BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP4SGX230FF35I3N	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120			564		.9		0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		9120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		3.6 mm	35 mm	No		e1	717 MHz		564		35 mm
LCMXO2-1200HC-5MG132I	Lattice Semiconductor	FPGA		Ball	132	BGA	Square	Plastic/Epoxy	1280	Yes	3.465 V				104		2.5	Tray	2.5/3.3 V	Grid Array	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	104	250 °C (482 °F)	8 mm
LCMXO2-7000HC-4FG484IAK7	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	6864	Yes	3.6 V				334		2.5	Tray		Grid Array	BGA484,22X22,40		2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm		Also Operates at 3.3 V nominal supply	e1		30 s	334	250 °C (482 °F)	23 mm
LFE3-35EA-8FN484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	33000	Yes	1.26 V				295		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.281 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	500 MHz		295	250 °C (482 °F)	23 mm
M1A3P600-2FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm
M2GL010T-1FG484MX417	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V				233		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e0		20 s	233	240 °C (464 °F)	23 mm
M2GL025TS-1FCSG325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS		180		1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325	3		11 mm	No					180		11 mm
M2S025TS-1FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S090-1FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S090TS-1FGG484T2	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V			AEC-Q100	267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
XC2VP7-6FFG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS		396		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	1232 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No		e1	1200 MHz	30 s	396	250 °C (482 °F)	27 mm
XC7S75-2FGGA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	76800	Yes	1.05 V	6000	HKMG		400		1			Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	6000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.44 mm	27 mm			e1	1286 MHz		400		27 mm
10M25DCF484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563			360		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2 mm	23 mm			e1			360		23 mm
5SGXMA3H2F35C3N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	340000	Yes	.88 V	12830	CMOS		432		.85		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		12830 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5SGXMA3H2F35I3N	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	340000	Yes	.88 V	12830	CMOS		432		.85		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		12830 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	3.6 mm	35 mm	No		e1		30 s	432	245 °C (473 °F)	35 mm
A3PE3000-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	350 MHz	20 s	341	225 °C (437 °F)	23 mm
EP2SGX60EF1152C4N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS		534		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	60440 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No		e1	717 MHz		534		35 mm
EP4SGX230FF35I3G	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120			564		.9			Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)		9120 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						564		35 mm
LFE2-12E-7FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500			193		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	420 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2M50E-6FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.26 V	6000			270		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	357 MHz		270	250 °C (482 °F)	23 mm
M2GL050T-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V				267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
MPF300T-FCG484E	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
XC2S200-5FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			288	200000	2.5		1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	1176 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	263 MHz	30 s	284	225 °C (437 °F)	23 mm
XC4VFX12-10FFG668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS		320		1.2			Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			1368 CLBS		Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e1	1028 MHz	30 s	320	250 °C (482 °F)	27 mm
XC7K410T-2FF676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes			CMOS		400				1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B676				No		e0	1818 MHz		400
XCAU10P-L1FFVB676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	96250	Yes	.742 V	5500			228		0.72			Grid Array	BGA676,26X26,40		.698 V	1 mm	100 °C (212 °F)		5500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		Also Operates at 0.85 V nominal supply	e1		30 s	228	250 °C (482 °F)	27 mm
1SG280HN1F43I1VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125			704					Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		344125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
5CGXFC4C7F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.13 V	1886	CMOS		240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		1886 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			240		23 mm
EP1C12F256C7	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206			185		1.5		1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1206 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0	320 MHz	20 s	185	220 °C (428 °F)	17 mm
EP3C5F256A7N	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	5136	Yes	2.625 V	5136	CMOS		182		2.5		1.2/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		5136 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		3.5 mm	17 mm	No					182		17 mm
EP3C80F484C8N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS		295		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		81264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		295		23 mm
LFE3-70EA-8LFN672I	Lattice Semiconductor	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V				380		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.281 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	500 MHz	30 s	380	250 °C (482 °F)	27 mm
LFE3-70EA-9FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V				380		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.252 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	500 MHz	30 s	380	250 °C (482 °F)	27 mm
M2GL090-FGG676	Microchip Technology	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS		425		1.2	Tray	1.2 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No				30 s	425	250 °C (482 °F)	27 mm
M2S050-FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
MPF300T-1FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS		388		1			Grid Array	BGA784,28X28,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm		It also Operates at 1.05 V nominal supply				388		29 mm
MPF500TS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS		584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TSFCG1152I	Microsemi	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS		584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
XC6SLX45T-4FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes			CMOS		296				1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1		30 s	296	250 °C (482 °F)	23 mm
XC6SLX45T-N3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		296		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz	30 s	296	250 °C (482 °F)	23 mm
XC7K325T-2FBG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS		400		1		1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1818 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7K480T-1FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	CMOS		380		1		1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.74 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1	1098 MHz	30 s	380	245 °C (473 °F)	31 mm
XCKU040-2FBVA900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	1920			520		.95		0.95 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm	No		e1		30 s	520	245 °C (473 °F)	31 mm
XCKU115-2FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520			832		.95		0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
10AX016E4F27E3SG	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151	TSMC		240		0.9		0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		6151 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672		3.35 mm	27 mm	No					240		27 mm
10M08DCF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500			250		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			250		23 mm
A2F500M3G-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	11520	CMOS		128	500000	1.5	Tray	1.5,1.8,2.5,3.3 V	Grid Array	BGA484,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		11520 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	100 MHz	30 s	128	250 °C (482 °F)	23 mm
A3P600-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e0	350 MHz	20 s		225 °C (437 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.