324 Field Programmable Gate Arrays (FPGA) 652

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A25T-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		e1	1412 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A25T-L1CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825	HKMG	150	0.95		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XA7A50T-1CSG324I	Xilinx	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG	210	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	1098 MHz	30 s	210	260 °C (500 °F)	15 mm
XC6SLX25-L1CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.05 V	1879	CMOS	226	1	1,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	0.46 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1		30 s	226	260 °C (500 °F)	15 mm
XC6SLX45-1LCSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V				1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	500 MHz				15 mm
XC7A35T-2CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC6SLX16-2CS324I4204	Xilinx	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139		232	1.2		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm			667 MHz		232		15 mm
XC7A35T-3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	85 °C (185 °F)	0.94 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XC5VLX30-3FFG324I	Xilinx	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	2400	Yes			CMOS	400		1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B324	4			No	e1	710 MHz	30 s	400	250 °C (482 °F)
10M04DFU324A7G	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B324
10M16DFU324C8G	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	16000	Yes			CMOS	246	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324				No				246
EP20K100EFI324-1X	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	4160	Yes			CMOS	238		1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B324	3			No				238	220 °C (428 °F)
5CEBA2U15A7N	Altera	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP4CGX30BF19C7	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
EP1C20F324I6ES	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes	1.575 V	20060			1.5		Grid Array			1.425 V	1 mm			20060 CLBS		Tin Lead	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	e0	405 MHz				19 mm
10M08DFU324C7	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324
EP1C4F324I7	Altera	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400		249	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	e0	320 MHz	20 s	249	220 °C (428 °F)	19 mm
10M16DCU324C8	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324
10M08DAU324I7	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array										Bottom	S-PBGA-B324
EP1C4F324C8ES	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes	1.575 V	4000			1.5		Grid Array			1.425 V	1 mm			4000 CLBS		Tin Lead	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	e0	275 MHz				19 mm
5CEBA4U15C6	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP20K30EFI324-1X	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	1200	Yes			CMOS	120		1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B324	3			No				120	220 °C (428 °F)
EP20K100FI324-3V	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	4160	Yes			CMOS	246		2.5,2.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B324	3			No				246	220 °C (428 °F)
5CEFA2U15C7	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP3C40F324I6N	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V		CMOS	195	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B324		1.9 mm	19 mm	No	e1			195		19 mm
EP1C20F324C7	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	20060	Yes	1.575 V	2006		233	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2006 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	e0	320 MHz	20 s	233	220 °C (428 °F)	19 mm
10M04DAU324I7G	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes			CMOS	246	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm						Bottom	S-PBGA-B324				No				246
10M08DFU324I7	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array										Bottom	S-PBGA-B324
EP4CGX30CF19	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.24 V	47			1.2		Grid Array, Low Profile			1.16 V	1 mm			47 CLBS			Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
5CEBA2U15C8	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
10M16DFU324I6G	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array										Bottom	S-PBGA-B324
EP1C4F324C8	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400		249	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		400 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	e0	275 MHz	20 s	249	220 °C (428 °F)	19 mm
10M08DFU324A7G	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B324
EP4CGX30CF19C6	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		150	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1840 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No	e0	472.5 MHz	20 s	150	220 °C (428 °F)	19 mm
EP20K100FI324-1V	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	4160	Yes			CMOS	246		2.5,2.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B324	3			No				246	220 °C (428 °F)
EP4CGX30BF19C6N	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
10M04DFU324C7	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324
EP4CGX30BF19C6	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
EP1C4F324I6	Altera	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400		249	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	e0	405 MHz		249	220 °C (428 °F)	19 mm
EP1C20F324C6ES	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes	1.575 V	20060			1.5		Grid Array			1.425 V	1 mm			20060 CLBS		Tin Lead	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	e0	405 MHz				19 mm
EP4CGX30BF19C8	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
EP20K100FI324-2X	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	4160	Yes			CMOS	246		2.5,2.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B324	3			No				246	220 °C (428 °F)
EP4CGX30BF19C8N	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
EP4CGX22DF19C6	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
EP4CGX22CF19C7N	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	21280	Yes	1.24 V	1330		150	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1330 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No	e1	472.5 MHz	30 s	150	260 °C (500 °F)	19 mm
10M02DCU324C7	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324
EP20K30EFI324-2X	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	1200	Yes			CMOS	120		1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B324	3			No				120	220 °C (428 °F)
EP4CGX22DF19I7N	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm						Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.