672 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5AGXFA1G6F27C4N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	670 MHz				27 mm
10AX016E4F27E3LG	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V		CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm	No					240		27 mm
5CGXFC7A7F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGTFD9E5F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CSEMA5U23C72N	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	85000	Yes			CMOS	124		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,26X26,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B672				No					124
5CGXBC7E7F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
10AX032E4F27I3LP	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	11990 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672				No					240
5CEFA5F27C6N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	76500	Yes			CMOS	360		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B672				No					360
5CSXFC4D6U23C8	Altera	FPGA	Other	Ball	672	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm								23 mm
5AGXMA5H4F27C4N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	670 MHz				27 mm
5AGXMA5K4F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	500 MHz				27 mm
5AGXFA5H4F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm			e0	670 MHz				27 mm
5CSEBA5U23C8S	Altera	FPGA	Other	Ball	672	FBGA	Square	Plastic/Epoxy	85000	Yes	1.13 V		CMOS	145	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,28X28,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm	No					145		23 mm
5CSXFC4C6U23C8N	Altera	FPGA	Other	Ball	672	FBGA	Square	Plastic/Epoxy	40000	Yes	1.13 V		CMOS	145	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,28X28,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm	No					145		23 mm
5AGXBA7G6F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm			e0	670 MHz				27 mm
5CGXFC4F7F27I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5AGTMC3H3F27I5N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	622 MHz				27 mm
10AX032E3F27I2SP	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	11990 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672				No					240
5CGXBC5A7F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5AGXFA7D6F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm			e0	500 MHz				27 mm
5CGTFD9F5F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGTFD9E5F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5AGXMA7H6F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm			e0	670 MHz				27 mm
10M25DAF672A7G	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672						e1
5CGXFC4C6F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	368	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm	No					368		27 mm
10AS032E5F27E3SP	Altera	FPGA		Ball	672	BGA	Square	Plastic	320000	Yes			CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B672				No					240
5AGXBA7H6F27I3N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	670 MHz				27 mm
10AS027E2F27E2SP	Altera	FPGA		Ball	672	BGA	Square	Plastic	270000	Yes			CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B672				No					240
10AX022E3F27E1MG	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm								27 mm
EP2C70F672I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	68416	Yes	1.25 V	4300	CMOS	422	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm		4300 CLBS		Tin Lead	Bottom	S-PBGA-B672		2.6 mm	27 mm	No	Also requires 3.3 V supply	e0			406		27 mm
5CSEMA2U23C8	Altera	FPGA	Other	Ball	672	FBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	145	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,28X28,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm	No					145		23 mm
EP4CGX150DF27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	149760	Yes	1.24 V	9360		393	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	9360 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.4 mm	27 mm	No		e0	472.5 MHz	20 s	393	220 °C (428 °F)	27 mm
EP1SGX10CF672C7N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	362	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1		30 s	362	245 °C (473 °F)	27 mm
5CSXFC5C6U23C72N	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	85000	Yes			CMOS	124		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,26X26,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B672				No					124
5CGXFC4D7F27C8N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXBC5A6F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXBC9D7F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5AGXFA5G6F27I3N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	670 MHz				27 mm
5CSXFC4C6U23C62N	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	40000	Yes			CMOS	124		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,26X26,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B672				No					124
10AX016E5F27I3SG	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm								27 mm
5CSXFC6C6U23I72	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	110000	Yes			CMOS	124		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,26X26,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B672				No					124
EP1SGX40DF672I7ES	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		3.5 mm	27 mm	No		e0					27 mm
5AGXMA1D4F27I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	75000	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm	No		e0	622 MHz		336		27 mm
5CGXBC7E6F27C8N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXFC9C6F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5AGXMA7D6F27I3N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	670 MHz				27 mm
5AGXFA7G4F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	500 MHz				27 mm
5CGXBC5E6F27C8N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.