676 Field Programmable Gate Arrays (FPGA) 1,111

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU095-L1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200		702		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				702		27 mm
XCKU040-L1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300		520		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				520		27 mm
XCKU025-2FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU115-3FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU115-1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU095-2FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU025-L1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				312		27 mm
XCKU060-L1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				624		27 mm
XCKU115-1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU095-2FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU040-L1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300		520		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	85 °C (185 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				520		27 mm
XCKU115-2FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU085-1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU115-2FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU115-2FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU025-3FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU060-3FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460		624		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XCKU025-3FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU095-L1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200		702		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				702		27 mm
XCKU035-L1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391		520		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				520		27 mm
XCKU025-2FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU115-L1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920		832		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				832		27 mm
XCKU035-L1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391		520		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				520		27 mm
XCKU025-L1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				312		27 mm
XCKU035-2FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						520		27 mm
XCKU095-3FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200		702		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU115-L1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920		832		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				832		27 mm
XCKU060-2FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XCKU115-3FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU115-3FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU040-2FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						520		27 mm
XCKU060-L1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				624		27 mm
XCKU060-1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XCKU085-2FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU035-3FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						520		27 mm
XCKU085-1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU085-L1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190		676		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				676		27 mm
XCKU025-1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU085-L1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190		676		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				676		27 mm
XCKU095-2FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU060-2FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XCKU085-3FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU025-L1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				312		27 mm
XC7A200T-L1FB676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	215360	Yes	.98 V	16825		400		0.95		Grid Array	BGA676,26X26,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.54 mm	27 mm				1098 MHz		400		27 mm
XC2V3000-5FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	3584 CLBS, 3000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	750 MHz	30 s	484	225 °C (437 °F)	27 mm
XCE7K410T-L2FFG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	.93 V	31775	HKMG	400		.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	0.91 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XC4VLX15-10FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS	320		1.2		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		1536 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e1	1028 MHz	30 s	320	250 °C (482 °F)	27 mm
XC2V1500-5FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	750 MHz	30 s	392	225 °C (437 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.