324 Field Programmable Gate Arrays (FPGA) 652

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10M04DAU324C8	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
5CEFA4U15I7	Altera	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm					Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
10M04DFU324I7G	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes			CMOS	246	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B324				No				246
EP3C40F324C6	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	195	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	39600 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.9 mm	19 mm	No	e0	472.5 MHz	20 s	195	220 °C (428 °F)	19 mm
10M04DCU324C7	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
10M04DAU324I6G	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
EP1C4F324I8	Altera	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400		249	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	e0	275 MHz		249	220 °C (428 °F)	19 mm
EP4CGX30BF19I7N	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm					Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
EP1C12F324I8ES	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes	1.575 V	12060			1.5		Grid Array			1.425 V	1 mm		12060 CLBS		Tin Lead	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	e0	275 MHz				19 mm
5CEFA2U15C6	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
5CEFA2U15A7	Altera	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
5CEBA4U15A7N	Altera	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP1C12F324C6N	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		249	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	1206 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	e1	405 MHz	30 s	249	260 °C (500 °F)	19 mm
5CGXFC3B7U15C8	Altera	FPGA		Ball	324	FBGA	Square	Plastic	31500	Yes			CMOS	144		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B324				No				144
EP1C12F324I8	Altera	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		249	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	1206 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	e0	275 MHz		249	220 °C (428 °F)	19 mm
EP1C4F324I7N	Altera	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400		249	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	400 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No	e1	320 MHz	30 s	249	260 °C (500 °F)	19 mm
EP1C4F324C7ES	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes	1.575 V	4000			1.5		Grid Array			1.425 V	1 mm		4000 CLBS		Tin Lead	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	e0	320 MHz				19 mm
EP3C25F324I6	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	24624	Yes	1.25 V		CMOS	215	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Lead	Bottom	S-PBGA-B324	1	1.9 mm	19 mm	No	e0			215		19 mm
10M16DAU324I6	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
5CEFA4U15C6	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP1C12F324I7ES	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes	1.575 V	12060			1.5		Grid Array			1.425 V	1 mm		12060 CLBS		Tin Lead	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	e0	320 MHz				19 mm
10M04DAU324A7G	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324
10M16DCU324A7	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324
EP4CGX22BF19C8N	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
5CGXFC3B6U15I7	Altera	FPGA		Ball	324	FBGA	Square	Plastic	31000	Yes			CMOS	112		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B324				No				112
10M16DAU324C7	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
10M16DFU324A7	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324
EP1C4F324I7ES	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes	1.575 V	4000			1.5		Grid Array			1.425 V	1 mm		4000 CLBS		Tin Lead	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	e0	320 MHz				19 mm
10M16DFU324C8	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
10M04DCU324I6	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
10M02DFU324A7G	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324
EP4CGX22BF19C8	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm
10M02DAU324I6	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
10M04DAU324A7	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324
EP3C25F324A7	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215	1.2	1.2/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm		24624 CLBS			Bottom	S-PBGA-B324		1.9 mm	19 mm	No				215		19 mm
5CEFA4U15I7N	Altera	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm					Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
10M08DAU324I6	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
EP3C40F324I6	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V		CMOS	195	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Lead	Bottom	S-PBGA-B324	1	1.9 mm	19 mm	No	e0			195		19 mm
EP1C12F324I6	Altera	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		249	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	1206 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	e0	405 MHz		249	220 °C (428 °F)	19 mm
5CEBA4U15A7	Altera	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
10M08DFU324C8	Altera	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324
10M08DAU324A7G	Altera	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324
EP1C4F324I6ES	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes	1.575 V	4000			1.5		Grid Array			1.425 V	1 mm		4000 CLBS		Tin Lead	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	e0	405 MHz				19 mm
EP4CGX22CF19I7	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy	21280	Yes	1.24 V	1330		150	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm		1330 CLBS		Tin Lead	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No	e0	472.5 MHz	20 s	150	220 °C (428 °F)	19 mm
5CGXFC3B6U15C7	Altera	FPGA		Ball	324	FBGA	Square	Plastic	31000	Yes			CMOS	112		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B324				No				112
EP20K100FI324-1X	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	4160	Yes			CMOS	246		2.5,2.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B324	3			No				246	220 °C (428 °F)
10M04DAU324I6	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
EP4CGX22BF19C6	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm							19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.