0	111 MHz		160		28.702 mm
XQ4025E-4CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	2432	Yes	5.5 V	1024	CMOS	MIL-PRF-38535	192	15000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.7 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates = 45000	e0	111 MHz		192		39.37 mm
XC4020E-4PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			111 MHz				47.244 mm
XQ4VLX25-10SF363M	Xilinx	FPGA	Military	Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		240		1.2	1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	125 °C (257 °F)		2688 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1028 MHz	30 s	240	225 °C (437 °F)	17 mm
XQ4VLX25-10SFG363M	Xilinx	FPGA	Military	Ball	363	FBGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS						Grid Array, Fine Pitch	BGA363,20X20,32		1.14 V	.8 mm	125 °C (257 °F)	0.78 ns		-55 °C (-67 °F)		Bottom	S-PBGA-B363		1.99 mm	17 mm								17 mm
XC3020-100CB100BSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		64	CMOS			1000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500	e0	100 MHz				19.05 mm
XQV300-4CBG228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q		322970	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3					39.37 mm
XQ6VSX475T-1FFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V	37200	CMOS		600		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	125 °C (257 °F)	0.79 ns	37200 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
5962-8971301MZC	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No			CMOS	MIL-STD-883	96		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	14 ns		-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No		e4	50 MHz		96		37.084 mm
XQV1000E-6BG560N	Xilinx	FPGA	Military	Ball	560	LBGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	38535Q/M;38534H;883B	404	1569178	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1569178 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B560		1.7 mm	42.5 mm	No			357.2 MHz		404		42.5 mm
XC3190A-5PG175M	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No		320	CMOS		144	5000	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	Typical gates = 5000-6000		188 MHz		144		42.164 mm
XC3142A-4CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		144	CMOS	MIL-STD-883 Class B		2000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	3.3 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		3.429 mm	19.05 mm	No	3000 Logic gates can also be used						19.05 mm
5962-9752401QYX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	576		MIL-PRF-38535 Class Q		10000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 10000-30000						39.37 mm
5962-8994802MYX	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired	64	Yes			CMOS	MIL-STD-883	64		5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0	70 MHz		64		17.272 mm
XQV1000-4CGG560Q	Xilinx	FPGA	Military		560	HCGA	Square	Ceramic, Metal-Sealed Cofired	27648	Yes	2.625 V	6144	CMOS	MIL-PRF-38535 Class Q		1124022	2.5		Grid Array, Heat Sink/Slug			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X560		4.9 mm	42.5 mm	No		e3					42.5 mm
XC3030-100PG84MSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		100	CMOS			1500	5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns	100 CLBS, 1500 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	360 flip-flops; typical gates = 1500-2000	e3	100 MHz				27.94 mm
XC7V2000T-2FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V	1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
5962-8971302XX	Xilinx	FPGA	Military		100			Ceramic, Metal-Sealed Cofired					CMOS				5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad			3.429 mm	19.05 mm	No							19.05 mm
5962-9957501QXC	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	3136	CMOS	MIL-PRF-38535 Class Q		55000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P475		5.969 mm	54.864 mm	No		e4	200 MHz				54.864 mm
XQKU040-1RSA784M	Xilinx	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy		Yes		30300					.95		Grid Array					125 °C (257 °F)		30300 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B784						e0
XC4010-10CB196B	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	400	CMOS	MIL-STD-883 Class B		8000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	28.702 mm	No	1120 flip-flops; typical gates = 8000-10000						28.702 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.