324 Field Programmable Gate Arrays (FPGA) 652

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP4CGX30DF19C6N

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

10M08DAU324A7

Altera

FPGA

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

EP1C20F324C8ES

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

1.575 V

20060

1.5

Grid Array

1.425 V

1 mm

20060 CLBS

Tin Lead

Bottom

S-PBGA-B324

2.2 mm

19 mm

No

e0

275 MHz

19 mm

10M04DFU324I6G

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

EP1C4F324C6ES

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

1.575 V

4000

1.5

Grid Array

1.425 V

1 mm

4000 CLBS

Tin Lead

Bottom

S-PBGA-B324

2.2 mm

19 mm

No

e0

405 MHz

19 mm

5CEBA4U15A7

Altera

FPGA

Automotive

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

10M08DFU324C8

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

10M08DAU324A7G

Altera

FPGA

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

EP1C4F324I6ES

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

1.575 V

4000

1.5

Grid Array

1.425 V

1 mm

4000 CLBS

Tin Lead

Bottom

S-PBGA-B324

2.2 mm

19 mm

No

e0

405 MHz

19 mm

EP4CGX22CF19I7

Altera

FPGA

Ball

324

LBGA

Square

Plastic/Epoxy

21280

Yes

1.24 V

1330

150

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA324,18X18,40

Field Programmable Gate Arrays

1.16 V

1 mm

1330 CLBS

Tin Lead

Bottom

S-PBGA-B324

3

1.55 mm

19 mm

No

e0

472.5 MHz

20 s

150

220 °C (428 °F)

19 mm

5CGXFC3B6U15C7

Altera

FPGA

Ball

324

FBGA

Square

Plastic

31000

Yes

CMOS

112

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B324

No

112

EP20K100FI324-1X

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

4160

Yes

CMOS

246

2.5,2.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B324

3

No

246

220 °C (428 °F)

10M04DAU324I6

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

EP4CGX22BF19C6

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

10M16DAU324C8

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

10M04DFU324I7

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

5CEBA4U15C6N

Altera

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

5CEFA2U15I7

Altera

FPGA

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

EP20K100FI324-2V

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

4160

Yes

CMOS

246

2.5,2.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B324

3

No

246

220 °C (428 °F)

EP4CGX22CF19C8

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

21280

Yes

1.24 V

1330

150

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA324,18X18,40

Field Programmable Gate Arrays

1.16 V

1 mm

85 °C (185 °F)

1330 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

1.55 mm

19 mm

No

e0

472.5 MHz

20 s

150

220 °C (428 °F)

19 mm

5CEBA2U15C7

Altera

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

10M02DAU324C8

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

10M02DCU324A7

Altera

FPGA

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

10M16DCU324I7

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

10M02DAU324A7

Altera

FPGA

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

5CEFA2U15A7N

Altera

FPGA

Automotive

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

5CGXFC3B6U15C6

Altera

FPGA

Ball

324

FBGA

Square

Plastic

31000

Yes

CMOS

112

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B324

No

112

EP4CGX30CF19I7

Altera

FPGA

Ball

324

LBGA

Square

Plastic/Epoxy

29440

Yes

1.24 V

1840

150

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA324,18X18,40

Field Programmable Gate Arrays

1.16 V

1 mm

1840 CLBS

Tin Lead

Bottom

S-PBGA-B324

3

1.55 mm

19 mm

No

e0

472.5 MHz

20 s

150

220 °C (428 °F)

19 mm

5CGXFC3B6U15C6N

Altera

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

31000

Yes

1.13 V

1346

CMOS

112

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

1.07 V

.8 mm

85 °C (185 °F)

1346 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

No

112

15 mm

EP4CGX22DF19C6N

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP1C12F324C7ES

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

1.575 V

12060

1.5

Grid Array

1.425 V

1 mm

12060 CLBS

Tin Lead

Bottom

S-PBGA-B324

2.2 mm

19 mm

No

e0

320 MHz

19 mm

10M16DFU324I7

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

EP20K30EFI324-1

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

1200

Yes

CMOS

120

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B324

3

No

120

220 °C (428 °F)

10M08DCU324I6G

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

EP3C40F324A7N

Altera

FPGA

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

39600

Yes

2.625 V

39600

CMOS

195

2.5

1.2/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

2.375 V

1 mm

125 °C (257 °F)

39600 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e1

30 s

195

260 °C (500 °F)

19 mm

10M08DFU324C8G

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

8000

Yes

CMOS

246

1.2

1.2 V

Grid Array

BGA324,18X18,32

Field Programmable Gate Arrays

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

No

246

10M16DCU324I6

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

10M02DFU324C7

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

10M08DAU324C7

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

EP1C20F324C6N

Altera

FPGA

Other

Ball

324

BGA

Square

Plastic/Epoxy

20060

Yes

1.575 V

2006

233

1.5

1.5,1.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

2006 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

e1

405 MHz

30 s

233

260 °C (500 °F)

19 mm

5CGXBC3B7U15C8N

Altera

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

31500

Yes

1.13 V

1346

CMOS

144

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

Field Programmable Gate Arrays

1.07 V

.8 mm

85 °C (185 °F)

1346 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

No

144

15 mm

10M04DFU324I6

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

EP4CGX30CF19C7N

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

29440

Yes

1.24 V

1840

150

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA324,18X18,40

Field Programmable Gate Arrays

1.16 V

1 mm

85 °C (185 °F)

1840 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.55 mm

19 mm

No

e1

472.5 MHz

30 s

150

260 °C (500 °F)

19 mm

EP3C25F324I6N

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

24624

Yes

1.25 V

CMOS

215

1.2

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B324

1.9 mm

19 mm

No

e1

215

19 mm

EP4CGX22BF19I7

Altera

FPGA

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP1C20F324I6

Altera

FPGA

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

20060

Yes

1.575 V

2006

233

1.5

1.5,1.5/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

1.425 V

1 mm

100 °C (212 °F)

2006 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

e0

405 MHz

233

220 °C (428 °F)

19 mm

5CEBA2U15A7

Altera

FPGA

Automotive

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

EP4CGX30DF19C8

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.