672 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Peak Reflow Temperature (C)	Length
5AGXFA7K6F27I3	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V			1.15		Grid Array			1.12 V	1 mm			Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz			27 mm
5CGTFD9C5F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
HC20K1000FC672N	Altera	FPGA		Ball	672	BGA	Square	Plastic	38400	Yes		CMOS	508		1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm				Bottom	S-PBGA-B672				No			508
5CGTFD9C5F27C8N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXBA7H4F27I3	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V			1.15		Grid Array			1.12 V	1 mm			Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz			27 mm
5CGXFC9C6F27C8N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXFA1G6F27I5N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm			Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz			27 mm
5CGXFC5E6F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXMA5G4F27C4N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	670 MHz			27 mm
5CGXFC5E7F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXFA5D6F27C5N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz			27 mm
5AGXBA3G4F27C4N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	670 MHz			27 mm
5AGXMA1H6F27C5N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz			27 mm
5CGXBC9D7F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGTFD9C5F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXBC5B6F27I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm				Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXBC7C7F27C7N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXMA1H6F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	500 MHz			27 mm
5AGXMA3H4F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	500 MHz			27 mm
EP1SGX10FF672C7N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V	CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		3.5 mm	27 mm	No	e1				27 mm
5CGXFC4D6F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXBC7A7F27C8N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXMA5K4F27C5	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz			27 mm
5AGXBA3D4F27C5	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz			27 mm
5AGXBA7K4F27I3	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V			1.15		Grid Array			1.12 V	1 mm			Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz			27 mm
5AGXMA7G6F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	500 MHz			27 mm
5CGTFD5A5F27I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm				Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXFC4A6F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXFA7K4F27C5	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz			27 mm
5AGXBA3H6F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz			27 mm
5CGXFC9C6F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXFC7E7F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXBC7E7F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXFC7E6F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXMA3D6F27I3N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V			1.15		Grid Array			1.12 V	1 mm			Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	670 MHz			27 mm
5CSEMA4U23C72	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	40000	Yes		CMOS	124		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,26X26,32	Field Programmable Gate Arrays		.8 mm				Bottom	S-PBGA-B672				No			124
5CGXBC5E7F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CSXFC4C6U23A7N	Altera	FPGA	Automotive	Ball	672	FBGA	Square	Plastic/Epoxy	40000	Yes	1.13 V	CMOS	145	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,28X28,32	Field Programmable Gate Arrays	1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm	No			145		23 mm
5AGXFA3D6F27I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm			Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz			27 mm
5AGXFA7K4F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	500 MHz			27 mm
5CEFA5F27I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	76500	Yes		CMOS	360		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm				Bottom	S-PBGA-B672				No			360
10AS022E3F27I2LG	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm	No			240		27 mm
EP1SGX10CF672I6	Altera	FPGA	Military	Ball	672	BGA	Square	Plastic/Epoxy	10570	Yes		CMOS	362		1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm	135 °C (275 °F)	-65 °C (-85 °F)		Bottom	S-PBGA-B672	3			No			362	220 °C (428 °F)
5CGXFC7B6F27C8N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXFA5D6F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	500 MHz			27 mm
5CGXBC4C6F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXFA5D6F27I5N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm			Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz			27 mm
10AS032E1F27E1SG	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	.93 V			.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm						27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.