676 Field Programmable Gate Arrays (FPGA) 1,111

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7K325T-3FBG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS		400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1412 MHz	30 s	400	250 °C (482 °F)	27 mm
XA7K160T-1FFG676Q	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V	12675	HKMG	AEC-Q100; TS 16949	400		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	125 °C (257 °F)		12675 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XCKU115-1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920			832		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU060-1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460			624		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XCKU095-1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU025-1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180			312		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU095-1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU085-2FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU095-L1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200			702		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				702		27 mm
XCKU085-3FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190			676		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU060-2FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460			624		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XCKU040-3FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300			520		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	85 °C (185 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						520		27 mm
XCKU085-1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU025-2FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180			312		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU025-1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180			312		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU095-3FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200			702		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU095-3FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200			702		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU115-L1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920			832		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				832		27 mm
XCKU095-1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU085-L1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190			676		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				676		27 mm
XCKU060-3FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460			624		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XCKU025-3FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180			312		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU060-3FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460			624		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XC7K410T-1FBG676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V						1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)	0.74 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1					27 mm
XC7K325T-L2FFG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	.93 V	25475	CMOS		400		.9	0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm		0.91 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No	Also Operates at 1 V supply	e1		30 s	400	250 °C (482 °F)	27 mm
XC4VLX40-11FF676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	41472	Yes			CMOS		448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	4			No		e0		30 s	448	225 °C (437 °F)
XC4VLX60-11FFG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS		448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No		e1		30 s	448	250 °C (482 °F)
XC3S1000-5FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes			CMOS		391			1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	3			No		e0			391
XC3S1500-5FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS		487	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	725 MHz		487		27 mm
XC6SLX150T-3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		396		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	396	250 °C (482 °F)	27 mm
XC6SLX75T-3NFG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	806 MHz				27 mm
XA6SLX75T-2FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS	AEC-Q100	348			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	3			No		e1	667 MHz	30 s	348	250 °C (482 °F)
XC7K325T-2FBV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475					1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC6SLX150-1LFG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	500 MHz				27 mm
XC4VSX25-10FFG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	23040	Yes			CMOS		320				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B676	4			No		e1		30 s	320	250 °C (482 °F)
XC7A350T-1FBG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic	348480	Yes	1.05 V		CMOS		400		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4		27 mm	No		e1	1098 MHz	30 s	400	250 °C (482 °F)	27 mm
XC3S1500-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS		487	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	3328 CLBS, 1500000 Gates		Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	630 MHz	30 s	487	260 °C (500 °F)	27 mm
XC7K410T-1FB676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes			CMOS		400			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	1818 MHz	30 s	400	225 °C (437 °F)
XC4VLX25-10FF676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		448		1.2		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2688 CLBS		Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XCE7K410T-2FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG		400		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XA3S1500-4FGG676Q	Xilinx	FPGA	Automotive	Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes				AEC-Q100	487			1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	125 °C (257 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3			No		e1	125 MHz	30 s	487	260 °C (500 °F)
XC3S50AN-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS			50000	1.2		Grid Array			1.14 V	1 mm		4.88 ns	176 CLBS, 50000 Gates		Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	667 MHz	30 s		250 °C (482 °F)	27 mm
XC7K410T-1FB676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes			CMOS		400			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	1818 MHz	30 s	400	225 °C (437 °F)
XCV400-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	2.625 V	2400	CMOS		404	468252	2.5	1.2/3.6,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.8 ns	2400 CLBS, 468252 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	250 MHz	30 s	404	225 °C (437 °F)	27 mm
XC7Z030-L1FFG676I	Xilinx	FPGA SOC		Ball	676	BGA	Square	Plastic/Epoxy	125000	Yes	1.05 V	9825			380	1900000	1		Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	9825 CLBS, 1300000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.24 mm	27 mm			e1		30 s	380	250 °C (482 °F)	27 mm
XC5VLX30-2FF676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			400		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	2400 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e0		30 s	400	225 °C (437 °F)	27 mm
XC6SLX150-N3FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		498		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	806 MHz	30 s	498	225 °C (437 °F)	27 mm
XCV800-6FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	2.625 V	4704	CMOS			888439	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.6 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	333 MHz	30 s		250 °C (482 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.