324 Field Programmable Gate Arrays (FPGA) 652

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC7A8-2CSG324I

Xilinx

FPGA

Ball

324

FBGA

Square

Plastic

8000

Yes

1.05 V

CMOS

200

1

1 V

Grid Array, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

.95 V

.8 mm

100 °C (212 °F)

1.05 ns

-40 °C (-40 °F)

Bottom

S-PBGA-B324

15 mm

No

1286 MHz

200

15 mm

XC7A30T-3CSG324E

Xilinx

FPGA

Ball

324

FBGA

Square

Plastic

33600

Yes

1.05 V

CMOS

210

1

1 V

Grid Array, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

.95 V

.8 mm

100 °C (212 °F)

0.94 ns

0 °C (32 °F)

Bottom

S-PBGA-B324

15 mm

No

1412 MHz

210

15 mm

XA6SLX25T-2CSG324Q

Xilinx

FPGA

Ball

324

FBGA

Square

Plastic/Epoxy

24051

Yes

AEC-Q100

190

1.2,2.5/3.3 V

Grid Array, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

.8 mm

Tin Silver Copper

Bottom

S-PBGA-B324

3

No

e1

62.5 MHz

30 s

190

260 °C (500 °F)

XC7A25T-3CSG324E

Xilinx

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

23360

Yes

1.05 V

1825

HKMG

150

1

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

.95 V

.8 mm

100 °C (212 °F)

0.94 ns

1825 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.5 mm

15 mm

e1

1412 MHz

30 s

150

260 °C (500 °F)

15 mm

XC5VLX30-3FFG324C

Xilinx

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

30720

Yes

1.05 V

2400

220

1

1,2.5 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

.95 V

1 mm

85 °C (185 °F)

0.67 ns

2400 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

4

2.85 mm

19 mm

No

e1

30 s

220

250 °C (482 °F)

19 mm

XC7A15T-L1CSG324C

Xilinx

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

16640

Yes

.98 V

1300

250

0.95

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

.92 V

.8 mm

85 °C (185 °F)

1.27 ns

1300 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.5 mm

15 mm

e1

1098 MHz

30 s

250

260 °C (500 °F)

15 mm

XC6SLX25-N3CSG324C

Xilinx

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

24051

Yes

1.26 V

1879

CMOS

226

1.2

1.2,1.2/3.3,2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

1.14 V

.8 mm

85 °C (185 °F)

0.26 ns

1879 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.5 mm

15 mm

No

e1

806 MHz

30 s

226

260 °C (500 °F)

15 mm

XC5VLX30-1FFV324C

Xilinx

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

30720

Yes

1.05 V

2400

220

1

Grid Array

BGA324,18X18,40

.95 V

1 mm

85 °C (185 °F)

0.9 ns

2400 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

4

2.85 mm

19 mm

e1

30 s

220

250 °C (482 °F)

19 mm

XC6SLX16-2CS324I4204

Xilinx

FPGA

Ball

324

LFBGA

Square

Plastic/Epoxy

14579

Yes

1.26 V

1139

232

1.2

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

1.14 V

.8 mm

100 °C (212 °F)

0.26 ns

1139 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

667 MHz

232

15 mm

10M04DAU324A7

Altera

FPGA

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

EP3C25F324A7

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

24624

Yes

1.25 V

24624

CMOS

215

1.2

1.2/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.15 V

1 mm

24624 CLBS

Bottom

S-PBGA-B324

1.9 mm

19 mm

No

215

19 mm

5CEFA4U15I7N

Altera

FPGA

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

10M08DAU324I6

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

EP3C40F324I6

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

39600

Yes

1.25 V

CMOS

195

1.2

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B324

1

1.9 mm

19 mm

No

e0

195

19 mm

EP1C12F324I6

Altera

FPGA

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

12060

Yes

1.575 V

1206

249

1.5

1.5,1.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.425 V

1 mm

100 °C (212 °F)

1206 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

e0

405 MHz

249

220 °C (428 °F)

19 mm

10M16DFU324A7G

Altera

FPGA

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

10M08DFU324I6

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

10M04DCU324C7G

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

10M08DFU324I7G

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

8000

Yes

CMOS

246

1.2

1.2 V

Grid Array

BGA324,18X18,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B324

No

246

10M02DFU324A7

Altera

FPGA

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

10M08DAU324I6G

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

5CEFA2U15I7N

Altera

FPGA

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

EP4CGX22BF19C6N

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

5CEBA4U15C7

Altera

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

10M04DCU324I7

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

10M08DCU324C7

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

5CGXFC3B6U15C8N

Altera

FPGA

Ball

324

FBGA

Square

Plastic/Epoxy

31000

Yes

CMOS

112

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B324

No

112

10M08DFU324C7G

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

EP1C4F324C7

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

4000

Yes

1.575 V

400

249

1.5

1.5,1.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

400 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

e0

320 MHz

20 s

249

220 °C (428 °F)

19 mm

10M16DFU324I6

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

5CEFA4U15C8N

Altera

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

EP1C20F324C8

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

20060

Yes

1.575 V

2006

233

1.5

1.5,1.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

2006 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

e0

275 MHz

20 s

233

220 °C (428 °F)

19 mm

10M16DFU324C7

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

EP1C20F324I8

Altera

FPGA

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

20060

Yes

1.575 V

2006

233

1.5

1.5,1.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.425 V

1 mm

100 °C (212 °F)

2006 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

e0

275 MHz

233

220 °C (428 °F)

19 mm

10M16DAU324A7G

Altera

FPGA

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

10M08DCU324C7G

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

5CEBA2U15C6

Altera

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

10M02DCU324I6

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

EP1C20F324I7ES

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

1.575 V

20060

1.5

Grid Array

1.425 V

1 mm

20060 CLBS

Tin Lead

Bottom

S-PBGA-B324

2.2 mm

19 mm

No

e0

320 MHz

19 mm

EP4CGX30DF19I7

Altera

FPGA

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

10M04DAU324C7

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

10M02DCU324I6G

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

EP4CGX22DF19C7

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

10M02DAU324I7G

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

EP1C12F324C6

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

12060

Yes

1.575 V

1206

249

1.5

1.5,1.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

1206 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

e0

405 MHz

20 s

249

220 °C (428 °F)

19 mm

10M04DFU324C8

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

EP4CGX30DF19I7N

Altera

FPGA

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

5CGXBC3B6U15C7

Altera

FPGA

Ball

324

FBGA

Square

Plastic

31500

Yes

CMOS

144

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B324

No

144

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.