672 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Peak Reflow Temperature (C)	Length
5CGTFD5A5F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
EP1S40B672C5	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V	CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672				No	e0
5AGXMA3H4F27I5N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm			Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz			27 mm
5CGXFC5A7F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
10AS027E2F27I1LG	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy		Yes	.93 V			.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm						27 mm
5CGXFC9F7F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
EP1SGX10GF672C7N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V	CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		3.5 mm	27 mm	No	e1				27 mm
5CGTFD7C5F27I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm				Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGTFD9D5F27I7N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V	CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm			Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No	e1		336		27 mm
5CGXBC9E7F27I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm				Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXFC9D7F27C7N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
10AX022E4F27I3SG	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm	No			240		27 mm
5CGTFD7B5F27I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm				Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXBC5A7F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGTFD5E5F27C8N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXFA5H6F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz			27 mm
5CSXFC6C6U23C62N	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	110000	Yes		CMOS	124		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,26X26,32	Field Programmable Gate Arrays		.8 mm				Bottom	S-PBGA-B672				No			124
5AGXFA1G6F27C5N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz			27 mm
5CSXFC4D6U23A7N	Altera	FPGA	Automotive	Ball	672	FBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm						23 mm
5AGXBA5H4F27I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm			Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz			27 mm
5AGXBA3G4F27C5	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz			27 mm
EP20K600EFI672-3	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	24320	Yes		CMOS	500		1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm				Bottom	S-PBGA-B672	3			No			500	220 °C (428 °F)
5CGXBC5C7F27I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm				Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXBA1H4F27I3	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V			1.15		Grid Array			1.12 V	1 mm			Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz			27 mm
5AGXBA1G6F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	500 MHz			27 mm
5CGXFC5A6F27C7N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CSEBA6U23C6SN	Altera	FPGA	Other	Ball	672	FBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm						23 mm
10AS032E1F27I1SG	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy		Yes	.93 V			.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm						27 mm
5AGXBA5K4F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	500 MHz			27 mm
5AGXMA7H6F27I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm			Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz			27 mm
5AGXMA7D6F27C5	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz			27 mm
5AGXBA5D4F27C4N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.7 mm	27 mm	No	e1	670 MHz	336		27 mm
5AGXBA1K4F27I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm			Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz			27 mm
EP2S60F672I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	60440	Yes		CMOS	492		1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm			Tin Lead	Bottom	S-PBGA-B672	3			No	e0		484	220 °C (428 °F)
5AGXFA3D6F27C5N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz			27 mm
EP4CGX75BF27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.25 V			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2.4 mm	27 mm						27 mm
10AX027E4F27I3SG	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm	No			240		27 mm
10M50DCF672C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes						Grid Array					85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672
EP4CGX50CF27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.25 V			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2.4 mm	27 mm						27 mm
5AGXBA1D6F27C5	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz			27 mm
5CSEBA2U23I7SN	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V	CMOS	145	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,28X28,32	Field Programmable Gate Arrays	1.07 V	.8 mm				Bottom	S-PBGA-B672		1.85 mm	23 mm	No			145		23 mm
5CGXFC7A6F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXBA1G4F27C5	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz			27 mm
EP1S60B672I6ES	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V	CMOS		1.5		Grid Array			1.425 V				Tin Lead	Bottom	S-PBGA-B672				No	e0
5AGXFA7K6F27C5N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz			27 mm
5AGXFA7D4F27I5N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	242950	Yes	1.13 V	CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm			Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm	No	e1	622 MHz	336		27 mm
5CGXFC9F7F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXBC7D6F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.