672 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5CSEBA6U23C8S	Altera	FPGA	Other	Ball	672	FBGA	Square	Plastic/Epoxy	110000	Yes	1.13 V		CMOS	145	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,28X28,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm	No				145		23 mm
EP1SGX25DF672I6N	Altera	FPGA	Military	Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	455	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)	2852 CLBS	-65 °C (-85 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No	e1		30 s	455	245 °C (473 °F)	27 mm
EP1SGX25DF672I7N	Altera	FPGA	Military	Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V		CMOS	455	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)		-65 °C (-85 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No	e1		40 s	455	245 °C (473 °F)	27 mm
10AX027E3F27I2SP	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	10162 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672				No				240
5CGXBC4A7F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5CGTFD5C5F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5AGXFA1D6F27I5N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz				27 mm
5CGXBC4A6F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5AGXFA7K4F27C4N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	670 MHz				27 mm
10M50DAF672C7G	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes			CMOS	500	1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3			No	e1			500
5CGXBC5F6F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
EP1SGX10CF672I7N	Altera	FPGA	Military	Ball	672	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V		CMOS	362	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)		-65 °C (-85 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No	e1		40 s	362	245 °C (473 °F)	27 mm
EP1SGX25FF672I5ES	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		3.5 mm	27 mm	No	e0					27 mm
5CSEMA4U23C6SN	Altera	FPGA	Other	Ball	672	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm							23 mm
EP1SGX25DF672I6	Altera	FPGA	Military	Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	455	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)	2852 CLBS	-65 °C (-85 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No	e0		20 s	455	220 °C (428 °F)	27 mm
EP4CGX75DF27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	73920	Yes	1.24 V	4620		310	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	4620 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.4 mm	27 mm	No	e1	472.5 MHz	30 s	310	260 °C (500 °F)	27 mm
5AGXBA7G6F27I3N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	670 MHz				27 mm
EP1SGX10FF672I5ES	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		3.5 mm	27 mm	No	e0					27 mm
5CSEMA6U23C7	Altera	FPGA	Other	Ball	672	FBGA	Square	Plastic/Epoxy	110000	Yes	1.13 V		CMOS	145	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,28X28,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm	No				145		23 mm
5AGXFA1G4F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz				27 mm
5AGXBA7K4F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	500 MHz				27 mm
5CGTFD7C5F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5AGXFA7H4F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	500 MHz				27 mm
5AGXFA3D4F27I5N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz				27 mm
5CGXBC9C7F27C7N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5CGXBC4A6F27C8N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5CGTFD5D5F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5CGXBC9D7F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5AGXBA3D4F27I3	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz				27 mm
5CSXFC4C6U23C82	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	40000	Yes			CMOS	124		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,26X26,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B672				No				124
5AGXMA5G4F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	500 MHz				27 mm
5CGXFC5C7F27C7N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5AGXFA1G4F27I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz				27 mm
5CGXBC9D6F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
EP1SGX40GF672I5ES	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		3.5 mm	27 mm	No	e0					27 mm
5CGXFC4B7F27C8N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
EP4CGX150BF27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2.4 mm	27 mm							27 mm
EP1SGX40GF672I7ES	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		3.5 mm	27 mm	No	e0					27 mm
5CGTFD9F5F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5CGXBC5D7F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5CGXBC5E6F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5AGXFA7D4F27I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	242950	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm	No	e0	622 MHz		336		27 mm
5CGTFD5D5F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5CGTFD5B5F27C7N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5CSEMA2U23C61	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	25000	Yes			CMOS	124		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,26X26,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B672				No				124
5AGXBA1D4F27I3N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	670 MHz				27 mm
5AGTFC3G3F27I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz				27 mm
5CGXFC7B7F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.