672 Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5AGXBA5K6F27C6

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

500 MHz

27 mm

5AGXMA3G4F27I5N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

EP1S80B672I7ES

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B672

No

e0

10AX016E4F27I3SP

Altera

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

27 mm

5CGXFC9B6F27C7

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXBC7F6F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CSEMA6U23C8SN

Altera

FPGA

Other

Ball

672

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

23 mm

5AGXBA5D4F27C6

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

500 MHz

27 mm

5CGXBC5C7F27C6

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXBA7H6F27C4

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

10AX027E1F27I1LP

Altera

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

27 mm

EP1SGX40FF672I6ES

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

3.5 mm

27 mm

No

e0

27 mm

5CGTFD5B5F27I7

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXFA3G6F27I3

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

EP1SGX40FF672I7N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

3.5 mm

27 mm

No

e1

27 mm

5CGXFC7B7F27C7N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

EP1S20B672C6ES

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

No

e0

5AGXBA7K6F27C4N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

670 MHz

27 mm

5CGXBC4A7F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

EP4CGX75CF27C8

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2.4 mm

27 mm

27 mm

5CGXFC9C7F27I7

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CSEBA6U23C7N

Altera

FPGA

Other

Ball

672

FBGA

Square

Plastic/Epoxy

110000

Yes

1.13 V

CMOS

145

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA672,28X28,32

Field Programmable Gate Arrays

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

No

145

23 mm

5AGXMA5H4F27C5

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

622 MHz

27 mm

EP20K400EFI672-1X

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

16640

Yes

CMOS

480

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B672

3

No

480

220 °C (428 °F)

5AGXBA3K4F27I3

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

5CGXFC5B7F27I7

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXBA7H4F27C4N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

670 MHz

27 mm

5CGXBC9B7F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXBC5B6F27A7N

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXMA1H6F27C5

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

622 MHz

27 mm

5AGXFA7D6F27C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

5CGXFC5C6F27C8

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

EP4CGX75BF27C7

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2.4 mm

27 mm

27 mm

5CGXFC9A7F27I7N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

EP1SGX25CF672C5

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

25660

Yes

1.575 V

2852

CMOS

462

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

2852 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

20 s

462

220 °C (428 °F)

27 mm

5CGTFD5B5F27C8

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

EP1SGX10DF672I6N

Altera

FPGA

Military

Ball

672

BGA

Square

Plastic/Epoxy

10570

Yes

1.575 V

1200

CMOS

362

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

135 °C (275 °F)

1200 CLBS

-65 °C (-85 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

30 s

362

245 °C (473 °F)

27 mm

EP1SGX25CF672C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

25660

Yes

1.575 V

2852

CMOS

455

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

2852 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

30 s

455

245 °C (473 °F)

27 mm

EP1SGX25DF672C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

25660

Yes

1.575 V

2852

CMOS

455

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

2852 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

30 s

455

245 °C (473 °F)

27 mm

10M50DFF672I7

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B672

5AGXFA1H6F27C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

5AGXMA1H6F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

500 MHz

27 mm

5CGXBC5A6F27I7

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CSEMA6U23A7

Altera

FPGA

Automotive

Ball

672

FBGA

Square

Plastic/Epoxy

110000

Yes

1.13 V

CMOS

145

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA672,28X28,32

Field Programmable Gate Arrays

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

No

145

23 mm

5CGXBC5C7F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

10AX022E3F27I1LP

Altera

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

27 mm

10AX032E2F27I1LP

Altera

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

27 mm

10M25DAF672I7G

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

25000

Yes

CMOS

380

1.2

1.2 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

380

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.