676 Field Programmable Gate Arrays (FPGA) 1,111

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XQ7K410T-1RF676M	Xilinx	FPGA	Military	Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	400		1		Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	31775 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.37 mm	27 mm		e0		30 s	400	225 °C (437 °F)	27 mm
XC6SLX100-N3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	480		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	806 MHz	30 s	480	250 °C (482 °F)	27 mm
XC7K410T-1FFG676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V					1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)	0.74 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No	e1		30 s		250 °C (482 °F)	27 mm
XC4VLX60-12FF676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS	448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	4			No	e0		30 s	448	225 °C (437 °F)
XQ6SLX150-2FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS	498			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3			No	e0	667 MHz	30 s	498	225 °C (437 °F)
XC2V3000-5FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	3584 CLBS, 3000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	750 MHz	30 s	484	250 °C (482 °F)	27 mm
XCV600E-7FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	444	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e0	400 MHz	30 s	444	225 °C (437 °F)	27 mm
XC4VFX12-11FFG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	12312	Yes			CMOS	320				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No	e1		30 s	320	250 °C (482 °F)
XC5VLX30-3FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		400		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.67 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm		e1		30 s	400	250 °C (482 °F)	27 mm
XC3S1500-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS	487	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	630 MHz	30 s	487	260 °C (500 °F)	27 mm
XC7K160T-2FFG676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V					1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No	e1		30 s		250 °C (482 °F)	27 mm
XC7K410T-L2FBV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	31775				.95		Grid Array			.93 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm		e1					27 mm
XC7K325T-1FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		3.37 mm	27 mm		e1					27 mm
XCE7K410T-1FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	400		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm		e1		30 s	400	250 °C (482 °F)	27 mm
XC4VLX25-10FF676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448		1.2		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No	e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC2VP40-5FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e0	1050 MHz	30 s	416	225 °C (437 °F)	27 mm
XC4VLX40-10FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	41472	Yes			CMOS	448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B676	4			No	e1		30 s	448	250 °C (482 °F)
XC4VLX40-11FF676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	41472	Yes			CMOS	448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	4			No	e0		30 s	448	225 °C (437 °F)
XC5VLX110-2FFV676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		440		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	8640 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm		e1		30 s	440	250 °C (482 °F)	27 mm
XC7K160T-2LFBG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	.93 V					0.9		Grid Array	BGA676,26X26,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm		e1					27 mm
XC7K160T-L2FB676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes			CMOS	400			0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No	e0	1286 MHz	30 s	400	225 °C (437 °F)
XCV400E-7FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	2400 CLBS, 129600 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	400 MHz	30 s	404	250 °C (482 °F)	27 mm
XC7K160T-1FFG676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V					1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)	0.74 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No	e1		30 s		250 °C (482 °F)	27 mm
XC2VP40-7FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.575 V	4848	CMOS			1.5		Grid Array			1.425 V	1 mm		0.28 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	1350 MHz	30 s		250 °C (482 °F)	27 mm
XC5VLX30-1FF676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		400		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	2400 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No	e0		30 s	400	225 °C (437 °F)	27 mm
XC6SLX100-1LFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e0	500 MHz				27 mm
XCE7K325T-2FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm		e1		30 s		250 °C (482 °F)	27 mm
XC4VLX60-10FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS	448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No	e1		30 s	448	250 °C (482 °F)
XQKU040-2RSA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes		30300				.95		Grid Array				1 mm			30300 CLBS		Tin Lead	Bottom	S-PBGA-B676		3.44 mm	27 mm		e0					27 mm
XQ6SLX150T-3FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS	396			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B676	3			No	e1	862 MHz	30 s	396	250 °C (482 °F)
XC7K325T-1LFBG676I	Xilinx	FPGA		Ball	676			Plastic/Epoxy		Yes								Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No	e1		30 s		250 °C (482 °F)
XCV600E-7FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	444	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	3456 CLBS, 186624 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	400 MHz	30 s	444	250 °C (482 °F)	27 mm
XC6SLX100-3FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	480		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e0	862 MHz	30 s	480	225 °C (437 °F)	27 mm
XC4VLX40-10FF676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	41472	Yes			CMOS	448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	4			No	e0		30 s	448	225 °C (437 °F)
XCE7K325T-1FBV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.74 ns	25475 CLBS			Bottom	S-PBGA-B676		2.54 mm	27 mm							27 mm
XCV405E-7FG676C	Xilinx	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	70 °C (158 °F)	0.42 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e0	400 MHz	30 s	404	225 °C (437 °F)	27 mm
XQ6SLX150T-2FG676Q	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS	396			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	3			No	e0	667 MHz	30 s	396	225 °C (437 °F)
XC7K325T-2FF676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B676		3.37 mm	27 mm	No	e0	1818 MHz		400		27 mm
XQ7K325T-L1RF676M	Xilinx	FPGA		Ball	676	BGA	Square	Plastic	326080	Yes	1.05 V	25475	HKMG	400		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)	0.74 ns		-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B676	4		27 mm	No	e0	1818 MHz		400		27 mm
XC6SLX100T-3NFGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	806 MHz	30 s		250 °C (482 °F)	27 mm
XCKU5P-3FFVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.927 V	27120		304		0.9		Grid Array	BGA676,26X26,40		.873 V	1 mm	100 °C (212 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1		30 s	304	250 °C (482 °F)	27 mm
XC6SLX45-3NFGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	806 MHz	30 s		250 °C (482 °F)	27 mm
XC7K410T-1LFFG676C	Xilinx	FPGA		Ball	676			Plastic/Epoxy		Yes								Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No	e1		30 s		250 °C (482 °F)
XC3S1500-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS	487	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	725 MHz	30 s	487	260 °C (500 °F)	27 mm
XCE7K325T-2FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		3.37 mm	27 mm							27 mm
XCKU5P-2FFVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304		0.85		Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1		30 s	304	250 °C (482 °F)	27 mm
XC4VFX12-12FFG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	12312	Yes			CMOS	320				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No	e1		30 s	320	250 °C (482 °F)
XC7A200T-L2FBV676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	215360	Yes	.93 V	16825		400		.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	1.51 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm		e1			400		27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.