324 Field Programmable Gate Arrays (FPGA) 652

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP4CGX30DF19C8	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
10M08DAU324C7G	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
EP4CGX30DF19C6	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
EP4CGX30CF19C8	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		150	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	1840 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No	e0	472.5 MHz	20 s	150	220 °C (428 °F)	19 mm
10M04DAU324C7	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
EP4CGX22BF19C7	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
5CEFA4U15C7	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP1C20F324C7N	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	20060	Yes	1.575 V	2006		233	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2006 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	e1	320 MHz	30 s	233	260 °C (500 °F)	19 mm
EP4CGX30BF19I7	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm					Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
10M16DCU324C7G	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
EP3C40F324I8	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V		CMOS	195	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Lead	Bottom	S-PBGA-B324	1	1.9 mm	19 mm	No	e0			195		19 mm
10M16DAU324I7	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
EP20K60EFI324-1X	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	2560	Yes			CMOS	188		1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B324	3			No				188	220 °C (428 °F)
10M04DAU324I7	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
EP3C40F324I8N	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V		CMOS	195	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B324		1.9 mm	19 mm	No	e1			195		19 mm
EP4CE40F19A7N	Altera	FPGA	Automotive	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
5CEBA4U15C8	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP20K60EFI324-1	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	2560	Yes			CMOS	188		1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B324	3			No				188	220 °C (428 °F)
10M08DCU324I7	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
EP4CGX22BF19I7N	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm					Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
5CEFA4U15C8	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
5CEFA4U15C7N	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
10M02DCU324I7	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
10M02DFU324I7G	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
EP4CGX22BF19C7N	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
10M04DCU324I6G	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
EP1C20F324I7	Altera	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	20060	Yes	1.575 V	2006		233	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	2006 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	e0	320 MHz	20 s	233	220 °C (428 °F)	19 mm
10M02DAU324C7G	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.