324 Field Programmable Gate Arrays (FPGA) 652

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A12T-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	15 mm
XQ7A50T-1CS325I	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic	52160	Yes	1.05 V	4075	HKMG		150	1	1 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns		-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B324	3		15 mm	No		e0	1098 MHz		150		15 mm
XC7A25T-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XC6SLX25T-3NCSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s		260 °C (500 °F)	15 mm
XC7A12T-L2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	12800	Yes	.93 V	1000	HKMG		150	0.9		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.87 V	.8 mm	100 °C (212 °F)	1.51 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XA7S25-1CSGA324Q4875	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		AEC-Q100; TS 16949	150	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.5 mm	15 mm					10 s	150	260 °C (500 °F)	15 mm
XC7A50T-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A200T-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825			500	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1286 MHz	30 s	500	260 °C (500 °F)	15 mm
XC7A75T-L1CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	.98 V	5900			300	0.95		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	85 °C (185 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7A25T-1CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A15T-L2CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	.93 V	1300			250	0.9		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.87 V	.8 mm	100 °C (212 °F)	1.51 ns	1300 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XA6SLX45-2CSG324Q	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic/Epoxy	43661	Yes				AEC-Q100	218		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B324	3			No		e1	62.5 MHz	30 s	218	260 °C (500 °F)
XC7A200T-L2CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	215360	Yes	.93 V	16825			500	0.9		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.87 V	.8 mm	100 °C (212 °F)	1.51 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	500	260 °C (500 °F)	15 mm
XC7A15-3CSG324E	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic	15360	Yes	1.05 V		CMOS		200	1	1 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.94 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3		15 mm	No		e1	1412 MHz	30 s	200	260 °C (500 °F)	15 mm
XC6SLX25-1LCSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	500 MHz				15 mm
XC7A25T-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.05 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XC6SLX45T-3NCSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz				15 mm
XC6SLX9-3NCSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz				15 mm
XC5VLX30-3FF324I	Xilinx	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	2400	Yes			CMOS		400		1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B324	4			No		e0	710 MHz	30 s	400	225 °C (437 °F)
XC5VLX30-1FF324I	Xilinx	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			220	1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	2400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No		e0		30 s	220	225 °C (437 °F)	19 mm
XQ7A100T-1CS324I	Xilinx	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS		210	1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm		1.27 ns	7925 CLBS			Bottom	S-PBGA-B324		1.5 mm	15 mm	No			1098 MHz		210		15 mm
XC6SLX25-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		226	1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	226	260 °C (500 °F)	15 mm
XC5VLX50-2FFV324C	Xilinx	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			220	1		Grid Array	BGA324,18X18,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	3600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	4	2.85 mm	19 mm			e1		30 s	220	250 °C (482 °F)	19 mm
XC7A12T-1CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A12T-3CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A75T-1CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XA6SLX25T-3CSG324I	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic/Epoxy	24051	Yes				AEC-Q100	190		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B324	3			No		e1	62.5 MHz	30 s	190	260 °C (500 °F)
XA6SLX16-2CSG324I	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic/Epoxy	14579	Yes				AEC-Q100	232		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B324	3			No		e1	62.5 MHz	30 s	232	260 °C (500 °F)
XC5VLX50-1FF324I	Xilinx	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			220	1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	3600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No		e0		30 s	220	225 °C (437 °F)	19 mm
XC5VLX50-1FF324C	Xilinx	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			220	1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	3600 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No		e0		30 s	220	225 °C (437 °F)	19 mm
XC7A15T-L2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	.93 V	1300			250	0.9		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.87 V	.8 mm	85 °C (185 °F)	1.51 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A12T-L1CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG		150	0.95		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC6SLX25-3NCSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz				15 mm
XC7A8-3CSG324E	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic	8000	Yes	1.05 V		CMOS		200	1	1 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.94 ns		0 °C (32 °F)		Bottom	S-PBGA-B324			15 mm	No			1412 MHz		200		15 mm
XC7A100T-L1CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	.98 V	7925			300	0.95		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XA6SLX45-3CSG324I	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic/Epoxy	43661	Yes				AEC-Q100	218		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B324	3			No		e1	62.5 MHz	30 s	218	260 °C (500 °F)
XC7A35T-L1CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600			250	0.95		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	85 °C (185 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A12T-L2CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	12800	Yes	.93 V	1000	HKMG		150	0.9		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.87 V	.8 mm	100 °C (212 °F)	1.51 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A8-L2CSG324E	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic	8000	Yes	1.05 V		CMOS		200	1	1 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns		0 °C (32 °F)		Bottom	S-PBGA-B324			15 mm	No			1286 MHz		200		15 mm
XA6SLX45T-2CSG324I	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic/Epoxy	43661	Yes				AEC-Q100	190		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B324	3			No		e1	62.5 MHz	30 s	190	260 °C (500 °F)
XC5VLX30-1FF324C	Xilinx	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			220	1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	2400 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No		e0		30 s	220	225 °C (437 °F)	19 mm
XC7A15-2CSG324C	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic	15360	Yes	1.05 V		CMOS		200	1	1 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3		15 mm	No		e1	1286 MHz	30 s	200	260 °C (500 °F)	15 mm
XC5VLX50-3FFG324I	Xilinx	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	3600	Yes			CMOS		560		1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B324	4			No		e1	710 MHz	30 s	560	250 °C (482 °F)
XC6SLX45-N3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		218	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s	218	260 °C (500 °F)	15 mm
XC7A75T-L2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	.93 V	5900			300	0.9		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.87 V	.8 mm	85 °C (185 °F)	1.51 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7A35T-L2CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	.93 V	2600			250	0.9	0.9 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)	1.51 ns	2600 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC6SLX16-N3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		232	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s	232	260 °C (500 °F)	15 mm
XC7A50T-3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	85 °C (185 °F)	0.94 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.