324 Field Programmable Gate Arrays (FPGA) 652

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

10M08DAU324C7G

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

EP4CGX30DF19C6

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP4CGX30CF19C8

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

29440

Yes

1.24 V

1840

150

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA324,18X18,40

Field Programmable Gate Arrays

1.16 V

1 mm

85 °C (185 °F)

1840 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

1.55 mm

19 mm

No

e0

472.5 MHz

20 s

150

220 °C (428 °F)

19 mm

EP4CGX22DF19I7

Altera

FPGA

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

10M04DCU324C8

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

EP1C20F324C7ES

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

1.575 V

20060

1.5

Grid Array

1.425 V

1 mm

20060 CLBS

Tin Lead

Bottom

S-PBGA-B324

2.2 mm

19 mm

No

e0

320 MHz

19 mm

10M02DAU324I7

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

EP4CGX22DF19C7N

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

10M02DAU324C8G

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

10M04DCU324A7

Altera

FPGA

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

EP20K30EFI324-3

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

1200

Yes

CMOS

120

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B324

3

No

120

220 °C (428 °F)

10M08DCU324C8

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

EP4CGX22CF19

Altera

FPGA

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.24 V

47

1.2

Grid Array, Low Profile

1.16 V

1 mm

47 CLBS

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

10M04DFU324A7G

Altera

FPGA

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

10M16DFU324C8G

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

16000

Yes

CMOS

246

1.2

1.2 V

Grid Array

BGA324,18X18,32

Field Programmable Gate Arrays

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

No

246

EP20K100EFI324-1X

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

4160

Yes

CMOS

238

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B324

3

No

238

220 °C (428 °F)

5CEBA2U15A7N

Altera

FPGA

Automotive

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

EP4CGX30BF19C7

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP1C20F324I6ES

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

1.575 V

20060

1.5

Grid Array

1.425 V

1 mm

20060 CLBS

Tin Lead

Bottom

S-PBGA-B324

2.2 mm

19 mm

No

e0

405 MHz

19 mm

10M08DFU324C7

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

EP1C4F324I7

Altera

FPGA

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

4000

Yes

1.575 V

400

249

1.5

1.5,1.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.425 V

1 mm

100 °C (212 °F)

400 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

e0

320 MHz

20 s

249

220 °C (428 °F)

19 mm

10M16DCU324C8

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

10M08DAU324I7

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

10M04DFU324C7G

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

10M04DFU324C8G

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

4000

Yes

CMOS

246

1.2

1.2 V

Grid Array

BGA324,18X18,32

Field Programmable Gate Arrays

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

No

246

EP4CGX30DF19C8N

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

5CEFA2U15C6N

Altera

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

EP4CGX22BF19C7

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

5CEFA4U15C7

Altera

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

EP1C20F324C7N

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

20060

Yes

1.575 V

2006

233

1.5

1.5,1.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

2006 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

e1

320 MHz

30 s

233

260 °C (500 °F)

19 mm

EP4CGX30BF19I7

Altera

FPGA

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

10M16DCU324C7G

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

EP3C40F324I8

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

39600

Yes

1.25 V

CMOS

195

1.2

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B324

1

1.9 mm

19 mm

No

e0

195

19 mm

10M16DAU324I7

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

EP3C40F324C6

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

39600

Yes

1.25 V

39600

CMOS

195

1.2

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

39600 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

1.9 mm

19 mm

No

e0

472.5 MHz

20 s

195

220 °C (428 °F)

19 mm

10M04DCU324C7

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

10M04DAU324I6G

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

EP1C4F324I8

Altera

FPGA

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

4000

Yes

1.575 V

400

249

1.5

1.5,1.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.425 V

1 mm

100 °C (212 °F)

400 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

e0

275 MHz

249

220 °C (428 °F)

19 mm

EP4CGX30BF19I7N

Altera

FPGA

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP1C12F324I8ES

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

1.575 V

12060

1.5

Grid Array

1.425 V

1 mm

12060 CLBS

Tin Lead

Bottom

S-PBGA-B324

2.2 mm

19 mm

No

e0

275 MHz

19 mm

5CEFA2U15C6

Altera

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

5CEFA2U15A7

Altera

FPGA

Automotive

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

5CEBA4U15A7N

Altera

FPGA

Automotive

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

EP1C12F324C6N

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

12060

Yes

1.575 V

1206

249

1.5

1.5,1.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

1206 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

e1

405 MHz

30 s

249

260 °C (500 °F)

19 mm

5CGXFC3B7U15C8

Altera

FPGA

Ball

324

FBGA

Square

Plastic

31500

Yes

CMOS

144

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B324

No

144

EP1C12F324I8

Altera

FPGA

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

12060

Yes

1.575 V

1206

249

1.5

1.5,1.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.425 V

1 mm

100 °C (212 °F)

1206 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

e0

275 MHz

249

220 °C (428 °F)

19 mm

EP1C4F324I7N

Altera

FPGA

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

4000

Yes

1.575 V

400

249

1.5

1.5,1.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.425 V

1 mm

100 °C (212 °F)

400 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e1

320 MHz

30 s

249

260 °C (500 °F)

19 mm

EP1C4F324C7ES

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

1.575 V

4000

1.5

Grid Array

1.425 V

1 mm

4000 CLBS

Tin Lead

Bottom

S-PBGA-B324

2.2 mm

19 mm

No

e0

320 MHz

19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.