324 Field Programmable Gate Arrays (FPGA) 652

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10M16DAU324C8	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
10M04DFU324I7	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
5CEBA4U15C6N	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
5CEFA2U15I7	Altera	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm					Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP20K100FI324-2V	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	4160	Yes			CMOS	246		2.5,2.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B324	3			No				246	220 °C (428 °F)
EP4CGX22CF19C8	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	21280	Yes	1.24 V	1330		150	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	1330 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No	e0	472.5 MHz	20 s	150	220 °C (428 °F)	19 mm
5CEBA2U15C7	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
10M02DAU324C8	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
10M02DCU324A7	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324
10M16DCU324I7	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
10M02DAU324A7	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324
5CEFA2U15A7N	Altera	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
5CGXFC3B6U15C6	Altera	FPGA		Ball	324	FBGA	Square	Plastic	31000	Yes			CMOS	112		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B324				No				112
10M16DCU324I6G	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
5CEBA4U15I7	Altera	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm					Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP1C12F324I6ES	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes	1.575 V	12060			1.5		Grid Array			1.425 V	1 mm		12060 CLBS		Tin Lead	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	e0	405 MHz				19 mm
5CEBA2U15I7N	Altera	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm					Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
5CEFA4U15A7	Altera	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
10M02DCU324C7G	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
EP3C25F324I8N	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	24624	Yes	1.25 V		CMOS	215	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B324		1.9 mm	19 mm	No	e1			215		19 mm
10M08DCU324A7	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324
EP4CGX30CF19I7	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		150	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm		1840 CLBS		Tin Lead	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No	e0	472.5 MHz	20 s	150	220 °C (428 °F)	19 mm
5CGXFC3B6U15C6N	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	31000	Yes	1.13 V	1346	CMOS	112	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)	1346 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm	No				112		15 mm
EP4CGX22DF19C6N	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
EP1C12F324C7ES	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes	1.575 V	12060			1.5		Grid Array			1.425 V	1 mm		12060 CLBS		Tin Lead	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	e0	320 MHz				19 mm
10M16DFU324I7	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
EP20K30EFI324-1	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	1200	Yes			CMOS	120		1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B324	3			No				120	220 °C (428 °F)
10M02DAU324C8G	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
10M04DCU324A7	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324
EP20K30EFI324-3	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	1200	Yes			CMOS	120		1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B324	3			No				120	220 °C (428 °F)
10M08DCU324C8	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
EP4CGX22CF19	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.24 V	47			1.2		Grid Array, Low Profile			1.16 V	1 mm		47 CLBS			Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
EP4CGX22DF19I7	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm					Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
10M04DCU324C8	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
EP1C20F324C7ES	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes	1.575 V	20060			1.5		Grid Array			1.425 V	1 mm		20060 CLBS		Tin Lead	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	e0	320 MHz				19 mm
10M02DAU324I7	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
EP4CGX22DF19C7N	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
5CEFA4U15A7N	Altera	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP1C20F324C6	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	20060	Yes	1.575 V	2006		233	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2006 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	e0	405 MHz	20 s	233	220 °C (428 °F)	19 mm
EP4CGX30BF19C7N	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
EP4CGX22CF19C7	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	21280	Yes	1.24 V	1330		150	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	1330 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No	e0	472.5 MHz	20 s	150	220 °C (428 °F)	19 mm
10M02DFU324I7	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
5CEFA2U15C7N	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
10M02DFU324C8	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
10M02DAU324C7	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
10M02DCU324I6G	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
EP4CGX22DF19C7	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
10M02DAU324I7G	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.