Military Field Programmable Gate Arrays (FPGA) 1,437

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP1SGX25FF1020I5	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes			CMOS		607		1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		1 mm	135 °C (275 °F)		-65 °C (-85 °F)		Bottom	S-PBGA-B1020	3			No				607	220 °C (428 °F)
EP1SGX25DF1020I6	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes			CMOS		607		1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		1 mm	135 °C (275 °F)		-65 °C (-85 °F)		Bottom	S-PBGA-B1020	3			No				607	220 °C (428 °F)
EP4SGX110FF35M3N	Altera	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	105600	Yes	.93 V	4224			488	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	125 °C (257 °F)	4224 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.4 mm	35 mm					488		35 mm
EP4SGX230DF29M3	Altera	FPGA	Military	Ball	780	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120			372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	125 °C (257 °F)	9120 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B780		3.5 mm	29 mm					372		29 mm
EPB1400JM	Altera	FPGA	Military	J Bend	44	QCCJ	Square	Ceramic		Yes			CMOS					Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays		1.27 mm	125 °C (257 °F)		-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-J44				No	e0				220 °C (428 °F)
EP4SE820F43M3	Altera	FPGA	Military	Ball	1760	BGA	Square	Plastic/Epoxy	813050	Yes	.93 V	32522			1120	0.9		Grid Array	BGA1760,42X42,40		.87 V	1 mm	125 °C (257 °F)	32522 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1760		3.5 mm	42.5 mm					1120		42.5 mm
EP1SGX40GF1020I6N	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS		624	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)	4697 CLBS	-65 °C (-85 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e1		30 s	624	245 °C (473 °F)	33 mm
EP4SGX290KF40M3	Altera	FPGA	Military	Ball	1517	BGA	Square	Plastic/Epoxy	291200	Yes	.93 V	11648			744	0.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	125 °C (257 °F)	11648 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm					744		40 mm
EP1SGX40GF1020I5N	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V		CMOS		624	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)		-65 °C (-85 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e1		40 s	624	245 °C (473 °F)	33 mm
EP1SGX25CF672I6	Altera	FPGA	Military	Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS		455	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)	2852 CLBS	-65 °C (-85 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No	e0		20 s	455	220 °C (428 °F)	27 mm
EP1SGX25DF1020I5	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes			CMOS		607		1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		1 mm	135 °C (275 °F)		-65 °C (-85 °F)		Bottom	S-PBGA-B1020	3			No				607	220 °C (428 °F)
EP4SGX180HF35M3	Altera	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	175750	Yes	.93 V	7030			564	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	125 °C (257 °F)	7030 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.4 mm	35 mm					564		35 mm
EP1SGX10DF672I6N	Altera	FPGA	Military	Ball	672	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS		362	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)	1200 CLBS	-65 °C (-85 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No	e1		30 s	362	245 °C (473 °F)	27 mm
EP4SGX360FF35M3N	Altera	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144			564	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	125 °C (257 °F)	14144 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.4 mm	35 mm					564		35 mm
EP4SGX290FH29M3	Altera	FPGA	Military	Ball	780	BGA	Square	Plastic/Epoxy	291200	Yes	.93 V	11648			289	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	125 °C (257 °F)	11648 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B780		3.4 mm	33 mm					289		33 mm
EP1SGX40GF1020I7	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes			CMOS		624		1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		1 mm	135 °C (275 °F)		-65 °C (-85 °F)		Bottom	S-PBGA-B1020	3			No				624	220 °C (428 °F)
EP1SGX25CF1020C6	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes			CMOS		607		1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		1 mm	135 °C (275 °F)		-65 °C (-85 °F)		Bottom	S-PBGA-B1020				No				607
EP4SGX360KF43M3N	Altera	FPGA	Military	Ball	1760	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144			880	0.9		Grid Array	BGA1760,42X42,40		.87 V	1 mm	125 °C (257 °F)	14144 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1760		3.5 mm	42.5 mm					880		42.5 mm
EP1SGX25DF672I7	Altera	FPGA	Military	Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes			CMOS		455		1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm	135 °C (275 °F)		-65 °C (-85 °F)		Bottom	S-PBGA-B672	3			No				455	220 °C (428 °F)
EP4SGX360KF43M3	Altera	FPGA	Military	Ball	1760	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144			744	0.9		Grid Array	BGA1760,42X42,40		.87 V	1 mm	125 °C (257 °F)	14144 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1760		3.5 mm	42.5 mm					744		42.5 mm
EP4SGX360FH29M3N	Altera	FPGA	Military	Ball	780	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144				0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	125 °C (257 °F)	14144 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B780		3.4 mm	33 mm							33 mm
EP4SGX230HF35M3N	Altera	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120			564	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	125 °C (257 °F)	9120 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm					564		35 mm
EP1SGX25CF1020C5	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes			CMOS		607		1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		1 mm	135 °C (275 °F)		-65 °C (-85 °F)		Bottom	S-PBGA-B1020				No				607
EP4SGX360KF40M3N	Altera	FPGA	Military	Ball	1517	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144			744	0.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	125 °C (257 °F)	14144 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm					744		40 mm
EP1SGX25CF1020I6	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes			CMOS		607		1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		1 mm	135 °C (275 °F)		-65 °C (-85 °F)		Bottom	S-PBGA-B1020				No				607
EP1SGX40GF1020I6	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS		624	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)	4697 CLBS	-65 °C (-85 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0		20 s	624	220 °C (428 °F)	33 mm
EP1SGX10CF672I6	Altera	FPGA	Military	Ball	672	BGA	Square	Plastic/Epoxy	10570	Yes			CMOS		362		1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm	135 °C (275 °F)		-65 °C (-85 °F)		Bottom	S-PBGA-B672	3			No				362	220 °C (428 °F)
EP1SGX40DF1020I5	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes			CMOS		624		1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		1 mm	135 °C (275 °F)		-65 °C (-85 °F)		Bottom	S-PBGA-B1020	3			No				624	220 °C (428 °F)
EP4SGX180FF35M3N	Altera	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	175750	Yes	.93 V	7030			564	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	125 °C (257 °F)	7030 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.4 mm	35 mm					564		35 mm
EP4SGX530KH40M3N	Altera	FPGA	Military	Ball	1517	BGA	Square	Plastic/Epoxy	531200	Yes	.93 V	21248				0.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	125 °C (257 °F)	21248 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1517		3.5 mm	42.5 mm							42.5 mm
EP4SE820H35M3	Altera	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	813050	Yes	.93 V	32522			744	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	125 °C (257 °F)	32522 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.5 mm	42 mm					744		42 mm
EPF8820GM883B-3	Altera	FPGA	Military	Pin/Peg	192	PGA	Square	Ceramic	672	No			CMOS	38535Q/M;38534H;883B	152		3.3/5,5 V	Grid Array	PGA192,17X17	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)		-55 °C (-67 °F)	Tin Lead	Perpendicular	S-XPGA-P192				No	e0			148	220 °C (428 °F)
EP1SGX25CF1020I6N	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V		CMOS		607	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)		-65 °C (-85 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No	e1		40 s	607	245 °C (473 °F)	33 mm
EP1SGX25DF672I5	Altera	FPGA	Military	Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes			CMOS		455		1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm	135 °C (275 °F)		-65 °C (-85 °F)		Bottom	S-PBGA-B672	3			No				455	220 °C (428 °F)
EPB1400DM	Altera	FPGA	Military	Through-Hole	40	DIP	Rectangular	Ceramic		No			CMOS					In-Line	DIP40,.6	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)		-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T40				No	e0				220 °C (428 °F)
EP4SE230F29M3	Altera	FPGA	Military	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V	9120				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	125 °C (257 °F)	9120 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B780	4	3.5 mm	29 mm			717 MHz				29 mm
EP1SGX25DF1020I5N	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V		CMOS		607	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)		-65 °C (-85 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e1		40 s	607	245 °C (473 °F)	33 mm
EP1SGX25CF1020I5	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes			CMOS		607		1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		1 mm	135 °C (275 °F)		-65 °C (-85 °F)		Bottom	S-PBGA-B1020				No				607
EP1SGX40DF1020I7N	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V		CMOS		624	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)		-65 °C (-85 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e1		40 s	624	245 °C (473 °F)	33 mm
EP4SGX230HF35M3	Altera	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120			564	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	125 °C (257 °F)	9120 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.4 mm	35 mm					564		35 mm
EP4SGX230FF35M3	Altera	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120			564	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	125 °C (257 °F)	9120 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.4 mm	35 mm			637.5 MHz		564		35 mm
EP4SGX180KF40M3N	Altera	FPGA	Military	Ball	1517	BGA	Square	Plastic/Epoxy	175750	Yes	.93 V	7030			744	0.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	125 °C (257 °F)	7030 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm					744		40 mm
EP4SGX530KH40M3	Altera	FPGA	Military	Ball	1517	BGA	Square	Plastic/Epoxy	531200	Yes	.93 V	21248				0.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	125 °C (257 °F)	21248 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1517		3.5 mm	42.5 mm							42.5 mm
EP4SGX110HF35M3	Altera	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	105600	Yes	.93 V	4224			488	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	125 °C (257 °F)	4224 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm					488		35 mm
EP4SGX360NF45M3N	Altera	FPGA	Military	Ball	1932	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144			920	0.9		Grid Array	BGA1932,44X44,40		.87 V	1 mm	125 °C (257 °F)	14144 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm					920		45 mm
EP1SGX10DF672I5	Altera	FPGA	Military	Ball	672	BGA	Square	Plastic/Epoxy	10570	Yes			CMOS		362		1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm	135 °C (275 °F)		-65 °C (-85 °F)		Bottom	S-PBGA-B672	3			No				362	220 °C (428 °F)
EP4SE530H40M3N	Altera	FPGA	Military	Ball	1517	BGA	Square	Plastic/Epoxy	531200	Yes	.93 V	21248	TSMC		976	0.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	125 °C (257 °F)	21248 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1517		3.5 mm	42.5 mm					976		42.5 mm
EP4SGX290NF45M3	Altera	FPGA	Military	Ball	1932	BGA	Square	Plastic/Epoxy	291200	Yes	.93 V	11648			920	0.9		Grid Array	BGA1932,44X44,40		.87 V	1 mm	125 °C (257 °F)	11648 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm					920		45 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.