672 Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5CGXFC9A6F27C7N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXBC9E7F27I7N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXMA3G4F27C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

5AGXBA1G6F27I5N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

5CGXBC4B6F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXFA1K6F27C6

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

500 MHz

27 mm

5CGXBC5D6F27C7

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CSEMA6U23C82

Altera

FPGA

Ball

672

FBGA

Square

Plastic/Epoxy

110000

Yes

CMOS

124

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA672,26X26,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B672

No

124

5AGXMA7D4F27I5

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

622 MHz

27 mm

5CGTFD5C5F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXBA7K6F27I5

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

622 MHz

27 mm

10M40DFF672I7G

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

40000

Yes

CMOS

500

1.2

1.2 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

500

EP1SGX40CF672C5ES

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3.5 mm

27 mm

No

e0

27 mm

5AGXFA1H4F27I3N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

670 MHz

27 mm

5CGXBC7F7F27I7

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXBA3K4F27C4

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

EP1S40F672C6

Altera

FPGA

Commercial Extended

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

No

e0

5AGXFA7D6F27I3N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

670 MHz

27 mm

EP1S80B672C5ES

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

No

e0

10AS032E4F27I3SP

Altera

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

11990

CMOS

240

.9

0.9 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

11990 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B672

No

240

EP4CGX110DF27C8

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

109424

Yes

1.24 V

6839

393

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.16 V

1 mm

85 °C (185 °F)

6839 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.4 mm

27 mm

No

e0

472.5 MHz

20 s

393

220 °C (428 °F)

27 mm

10AX032E1F27E1SG

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

240

.9

0.9 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

No

240

27 mm

5AGXBA7H6F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

500 MHz

27 mm

5CGXBC5F7F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXFC7E6F27A7N

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXBC9A7F27C7

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

10AS032E5F27E3SG

Altera

FPGA

Ball

672

BGA

Square

Plastic

320000

Yes

CMOS

240

.9

0.9 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B672

No

240

5CSEMA6U23I72N

Altera

FPGA

Ball

672

FBGA

Square

Plastic/Epoxy

110000

Yes

CMOS

124

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA672,26X26,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B672

No

124

5AGXMA5G4F27I3

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

10AS032E4F27E3SG

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

240

.9

0.9 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

No

240

27 mm

EP1S30F672I7ES

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B672

No

e0

5CSXFC4D6U23C7

Altera

FPGA

Other

Ball

672

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

23 mm

5AGXFA1D4F27I3N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

670 MHz

27 mm

10M40DAF672A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

5AGXMA3K4F27C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

5CGXBC7E6F27C7N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

10M40DCF672C7

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

5AGXBA7D4F27I5N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

242000

Yes

1.13 V

CMOS

336

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.7 mm

27 mm

No

e1

622 MHz

336

27 mm

5CSXFC2D6U23C6N

Altera

FPGA

Other

Ball

672

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

23 mm

5AGXFA5K4F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

500 MHz

27 mm

10M25DFF672I6

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B672

5CGXBC4D7F27C8N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXFC4D6F27C7N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CSEMA2U23I72

Altera

FPGA

Ball

672

FBGA

Square

Plastic/Epoxy

25000

Yes

CMOS

124

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA672,26X26,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B672

No

124

EP2C70F672C8

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

68416

Yes

1.25 V

4276

CMOS

422

1.2

1.2,1.5/3.3,3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

4276 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.6 mm

27 mm

No

Also requires 3.3 V supply

e0

402.5 MHz

20 s

406

220 °C (428 °F)

27 mm

5AGXBA3K4F27I5

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

622 MHz

27 mm

5AGXMA3K6F27C6

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

500 MHz

27 mm

5AGTMC3G3F27I3

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.