676 Field Programmable Gate Arrays (FPGA) 1,111

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2S50E-6FGG676C	Xilinx	FPGA		B	676	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz				27 mm
XC4VFX12-10FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	12312	Yes			CMOS		320				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No		e1		30 s	320	250 °C (482 °F)
XCE7K410T-3FFG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG		400		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.58 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XC4VLX25-12FF676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		448		1.2		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VSX25-10FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	23040	Yes			CMOS		320				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B676	4			No		e1		30 s	320	250 °C (482 °F)
XCV405E-8FGG676C	Xilinx	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	2400	CMOS			129600	1.8		Grid Array			1.71 V	1 mm	70 °C (158 °F)	0.4 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	416 MHz	30 s		250 °C (482 °F)	27 mm
XC2V2000-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS		456	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	750 MHz	30 s	456	250 °C (482 °F)	27 mm
XC6SLX100T-2FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		376		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	667 MHz	30 s	376	250 °C (482 °F)	27 mm
XC2VP30-7FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS		416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	3424 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1350 MHz	30 s	416	250 °C (482 °F)	27 mm
XCV405E-6FGG676C	Xilinx	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	2400	CMOS			129600	1.8		Grid Array			1.71 V	1 mm	70 °C (158 °F)	0.47 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	357 MHz	30 s		250 °C (482 °F)	27 mm
XCKU5P-1FFVA676I	Xilinx	FPGA	Industrial	Ball	676	HBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120			304		.85		Grid Array, Heat Sink/Slug	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
XC2VP20-6FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS		404		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	0.32 ns	2320 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1200 MHz	30 s	404	225 °C (437 °F)	27 mm
XC7A350T-1FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic	348480	Yes	1.05 V		CMOS		400		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4		27 mm	No		e1	1098 MHz	30 s	400	250 °C (482 °F)	27 mm
XC4VLX60-10FF676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS		448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	4			No		e0		30 s	448	225 °C (437 °F)
XC7K325T-3FBG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS		400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1412 MHz	30 s	400	250 °C (482 °F)	27 mm
XA7K160T-1FFG676Q	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V	12675	HKMG	AEC-Q100; TS 16949	400		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	125 °C (257 °F)		12675 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XCKU115-1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920			832		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						832		27 mm
XCKU060-1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460			624		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XCKU095-1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU025-1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180			312		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU095-1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU085-2FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU095-L1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200			702		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				702		27 mm
XCKU085-3FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190			676		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU060-2FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460			624		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XCKU040-3FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300			520		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	85 °C (185 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						520		27 mm
XCKU085-1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						676		27 mm
XCKU025-2FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180			312		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU025-1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180			312		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU095-3FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200			702		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU095-3FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200			702		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU115-L1FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920			832		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				832		27 mm
XCKU095-1FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95		Grid Array	BGA676,26X26,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						702		27 mm
XCKU085-L1FBVA676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190			676		0.9		Grid Array	BGA676,26X26,40		.88 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm		Also Operates at 0.95 V nominal supply				676		27 mm
XCKU060-3FBVA676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460			624		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XCKU025-3FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180			312		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						312		27 mm
XCKU060-3FBVA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460			624		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.71 mm	27 mm						624		27 mm
XC3SD1800A-5FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS		519	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	280 MHz		409		27 mm
XC7K325T-2LFBG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	.93 V						0.9		Grid Array	BGA676,26X26,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XCV800-4FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS		444	888439	2.5	1.2/3.6,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.8 ns	4704 CLBS, 888439 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	250 MHz	30 s	444	225 °C (437 °F)	27 mm
XA6SLX75T-3FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS	AEC-Q100	348			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3			No		e0	862 MHz	30 s	348	225 °C (437 °F)
XC4VSX25-11FFG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	23040	Yes			CMOS		320				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No		e1		30 s	320	250 °C (482 °F)
XCE7K325T-L2FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475					.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC3S50-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1		30 s		260 °C (500 °F)	27 mm
XQ7K325T-L2RF676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	.93 V	25475	HKMG		400		.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	0.91 ns	25475 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e0		30 s	400	225 °C (437 °F)	27 mm
XC7K410T-1FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS		400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1	1098 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7K160T-1LFBG676I	Xilinx	FPGA		Ball	676			Plastic/Epoxy		Yes									Grid Array									Tin Silver Copper	Bottom		4			No		e1
XC7A200T-L1FBV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.98 V	16825					.95		Grid Array			.92 V	1 mm		1.27 ns	16825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.