Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3030-50PG84M	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	100	No		100	CMOS		74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)		100 CLBS, 1500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA		50 MHz		74		27.94 mm
XQ4036XL-3CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	3078	Yes	3.6 V	1296	CMOS	MIL-PRF-38535	192	22000	3.3	3.3 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	3 V	.635 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228	1	3.302 mm	39.37 mm	No	Typical gates = 22000 to 65000	e0	166 MHz		192		39.37 mm
XC4005E-4CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	466	Yes	5.5 V	196	CMOS		112	3000	5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.7 ns	196 CLBS, 3000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164	1	3.302 mm	28.702 mm	No	Typical gates = 3000-9000	e0	111 MHz		112		28.702 mm
5962-9851301NXX	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Typical gates = 10000 to 30000		166 MHz				32 mm
5962-9230503MXC	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square		Ceramic, Metal-Sealed Cofired	950	No			CMOS	MIL-STD-883	160		5	5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	5 ns		-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No		e4	77 MHz		160		47.244 mm
XQ6VLX240T-1LRF1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square		Plastic/Epoxy	241152	Yes		18840	CMOS		600				Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	18840 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
5962-8994801MTX	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes			CMOS	MIL-STD-883	64		5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0	50 MHz		64		17.272 mm
5962-8863801XC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4					27.94 mm
5962-9471202MXC	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)	6 ns		-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No		e4					34.544 mm
5962-8994802XX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Rectangular		Ceramic, Metal-Sealed Cofired		No	5.5 V	64	CMOS	MIL-STD-883		2000	5		Grid Array			4.5 V		125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	R-CPGA-P84				No		e4	25 MHz
5962-8863805XX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS	MIL-STD-883		1800	5		Grid Array			4.5 V		125 °C (257 °F)		1800 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84				No
XC7V285T-1LFFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XC7VX485T-3FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square		Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		600		1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	125 °C (257 °F)	0.58 ns	37950 CLBS	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157		3.35 mm	35 mm	No		e1	1818 MHz		600		35 mm
XQ7VX330T-1RF1157M	Xilinx	FPGA	Military	Ball	1157	BGA	Square		Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG		600		1		Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	25500 CLBS	-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B1157		3.48 mm	35 mm			e0			600		35 mm
5962-9752501QXC	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square		Ceramic, Metal-Sealed Cofired	2432	No	5.5 V	1024	CMOS	MIL-PRF-38535 Class Q	256	15000	5	5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	3.9 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Typical gates = 15000-45000	e4			256		52.324 mm
5962R9957201QYX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q		322970	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)		1536 CLBS, 322970 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	Yes							39.37 mm
XC4025E-4CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	2432	Yes	5.5 V	1024	CMOS		192	15000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 15000-45000	e0	111 MHz		192		39.37 mm
XQ4013XL-3PQG240N	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535		10000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Typical gates = 10000 to 30000	e3	166 MHz	30 s		245 °C (473 °F)	32 mm
5962-9957501NT	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	3136	CMOS	MIL-PRF-38535		55000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Typical gates = 55000 to 180000		200 MHz				32 mm
XQ4013E-4CB228B	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic	1368	Yes		576	CMOS	38535Q/M;38534H;883B	192		5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQFP-F228			39.37 mm	No		e0	111 MHz		192		39.37 mm
5962-9752301QYC	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS	MIL-PRF-38535 Class Q	160	7000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	34.29 mm	No	Typical gates = 7000-20000	e4	111 MHz		160		34.29 mm
XQVR300-4CBG228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q		322970	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)		1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3					39.37 mm
XC3042-100PG84BSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No		144	CMOS			2000	5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000	e3	100 MHz				27.94 mm
XQVR600-4CB228V	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	15552	Yes	2.625 V	3456	CMOS		316	661111	2.5	1.5/3.3,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)		3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0			316		39.37 mm
XC4020E-1PGG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e3	166 MHz				47.244 mm
XC3042-50PG84BSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No		144	CMOS			2000	5		Grid Array				2.54 mm	125 °C (257 °F)	14 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000		50 MHz				27.94 mm
5962R9957401QXX	Xilinx	FPGA	Military	Ball	560	BGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V		CMOS			1124022	2.5		Grid Array			2.375 V	1.27 mm	125 °C (257 °F)		1124022 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-B560		5.35 mm	42.5 mm	No							42.5 mm
5962-9752501QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	2432	Yes	5.5 V	1024	CMOS	MIL-PRF-38535 Class Q	192	15000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 15000-45000	e4			192		39.37 mm
5962-8971301MZX	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)	14 ns		-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No		e4					37.084 mm
5962-9225201MXX	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired		No		196	CMOS			4000	5		Grid Array				2.54 mm	125 °C (257 °F)		196 CLBS, 4000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No							42.164 mm
5962-9225201MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4					28.702 mm
5962-8971301MMC	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes			CMOS	MIL-STD-883	82		5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4	50 MHz		82		19.05 mm
XC7V285T-2FFG1157E	Xilinx	FPGA	Military	Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
5962-8971303MYX	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
5962-9473001MYX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4					39.37 mm
XC3090-100PG175MSPC0107	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired		No		320	CMOS			5000	5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000		100 MHz				42.164 mm
XC7V2000T-1FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V		125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC4005-6PG156B	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired	196	No	5.5 V	196	CMOS	MIL-STD-883 Class B	112	4000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	6 ns	196 CLBS, 4000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	616 flip-flops; typical gates = 4000-5000		90.9 MHz		112		42.164 mm
5962-01-397-0210	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic	224	No			CMOS		110		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P132				No			70 MHz		110
XQ4062XL-3HQ240N	Xilinx	FPGA	Military	Gull Wing	240	HFQFP	Square		Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS	MIL-PRF-38535	193	40000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Typical gates = 40000 to 130000	e0	166 MHz	30 s	193	225 °C (437 °F)	32 mm
XC7V855T-1LFFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square		Plastic/Epoxy		Yes									Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XQ4010E-4CB196M	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS	MIL-PRF-38535	160	7000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.7 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F196		3.302 mm	34.29 mm	No	Maximum usable gates = 20000	e0	111 MHz		160		34.29 mm
CP21600CPGA383A-0M	Renesas Electronics	FPGA	Military	Pin/Peg	383	PGA			Ceramic	11760	No			CMOS		250		5	5 V	Grid Array	PGA383(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Perpendicular					No		e0			250
CP20420CPGA155A-0M	Renesas Electronics	FPGA	Military	Pin/Peg	155	PGA	Square		Ceramic	3584	No			CMOS		122		5	5 V	Grid Array	PGA155,15X15	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Perpendicular	S-XPGA-P155				No		e0			122
CP22000CPGA383A-0M	Renesas Electronics	FPGA	Military	Pin/Peg	383	PGA			Ceramic	14736	No			CMOS		270		5	5 V	Grid Array	PGA383(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Perpendicular					No		e0			270
CP21200CQFP208A-0M	Renesas Electronics	FPGA	Military	Gull Wing	208	QFP	Square		Ceramic	8960	Yes			CMOS		203		5	5 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays		.5 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Quad	S-XQFP-G208				No		e0			203
CP21200CPGA299A-0M	Renesas Electronics	FPGA	Military	Pin/Peg	299	PGA			Ceramic	8960	No			CMOS		203		5	5 V	Grid Array	PGA299(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Perpendicular					No		e0			203
CP20840CPGA223A-0M	Renesas Electronics	FPGA	Military	Pin/Peg	223	PGA	Square		Ceramic	6740	No			CMOS		180		5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Perpendicular	S-XPGA-P223				No		e0			180

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.