676 Field Programmable Gate Arrays (FPGA) 1,111

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4VLX40-11FFG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	41472	Yes			CMOS	448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No		e1		30 s	448	250 °C (482 °F)
XCV600E-8FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	444	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	3456 CLBS, 186624 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	416 MHz	30 s	444	225 °C (437 °F)	27 mm
XCE7K325T-2FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC5VLX50-2FF676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600		440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	3600 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e0		30 s	440	225 °C (437 °F)	27 mm
XC6SLX45-3NFG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	806 MHz				27 mm
XC6SLX100T-3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	376		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	376	250 °C (482 °F)	27 mm
XC2S150E-6FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 150000	e0	357 MHz				27 mm
XCKU085-3FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU060-L1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				624		27 mm
XCKU085-2FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU060-1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XCKU095-L1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200		702		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				702		27 mm
XCKU040-L1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300		520		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				520		27 mm
XCKU025-2FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU115-3FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU115-1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU095-2FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU025-L1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				312		27 mm
XCKU060-L1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				624		27 mm
XCKU115-1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU095-2FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU040-L1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300		520		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	85 °C (185 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				520		27 mm
XCKU115-2FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU085-1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU115-2FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU115-2FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU025-3FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU060-3FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460		624		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XCKU025-3FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU095-L1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200		702		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				702		27 mm
XCKU035-L1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391		520		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				520		27 mm
XCKU025-2FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU115-L1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920		832		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				832		27 mm
XCKU035-L1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391		520		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				520		27 mm
XCKU025-L1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				312		27 mm
XCKU035-2FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						520		27 mm
XCKU095-3FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200		702		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU115-L1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920		832		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				832		27 mm
XCKU060-2FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XCKU115-3FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU115-3FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU040-2FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						520		27 mm
XCKU060-L1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				624		27 mm
XCKU060-1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XCKU085-2FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU035-3FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						520		27 mm
XCKU085-1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU085-L1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190		676		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				676		27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.